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SEMI E111-0305 © SEMI 2001, 2005 15 RELATED INFORMATION 1 NOTICE : This related information is not an official part of SEMI E111, and it is not intended to modify or supercede the official standard. This inf o rmation wa…
SEMI E111-0305 © SEMI 2001, 2005 14
APPENDIX 1
APPLICATION NOTES
NOTICE: This appendix is an official part of SEMI E111 and was approved by full letter ballot procedures on
August 27, 2001, but the recommendations in this appendix are optional and are not required to conform to this
standard.
A1-1 Skewness, warp, rock, and stiffness are implicitly defined in the dimensional tolerances.
A1-2 Features on the RSP150 which enable stacking may be required by end users. It is preferred that these
features allowing stacking in only one orientation.
A1-3 Features on the RSP150 which provide visual orientation of the RSP150 top and RSP150 door may be
required by end users.
SEMI E111-0305 © SEMI 2001, 2005 15
RELATED INFORMATION 1
NOTICE: This related information is not an official part of SEMI E111, and it is not intended to modify or
supercede the official standard. This information was inserted by the North America Physical Interfaces and
Carriers Committee to alert the readers to potential changes to this provisional standard.
R1-1 In the event end-effector and pellicle exclusion volumes can be developed which would satisfy all lithography
equipment manufacturers and allow for a 126 mm pellicle, then the appropriate changes would be balloted to update
the standard.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
By publications of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E112-0305 © SEMI 2001, 2005 1
SEMI E112-0305
PROVISIONAL MECHANICAL SPECIFICATION FOR A 150 mm
MULTIPLE RETICLE SMIF POD (MRSP150) USED TO TRANSPORT
AND STORE MULTIPLE 6 INCH RETICLES
This specification was technically approved by the Global Physical Interfaces and Carriers Committee and is
the direct responsibility of the North American Physical Interfaces and Carriers Committee. Current edition
approved by the North American Regional Standards Committee on Decmber 10, 2004. Initially available at
www.semi.org January 2005; to be published March 2005. Originally published November 2001; previously
published November 2004.
1 Purpose
1.1 This standard specifies the 150 mm Multiple Reticle SMIF Pod (MRSP150) used to transport and store six 6
inch reticles in an integrated circuit (IC) manufacturing facility.
2 Scope
2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation
while ensuring modularity and inter- changeability at all mechanical interfaces. Most of the requirements given in
this specification are in the form of maximum or minimum dimensions with very few required surfaces. Only the
physical interfaces for the MRSP150 are specified; no materials requirements or micro-contamination limits are
given in this specification.
2.2 The pellicle exclusion volumes of this specification accommodates pellicles which extend the full length of the
reticle and up to a maximum pellicle width of 124 mm.
2.3 The MRSP150 has the following components, sub-components, and other features. A “” symbol indicates
components or features which are required and a “” symbol indicates components or features which are optional.
Top
robotic handling flange
Interior
supports for six 6 inch reticles
reticle capture
reticle contact surfaces
end-effector exclusion volumes
2 safety rail exclusion volumes
pellicle exclusion volumes
lateral constraints
reticle backstop
Sides
2 side handling flanges on the sides parallel to the bi-lateral reference plane
2 side handling exclusion volumes
RFID placement zone
Bottom
door compatible with SMIF as defined in SEMI E19.3