semi合集-English.pdf - 第2595页
SEMI E90.1-0705 © SEMI 2001, 2005 7 Attribute Name Attribute Data Form: SECS-II Structure “BatchLocState” 51 (U1) Bat chLocSta te BatchLocState e numerated per Variabl e BatchLocState. “BatchSubstIDMap” L,n n = num ber o…

SEMI E90.1-0705 © SEMI 2001, 2005 6
Attribute Name Attribute Date Form: SECS-II Structure
“SubstHistory” L,n n = number of substrate locations visited by the substrate
1. L,3
1. <OBJID
1
> SubstLocID
1
2. <TIMESTAMP
1
> TimeIn
1
3. <TIMESTAMP
1
> TimeOut
1
.
.
n. L,3
1. <OBJID
n
> SubstLocID
n
2. <TIMESTAMP
n
> TimeIn
n
3. <TIMESTAMP
n
> TimeOut
n
“SubstLocID” <OBJID> SubstLocID
“SubstPosInBatch” 20(A) SubstPosInBatch
“SubstProcState” 51 (U1) SubstProcState
SubstProcState enumerated per Variable SubstProcState.
“SubstSource” <OBJID> SubstLocID
“SubstState” 51 (U1) SubstState
SubstState enumerated per Variable SubstState.
“SubstType” 51 (U1) SubstType
SubstType enumerated per Variable SubstType.
“SubstUsage” 51 (U1) SubstUsage
SubstUsage enumerated per Variable SubstUsage.
“SubstIDStatus” 51 (U1) Enumerated
0 = NOT CONFIRMED
1 = WAITING FOR HOST
2 = CONFIRMED
3 = CONFIRMATION FAILED
“AcquiredID” A[0,80]
6.2 Substrate Location Object SECS-II Attributes Definitions — The following are the SECS-II structure definitions
for the E90 Substrate Location Object.
Table 7 Substrate Location Object Attribute Definitions
Attribute Name Attribute Data Form: SECS-II Structure
“DisableEvents” 11 (Boolean)
“ObjType” “SubstLoc”
“ObjID” <OBJID> SubstLocID (Conforms to the restrictions of ObjID as specified in SEMI
E39.1, §6.)
“SubstID” <OBJID> SubstID
“SubstLocState” 51 (U1) SubstLocState
SubstLocState enumerated per Variable SubstLocState.
6.3 Batch Location Object SECS-II Attributes Definitions — The following are the SECS-II structure definitions for
the SEMI E90 Batch Location Object.
Table 8 Batch Location Object Attribute Definitions
Attribute Name Attribute Data Form: SECS-II Structure
“ObjID” <OBJID> BatchLocID (Conforms to the restrictions of ObjID as specified in SEMI E39.1, §6.)
“ObjType” "BatchLoc"

SEMI E90.1-0705 © SEMI 2001, 2005 7
Attribute Name Attribute Data Form: SECS-II Structure
“BatchLocState” 51(U1) BatchLocState
BatchLocState enumerated per Variable BatchLocState.
“BatchSubstIDMap” L,n n = number of positions in a batch
1. <OBJID
1
> SubstID
1
.
.
n. <OBJID
n
> SubstID
n
“DisableEvents” 11 (Boolean)
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SEMI E91-0600 © SEMI 1999, 20001
SEMI E91-0600
SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL
(PSEM)
This specification was technically approved by the Global Information & Control Committee and is the direct
responsibility of the Japanese Communications Committee. Current edition approved by the Japanese
Regional Standards Committee on January 14, 2000. Initially available at www.semi.org March 2000; to be
published June 2000. Originally published September 1999.
1 Purpose
1.1 This document establishes a S pecific Equipment
Model for prober equipment (PSEM). The PSEM
consists of equipment characteristics and behaviors that
apply to this class of equipment and are required to be
implemented in addition to the fundamental
requirements and additional capabilities specified in
SEMI E30 (GEM). The intent of this document is to
facilitate the integration of prober equipment into an
automated semiconductor factory. This document
accomplishes this by defining an operational model for
prober equipment as viewed by a factory automation
controller. This definition provides a standard host
interface and equipment operational behavior.
2 Scope
2.1 The scope of this document is limited to the
definition of prober equipment behavior as perceived
by a Semiconductor Equipment Communications
Standard (SECS-II) (SEMI E5) host that complies with
GEM. The document defines the view of the equipment
through the SECS communications link, but does not
define the internal operation of the equipment. It
includes a specific processing state model as the basis
for the behavior of all equipment of this class.
2.2 This document requires that th e GEM fundamental
requirements and applicable additional capabilities have
been implemented on the prober equipment. This
document expands GEM Standard requirements and
capabilities in the areas of the processing state model,
collection events, remote commands, data item
variables and process program management, and adds
Prober Job state model to GEM Standard requirements
and capabilities. This document does not include the
definition of the treatment of Multiple Stage.
2.3 This document applies to the class of prober
equipment in which the wafer is unloaded from the
same slot in the same carrier which loaded the wafer
after processing.
2.4 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E5 — SEMI Equipment Communications
Standard 2 Message Content (SECS-II)
SEMI E30 — Generic Model for Communications and
Control of Manufacturing Equipment (GEM)
SEMI M20 ― Specification for Establishing a Wafer
Coordinate System
SEMI M21 ― Specification for Assigning Addresses to
Rectangular Elements in a Cartesian Array
3.2 Other Documents
Harel, D., “Statechart: A Visual Formalism for
Complex Systems”, Science of Computer Programming
8 (1987) 231-274.
1
NOTE 1: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
4 Terminology
4.1 alignment — a procedure in which a coordinate
system is established on a substrate.
4.2 bin — categorized data of die as a result of
measurement.
4.3 cassette — a physical object containing one or
more substrate locations (see slot). For example, a
SEMI standard cassette is a carrier with 25 substrate
slot locations.
4.4 die — 1. A field sub-unit. 2. An area of substrate
that contains the device being manufactured.
4.5 execution area — the area from which a current
copy of the process program instructions are executed.
4.6 inker — a resource of the prober. The
electromechanical units to put ink mark on die.
4.7 instruction data — the Result Data to refer on the
inspection process.
1 Elsevier Science, P.O. Box 945, New York, NY 10159-0945,
http://www.elsevier.nl/homepage/browse.htt