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SEMI E47.1-0305 © SEMI 1997, 2005 1 SEMI E47.1-0305 PROVISIONAL MECHANICAL SPECIF ICATI ON FOR FOUPS USED TO TRANSPORT AND STORE 300 mm WAFERS This specification was technically approved by the Gl obal Ph ysical Interfac…
SEMI E47-0301 © SEMI 1995, 2001 4
Figure 2
Orientation Possibilities
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SEMI E47.1-0305 © SEMI 1997, 2005 1
SEMI E47.1-0305
PROVISIONAL MECHANICAL SPECIFICATION FOR FOUPS USED TO
TRANSPORT AND STORE 300 mm WAFERS
This specification was technically approved by the Global Physical Interfaces & Carriers Committee and is
the direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition
approved by the North American Regional Standards Committee on December 10, 2004. Initially available
at www.semi.org February 2005; to be published March 2005. Originally published in 1997; previously
published November 2004.
1 Purpose
1.1 This standard partially specifies the FOUPs used to transport and store 300 mm wafers in an IC manufacturing
facility.
2 Scope
2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation
while ensuring modularity and interchange-ability at all mechanical interfaces. Most of the requirements given in
this specification are in the form of maximum or minimum dimensions with very few required surfaces. Only the
physical interfaces (other than the door mechanism and kinematic couplings) for FOUPs are specified; no materials
requirements or micro-contamination limits are given. The enclosure specified in this standard can be a sealed
minienvironment, but it could also just be a box with well-defined interfaces.
2.2 The FOUP has the following components and sub-components:
Key:
Required feature
Optional feature
top
top handling flange
center hole on top handling flange
3 kinematic grooves on top handling flange (optional)
interior
cassette (with supports for 13 or 25 wafers)
wafer capture mechanism
2 end effector exclusion zones
sides
2 side fork-lift flanges (optional)
ergonomic manual handles (optional)
door
holes for latch keys that lock the door to the FIMS interface when the door is unlatched from the FOUP
holes for registration pins
door sensing pads
bottom
4 bottom conveyor rails (with the bottom of the front seal zone acting as the fourth rail and the rear rail
optional)
SEMI E47.1-0305 © SEMI 1997, 2005 2
2 fork-lift pin holes
5 carrier sensing pads
center retaining feature
front retaining feature
4 info pads
2 advancing FOUP sensing pads
3 features that mate with kinematic coupling pins and provide a 10 mm lead in
3 features that mate with kinematic coupling pins and provide a 15 mm lead in (optional)
front conveyor surface
2.3 This standard is provisional because of concerns about the kinematic coupling pins causing excessive wear on
carriers and the usefulness of the robotic handling flanges and conveyor rails. Once FOUP testing is done, this
standard should be modified and upgraded from provisional status.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E1.9 Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E15 — Specification for Tool Load Port
SEMI E15.1 — Specification for 300 mm Tool Load Port
SEMI E19 — Standard Mechanical Interface (SMIF)
SEMI E47 — Specification for 150 mm/200 mm Pod Handles
SEMI E57 — Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer
Carriers
SEMI E62 — Provisional Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)
SEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 Definitions
4.1.1 bilateral datum plane — a vertical plane that bi-sects the wafers and that is perpendicular to both the
horizontal and facial datum planes (as defined in SEMI E57).
4.1.2 box — a protective portable container for a cassette and/or substrate(s).
4.1.3 carrier capacity — the number of substrates that a carrier holds (as defined in SEMI E1.9).
4.1.4 cassette — an open structure that holds one or more substrates.
4.1.5 facial datum plane — a vertical plane that bisects the wafers and that is parallel to the front side of the carrier
(where wafers are removed or inserted). On tool load ports, it is also parallel to the load face plane specified in
SEMI E15 on the side of the tool where the carrier is loaded and unloaded (as defined in SEMI E57).