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SEMI T13-1104 © SEMI 2004 2 verification occurs. Even if som e physical identification may be difficult to verify because something i s hidden by the other m aterial or no physical identification tag is provided, they h …
SEMI T13-1104 © SEMI 2004 1
SEMI T13-1104
SPECIFICATION FOR DEVICE TRACKING: CONCEPTS, BEHAVIOR
AND SERVICES
This specification was technically approved by the Global Traceability Committee and is the direct
responsibility of the Japanese Traceability Committee. Current edition approved by the Japanese Regional
Standards Committee on April 30, 2004. Initially available at www.semi.org June 2004; to be published June
2004.
NOTICE: The designation of SEMI T13 was updated during the 1104 publishing cycle to reflect the creation of
SEMI T13.1 and SEMI T13.2.
1 Purpose
1.1 The purpose of this specification is to trace devices
for the sake of quality control, warranty, security or
any other reasons. This specification makes it easy to
transfer information required for realizing tracing in
such semiconductor products as dice and packaged
devices.
1.2 Because modern market trend of consumer minds,
industries and governments are explicitly or implicitly
requiring traceability for all products including
semiconductor devices. Implementing this specification
will help to satisfy both direct and indirect consumers
of semiconductor devices.
1.3 The other purpose of this document is to clarify
means to define coordinates to specify physical
position of devices on substrates which the other
standard documents don’t address. This information is
provided in Appendix sections.
2 Scope
2.1 This specification is intended to realize
semiconductor device tracking rather than production
itself. Even if some operations or communications for
tracing purpose may be related to factory automation or
production including measurement and maintenance,
they are not in the scope of this specification but
references to work within a factory.
2.2 Because the object of this specification is
traceability, tracing dice is not bounded on packaging
process of semiconductor devices. For example bare
dice may be mounted on Print Circuit Board (PCB).
This specification describes not only what is required
to trace dice in semiconductor manufacturing fab but
also what could be shared in PCB assembly lines or set
makers.
2.3 This document describes device tracking data
transfer between entities in a fab. Some entities may be
physical or logical depending on configuration of the
fab. Sometimes the transfer is carried out between
entities in different companies over such
communication media as internet or VPN (Virtual
Private Network). While this document describes the
transferring interface, it doesn’t define security
specification or criteria to be used with this
specification.
2.4 This document describes tracking semiconductor
devices. To make it possible to track final assembled
products of semiconductor devices consistently, this
document describes such assembled materials. Also,
sometimes a semiconductor device may consist of
more than one die. To track the smallest unit this
document often uses “Die Tracking” or “Die Tracing”
rather than “Device Tracking.”
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 While this specification could be effective in such
industry as PCB assembly, it is not required to comply
with this specification. Semiconductor device
producers who implement this specification will find
communicating die trace information with later
assembly manufacturers easier and more effective if
they comply this specification. The reverse is also true.
3.2 Because this specification doesn’t talk about
security considerations, implementers of this
specification are required realizing security data
transfer or connection with foreign computers. It is the
responsibility of the readers of this document to discuss
this issue between users and suppliers.
3.3 This document specifies logical information
definitions and related message exchanges required for
die trace systems, and assumes that any process or
equipment verifies passed material or product by any
means. This document doesn’t specify how it is done,
which ID tags and readers are recommended or where
and when it must be done. However target equipment
and production systems have to make sure the
SEMI T13-1104 © SEMI 2004 2
verification occurs. Even if some physical
identification may be difficult to verify because
something is hidden by the other material or no
physical identification tag is provided, they have to
cover by some means.
3.4 Tracking die coordinate information on substrates
is a subset of full device tracking. Readers who have
just interested in die coordinate information (narrow
Device Tracking) can skip most sections and go
straight to Appendix and Related Information sections
to implement the specification.
4 Referenced Standards
4.1 SEMI Standards
SEMI E130 — Specification for Prober Specific
Equipment Model for 300 mm Environment
(PSEM300)
SEMI G81 — Specification for Map Data Items
SEMI G84 — Specification for Strip Map Protocol
SEMI G85 — Specification for Map Data Format
SEMI M17 — Guide for Universal Wafer Grid
SEMI M20 — Specification for Establishing a Wafer
Coordinate System
SEMI M21 — Specification for Assigning Addresses
to Rectangular Elements in a Cartesian Array
4.2 The Internet Engineering Task Force
1
RFC2396 — Uniform Resource Identifiers (URI):
Generic Syntax
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
5 Terminology
5.1 Abbreviations & Acronyms
5.1.1 PCB — Print Circuit Board
5.1.2 SMT — Surface Mount Technology
5.1.3 SMTP — Simple Mail Transfer Protocol
5.1.4 SIP — System In Package
5.2 Definitions
5.2.1 cabinet — a kind of enclosure for electronics to
keep from exposure of electrodes and/or
subcomponents, and/or to give some means of human
operation.
5.2.2 cassette — a kind of container of electronics
materials or parts for the purpose of carrying
1 The Internet Engineering Task Force;
www.ietf.org,
capability, grouping operation, replaceability at
inlet/outlet port or similar objectives.
5.2.3 circuit module — an implemented electric circuit
with active/passive elements in a cell, on a substrate or
packaged together.
5.2.4 device — a concise representation of a
semiconductor device. It must be a semiconductor die
regardless whether it is on the way of fabrication or
completed, whether it has been diced or not, whether it
is installed/mounted on some substrate or not, or
whether it is packaged or not. If it is packaged, the
whole package is assumed as a device and a device
may have more than one dice. In some specific case a
device may have some other active or passive elements
in the package.
5.2.5 Device Tracking — generic term of Die Trace
regardless of unit of tracing or category of information.
Following narrow sense is also applied in some specific
fields. A specific case of tracking especially for
geometric coordinates information on holding
substrate. Because sometimes this specific type of
Device Tracing information is very convenient to such
end user industries as the automobile or car parts
industries, this is defined separately. This can be
realized with limited specification presented in
Appendix sections of this specification.
5.2.6 dicing frame — a frame with sticky plastic film
to mount a semiconductor wafer for dicing.
5.2.7 die — a semiconductor product which has
electric elements and wiring. Many dice are usually
fabricated on a semiconductor substrate at a time which
is often referred to as wafer and the substrate is diced
for dice before packaging or mounting on some other
substrate. Some die may be fabricated on such isolator
as thin transparent glass plate. Die is intended as it is
just one piece of substrate even if it is packaged with
the other dice.
5.2.8 Die Trace — acquiring die information for
tracing the die and/or processing the information to
investigate what happens on the die during
manufacturing or to ensure such properties of the die as
producer and facilities. The information for such
aggregating entities as wafer and PCB may be included
depending on the usefulness of the information for
tracing because they are produced with the die on them.
5.2.9 glass plate — a rectangular thin insulator plate to
fabricate one or more electric elements on it. Often the
material of this plate is transparent glass for flat panel
display, sometimes it may be ceramic for passive
electric elements. The purpose of definition of this item
is just to introduce one of possible examples to trace
and this document doesn’t specify details.
SEMI T13-1104 © SEMI 2004 3
5.2.10 hybrid IC — a kind of Device which has one or more semiconductor dice and other active/passive elements
packaged together.
5.2.11 reusable container — a container for electronics parts which is usually used more than once.
5.2.12 packaged device — a Device which is not exposed in bared shape on substrate for passivation, physical
protection and manipulation purposes. It is often independently packaged by ceramic base or plastic molding with
leads. Sometimes it has more than one dice and some separated electric elements packaged in a package.
5.2.13 strip — rectangular shaped substrate or flexible tape to mount semiconductor devices. The purpose of use is
not only for products but also for carrier or some other purpose used during production of electronics products.
5.2.14 substrate — base on which electronics elements, especially semiconductor devices, are fabricated or on
which electronics parts are mounted. Examples are silicon wafers, flat panel display glass substrates, lead frames,
print circuit boards and so on.
6 Convention
6.1 This section defines the conventions followed by this document.
6.2 Object Conventions — This document conforms to the conventions for objects established by SEMI E39,
including object diagrams, object terminology, and requirements for standardized objects. Accordingly, notation is
based on Unified Modeling Language (UML).
6.2.1 Formal Name of an Object — The text capitalizes formal object name references. Similar to the way
capitalization is normally used when discussing entities. When describing something in the general (like cities)
lower case is used, but when a specific entity is of interest (New York City), then first letters are capitalized.
6.2.2 Components of Complex Attributes — The names of object attributes defined in tables are left-justified. The
individual elements of complex attributes are right-justified in order of appearance below the complex attribute.
6.3 State Model Conventions
6.3.1 This document uses the Harel state chart convention for describing dynamic operation of defined objects. The
outline of this convention is described in an attachment of SEMI E30. The official definition of this convention is
described in “State charts: A Visual Formalism for Complex Systems”
2
.
6.3.2 The Harel convention has not the concept of state models of “creation” and “extinction” for expressing a
temporary entity. The “job” described in this document is such an entity, and a copy of the same state model is used
for an independent job newly created. In this document, a circle with a black circle inside is used for expressing
extinction of an entity. A filled black circle denotes the entry to the state model (the entity creation).
6.3.3 Transition tables are provided in conjunction with the state diagrams to explicitly describe the nature of each
state transition. A transition table contains columns for Transition number, Previous State, Trigger, New State,
Actions, and Comments. The “trigger” (column 3) for the transition occurs while in the “previous” state. The
“actions” (column 5) includes a combination of:
1. Actions taken upon exit of the previous state.
2. Actions taken upon entry of the new state.
3. Actions taken which are most closely associated with the transition.
4. No differentiation is made between these cases.
Num Previous State Trigger New State Actions Comments
6.4 Service Message Representation — Services are functions or methods that may be provided by either the
equipment or the host. A service message may be either a request message, which always requires a response, or a
notification message, that does not require a response.
2 D. Harel, “State charts: A Visual Formalism for Complex Systems”, Science of Computer Programming 8,
1987.