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SEMI E126-0305 © SEMI 2003, 2005 6 9.2 Declar ation of Equipment Type( s) — An equipment complying with this st andard shall provide a n indication (i.e., declaration) of its equip ment type or types. This d eclaration s…

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SEMI E126-0305 © SEMI 2003, 2005 5
Deposition (CVD) chemical reactions between gaseous components at or near the surface of the wafer, usually occurring
at an elevated temperature.
Table 2 Equipment Type to EQIP Association
Equipment Type Name EQIP (Required (Y/N)?) Comments
Removal Amount Removed (Y)
Polishing Amount Removed (Y), Uniformity (Y)
Deposition Amount Deposited (Y)
Lithography Overlay Offset (Y)
Lithography CD (Y)
Diffusion Resistivity (Y)
Etching Amount Removed (Y), CD (N), Uniformity
(N)
Chemical Vapor Deposition Amount Deposited (Y), Uniformity (N)
Table 3 EQIP Definitions
# EQIP Name EQIP Definition Format Descriptor Fields
1 Amount
Removed
The average amount of material removed from a wafer during the
course of a process. Amount Removed is computed as (average
thickness prior to removal step – average thickness directly after
removal process).
Name, Units, Validity
2 Uniformity A measure of the variation of thickness of a feature on a wafer.
It is calculated utilizing thickness data collected at different
points across the wafer. The number of data points can vary, but
is generally greater than or equal to five. Typical uniformity
metrics include the difference between the maximum and
minimum points, the variance or standard deviation of the points,
or the average difference between the center points and the outer
points, commonly referred to as “center-to-edge”. Definition of
method for calculating this parameter is outside the scope of this
standard.
Name, Units, Validity, Method of
Calculation
3 Amount
Deposited
The average amount of material deposited on a wafer during the
course of a process. Amount Deposited is computed as: (average
thickness directly after deposition process – average thickness
immediately prior to deposition step)
Name, Units, Validity
4 Overlay Offset A measure of the displacement of a feature at the top layer with
respect to another layer (usually the layer directly below it) on a
wafer. It is usually reported as a delta in the ‘X’ and ‘Y’
directions for each measured point on the wafer.
Name, Units, Validity
5 CD Critical Dimension — The average width of the smallest
patterned feature on the wafer.
Name, Units, Validity
6 Resistivity A material’s opposition to the flow of electric current usually
used to detect properties of buried features in a wafer.
Name, Units, Validity
9 Compliance to this Standard
9.1 This section defines requirements placed on equipment types for claiming compliance with this standard and
verifying compliance with this standard.
SEMI E126-0305 © SEMI 2003, 2005 6
9.2 Declaration of Equipment Type(s) — An equipment complying with this standard shall provide an indication
(i.e., declaration) of its equipment type or types. This declaration shall be determined through matching of
equipment description to the equipment type definitions in Table 1.
9.3 Specification of Linked Process Program Parameters — An equipment complying with this standard must
specify a non-null set of settable equipment process program parameters that can be altered to effect change of each
EQIP associated with this equipment type or types. These process program parameters are termed “linked process
program parameters”. It is not required that the actual mathematical relationship between each EQIP and associated
process program parameters be specified.
9.4 Method for Effecting Control of EQIPs — An equipment complying with this standard must support and specify
at least one SEMI standard method for individual actuation of each linked process program parameters. An EQIP is
not supported unless a SEMI standard method for effecting control of the EQIP through individual actuation of
linked process program parameters is supported and defined. The following are SEMI standard methods for
individual actuation of process program parameters that could be utilized.
9.4.1 SEMI E30 (Generic Model for Communications and Control of Manufacturing Equipment (GEM))
Application Note A.8: Process Parameter Modification for Process and Equipment Control — This specification
defines a method for effecting control of EQIPs utilizing the GEM “Equipment Constants” capability. These
Equipment Constants could be set up as Linked PPPs thereby enabling control of EQIPs. Refer to these sections of
SEMI E30 for a precise definition of the GEM capability to be used and an example of its use for process control.
9.4.2 SEMI E40 (Standard for Process Management) — This standard specifies a method for setting recipe
variables, which can be assigned a value at Process Job creation time, and can be adjusted at a later time. These
recipe variables could be set up as Linked PPPs, thereby enabling control of EQIPs. Refer to ¶¶7.5.4 and 10.4 of
SEMI E40 for additional information.
9.5 Compliance Sheets — Compliance to this standard by equipment shall be indicated with compliance sheets that
shall be provided with the equipment. Templates for the compliance sheets are provided in Tables 4 and 5.
9.5.1 EQIP and Linked PPP Support Compliance Sheet — A template for this compliance sheet is provided in
Table 4. This compliance sheet has the following fields:
9.5.1.1 Unique Identifier Corresponding to Equipment — This field provides for a unique identification of the
equipment type for that manufacturer. The contents of this field are manufacturer specific, but could include the
company name and equipment model number.
9.5.1.2 Equipment Type — This field will indicate the specific type or types, from Table 1, to which this equipment
belongs.
9.5.1.3 Listing of EQIPs — This field will indicate the EQIPs defined for each equipment type specified for this
equipment, copied from the list in Table 2 associated with each equipment type. Modifiers for this field will
indicate, for each EQIP, whether the EQIP is required and whether it is supported for this equipment model. Note
that if an EQIP is specified as required for that equipment type in Table 2, then this EQIP must be specified as
supported. If the EQIP is specified as optional for that equipment type then the field modifier shall indicate whether
that EQIP is supported.
9.5.1.4 Listing of Linked Process Program Parameters — This field will indicate, for each supported EQIP, a non-
null list of linked process program parameters.
9.5.1.5 Additional Information — This optional field will provide additional information that could include forms
of models relating EQIPs to linked process program parameters, value limits on actuation of these parameters,
preferred method(s) and timing for actuation of these parameters, and behavior of equipment in response to
actuation of these parameters. The contents of this field are manufacturer specific.
9.5.2 EQIP and Linked PPP Data Format Compliance Sheet — A template for this compliance sheet is provided in
Table 5. This compliance sheet has the following fields:
9.5.3 Listing of Supported EQIPs — This field is a listing of supported EQIPs. This is a subset of the listed EQIPs
in the corresponding “EQIP and Linked PPP Support Compliance Sheet” (see ¶9.5.1.3).
9.5.4 EQIP Format Descriptors — These fields collectively provide the description of the format of the supported
EQIPs. The fields shall be copied from the list for each supported EQIP specified in Table 3.
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9.5.5 Listing of Supported Linked Process Program Parameters — This field is a listing of supported PPPs as
indicated in the corresponding “EQIP and Linked PPP Support Compliance Sheet” (see ¶9.5.1.3).
9.5.6 Linked PPP Format Descriptors — These fields collectively provide the description of the format of the
supported EQIPs. Note that required descriptor fields are Name, Data Type, and Data Units. Additional descriptor
fields can be provided as desired.
Table 4 EQIP and Linked PPP Support Compliance Sheet Template
Company
Company Name
Unique Identifier
Key for Identifying Classification of Equipment Within Company (e.g., Model Number(s))
Equipment Type(s)
Types from Figure 2; minimum of one type must be specified
EQIP Required Supported Linked PPPs Comments
From Table 2, linked to
Equipment Type
From Table
2
Y/N Could include
recommended method for
measuring and/or
calculating EQIP
parameter
…
Supported Methods for
Individual Actuation of
Linked PPPs
Additional Information
Additional Information, See ¶9.5.1.5
#1
Text in italics provides further description of a field; it is not part of the template.
Table 5 EQIP and Linked PPP Data Format Compliance Sheet Template
Company
Company Name
Unique Identifier
Key for Identifying Classification of Equipment Within Company (e.g., Model Number(s))
Equipment Type (s)
From list in Table 1
EQIP DATA FORMATS
Format Descriptors
EQIP From
Table 3
From Table 3 From Table 3 . . . Comments
Supported EQIPs (from
EQIP and Linked PPP
Support Compliance
Sheet)
Could
include
additional
descriptors
…
LINKED PPP DATA FORMATS
Format Descriptors
Linked PPP Name Data Type Data Units … Comments
Supported Linked PPPs
(from EQIP and Linked
PPP Support
Compliance Sheet)
Could
include
additional
descriptors