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SEMI E111-0305 © SEMI 2001, 2005 14 APPENDIX 1 APPLICATION NOTES NOTICE : This appe ndix is an official part of SEM I E111 and was approved by full letter ballot proced ures on August 27, 2001, but the reco mmendations i…

SEMI E111-0305 © SEMI 2001, 2005 13

Symbol Used Figure Value Specified Reference Measured From Feature Measured To

y236 11 82.5 mm (3.248 in.)

minimum

facial reference plane end of conveyor rail surface

y238 9 78.5 mm (3.091 in.)

maximum

facial reference plane edge of end effector exclusion

volume

y239 7 88.8 mm (3.496 in.)

maximum

bilateral reference plane edge of reticle backstops

y240 1 10 mm (0.394 in.)

minimum

facial reference plane edge of RFID placement zone

y241 1 58 mm (2.283 in.)

maximum

facial reference plane edge of RFID placement zone

y242 11 80.25 ± 0.5 mm

(3.159 ± 0.020 in.)

facial reference plane center of info pads

z2 None 2 mm (0.079 in.)

maximum

horizontal reference plane surface of info pads (when down)

z26 None 9 mm (0.354 in.)

minimum

horizontal reference plane surface of info pads (when up)

z276 6 ± 0.15 mm

(0.006 in.)

each nominal reticle seating

plane

entire bottom surface of the reticle

z290 4 22 mm (0.866 in.)

maximum

horizontal reference plane edge of first reticle pellicle exclusion

volume

z291 4 32 mm (1.260 in.) horizontal reference plane nominal reticle seating plane

z297 6 1.5 mm (0.059 in.)

minimum

each nominal reticle seating

plane

edge of end-effector exclusion

volume

z299 6 8.95 mm (0.352 in.)

minimum

each nominal reticle seating

plane

edge of end-effector exclusion

volume

z301 4 22 mm (0.866 in.)

maximum

horizontal reference plane edge of safety rail exclusion volume

z302 4 23.5 ± 0.5 mm

(0.945 ± 0.020 in.)

horizontal reference plane edge of first reticle end-effector

exclusion volume

z303 3 52.5 mm (2.067 in.)

maximum

horizontal reference plane top surface of dome recess

z304 3 55 mm (2.165 in.)

maximum

horizontal reference plane top surface of dome

z305 3, 5 70 ± 0.5 mm

(2.756 ± 0.020 in.)

horizontal reference plane bottom surface of robotic handling

flange

z306 3 49 ± 0.5 mm

(1.929 ± 0.020 in.)

horizontal reference plane bottom edge of side handling flange

z307 3 52.5 mm (2.067 in.)

maximum

horizontal reference plane top surface of side handling flange

z308 3, 12 25 mm (0.984 in.)

maximum

horizontal reference plane edge of side handling exclusion

volume and RFID placement zone

z310 3, 5 8 mm (0.315 in.)

maximum

bottom surface of robotic

handling flange

top of robotic handling flange

z312 8 44 mm (1.732 in.)

maximum

horizontal reference plane top of rear retainer exclusion volume

z313 n/a 43 ± 1 mm

(1.1693 ± 0.039 in.)

horizontal reference plane top of reticle backstops

z314 12 10 mm (0.394 in.)

minimum

horizontal reference plane bottom of RFID placement zone

z315 12 30 mm (1.181 in.)

maximum

horizontal reference plane top of RFID placement zone

APPENDIX 1

APPLICATION NOTES

NOTICE: This appendix is an official part of SEMI E111 and was approved by full letter ballot procedures on

August 27, 2001, but the recommendations in this appendix are optional and are not required to conform to this

standard.

A1-1 Skewness, warp, rock, and stiffness are implicitly defined in the dimensional tolerances.

A1-2 Features on the RSP150 which enable stacking may be required by end users. It is preferred that these

features allowing stacking in only one orientation.

A1-3 Features on the RSP150 which provide visual orientation of the RSP150 top and RSP150 door may be

required by end users.

RELATED INFORMATION 1

NOTICE: This related information is not an official part of SEMI E111, and it is not intended to modify or

supercede the official standard. This information was inserted by the North America Physical Interfaces and

Carriers Committee to alert the readers to potential changes to this provisional standard.

R1-1 In the event end-effector and pellicle exclusion volumes can be developed which would satisfy all lithography

equipment manufacturers and allow for a 126 mm pellicle, then the appropriate changes would be balloted to update

the standard.

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

By publications of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.