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SEMI M30-0997 © SE MI 1997 6 NOTICE: T hese standards do n ot purport to address safety issues, if any, ass o ciated with their use. It is the responsibility of t he user of these standards to establish appropriate safet…

SEMI M30-0997 © SEMI 19975

12 Calculations

12.1 Calculate the absorption coefficient,=α, using the expression:

= 1X ⋅1n (Ι0/Ι) = 1/X ⋅2.303 ⋅(peak height of absorption

)

where :

= absorption coefficient

X = specimen thickness, cm,

Ι = transmitted intensity at peak absorption (580 cm

-1

for room temperature, 582 cm

-1

for 77K, and

Ι0 = baseline intensity at peak absorption, Ι.

12.2 Determine the calibration coefficient of each FT-IR using the least square method in the following equations:

[C0]=

⋅

0 ⋅

∆

0 or [C0]=

⋅

where :

[C0] = already known carbon concentration in standard samples

0 = absorption coefficient of standard samples

∆ 0 = FWHM of standard samples

= calibration coefficient of each FT - IR

12.3 Calculate the concentration of s ubstitutional carbon in atoms/cm

with the use of the following equations:

[C]=

⋅

⋅∆ or [C] =

⋅

where :

[C] = carbon concentration in test specimen

= absorption coefficient of test specimen

∆ = FWHM of test specimen

= calibration coefficient of each FT - IR, determined in 12.2

13 Report

13.1 The following information shall be included in the report for referee and research measurements:

13.1.1 Instruments used, detector, resolution, measurement time, range of wave number, aperture, apodization

function, smoothing, specimen measurement temperature (room temperature or 77K).

13.1.2 Specimen thickness, and identification.

13.1.3 Calibration coefficient of FT-IR used, width of base line.

13.1.4 FWHM in cm

-1

, calculated absorption coefficient or absorption, and carbon concentration.

13.1.5 Date of measurement, organization performing test, and location.

13.1.6 Use of any special techniques, such as beam condenser, scale expansion, scan suppression, etc.

SEMI M30-0997 © SEMI 1997 6

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI M31-0705 © SEMI 1998, 2005 1

SEMI M31-0705

PROVISIONAL MECHANICAL SPECIFICATION FOR FRONT-OPENING

SHIPPING BOX USED TO TRANSPORT AND SHIP 300 mm WAFERS

This provisional specification was technically approved by the global Silicon Wafer Committee. This edition

was approved for publication by the global Audits and Reviews Subcommittee on May 20, 2005. It was

available at www.semi.org in June 2005 and on CD-ROM in July 2005. Originally published in 1998;

previously published March 2005.

1 Purpose

1.1 This standard specifies the front-opening shipping box (FOSB) used to ship 300 mm wafers from wafer

suppliers to their customers (typically IC manufacturers), while maintaining wafer quality.

NOTE 1: Refer to SEMI silicon wafer related specifications M-series such as SEMI M1 as for a wafer quality.

2 Scope

2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation

while ensuring modularity and interchangeability at all mechanical interfaces. However, this standard has been

written so that injection-molded plastic FOSBs can be manufactured in conformance with it, and those can be

utilized for maintaining wafers quality during transportation, opening and closing the door.

2.2 This standard assumes that the FOSB is used in the last process in wafer manufacturing, in acceptance and

inspection, and in transferring the wafers from the FOSB to a FOUP, FOBIT or open cassette inside an IC

manufacturing facility. The FOSB is not intended to be used in IC manufacturing processes. It is recommended that

wafers be transferred from the FOSB to a FOUP, FOBIT or open cassette using automated methods. As described in

¶5.4, the purchaser needs to specify which type of FOSB door is required:

1) Manual door as described in ¶5.4.1; or

2) Automated–shippable door as described in ¶5.4.2.

2.3 This standard is provisional. This standard will be modified and upgraded from provisional status. Where

possible, the specified design features are in accord with like features in SEMI E1.9 and SEMI E47.1.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish appropriate safety and health practices and determine the

applicability of regulatory or other limitations prior to use.

3 Referenced Standards and Documents

3.1 SEMI Standards

SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers

SEMI E15 — Specification for Tool Load Port

SEMI E15.1 — Specification for 300 mm Tool Load Port

SEMI E47.1 — Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm

Wafers

SEMI E57 — Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer

Carriers

SEMI E62 — Provisional Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)

SEMI E119 — Provisional Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory

Transport of 300mm Wafers

SEMI M45 — Provisional Standard for 300mm Wafer Shipping System

SEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment