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SEMI G39-89 © SEMI 198 6, 1989 5 Figure 3 Metallizat ion Misa lignment NOTICE: T hese standards do n ot purport to address safety issues, if any, ass o ciated with their use. It is the responsibility of t he user of thes…

SEMI G39-89 © SEMI 1986, 1989 4

using the Beta Backscatter Radiation Method, X-Ray

Fluorescence or by Cross Sectioning.

10.2 Nickel Plating — Shall conform to QQ-N-290.

Nickel thickness may be determined using the Beta

Backscatter Radiation Method, X-Ray Fluorescence, or

by Cross Sectioning.

10.3 Destructive Die Shear Testing — Shall be

performed per Method 2019 of MIL-STD-883.

10.4 Wire Bond Pull Testing — Shall be performed

per Method 2011, Condition D of MIL-STD-883.

10.5 Temperature Cycling Testing — Shall be

performed per Method 1010, Condition C of MIL-STD-

883.

10.6 Thermal Shock Testing — Shall be performed per

Method 1011, Condition C of MIL-STD-883.

10.7 Constant Acceleration Testing — Shall be

performed per Method 2001, Condition E, Y axis only,

of MIL-STD-883.

10.8 Mechanical Shock Testing — Shall be performed

per Method 2002, Condition B of MIL-STD-883.

10.9 Insulation Resistance Testing — Shall be

performed per Method 1003 of MIL-STD-883.

10.10 Internal Water Vapor Content Testing — Shall

be performed per Method 1018 of MIL-STD-883.

10.11 Hermeticity Testing — Shall be performed per

Method 1014, Condition A of MIL-STD-883. The

hermetic integrity of the packaged device must be

maintained after all testing.

10.12 Lead Integrity Testing — Shall be performed

per Method 2004, Condition A, B1, and B2 of MIL-

STD-883.

10.13 Solderability Testing — Shall be performed per

Method 2003 of MIL-STD-883.

10.14 Moisture Resistance Testing — Shall be

performed per Method 1004 of MIL-STD-883.

11 Packaging and Marking

11.1 Packaging — Containers selected shall be strong

enough and suitably designed to provide maximum

protection against crushing, spillage and other forms of

damage to the container or its contents. Container shall

afford protection of the contents to contamination from

exposure to excessive moisture or oxidation by gases.

Packaging material shall be so selected to prevent any

contamination of the ceramic component parts with

fibers or organic particles.

11.2 Marking — The outer containers shall be clearly

marked identifying:

1. Supplier part number.

2. User part number.

3. Quantity.

4. Date of manufacture.

5. Supplier lot number.

12 Applicability

This specification is intended to apply to construction

utilizing the tall brazed lead flatpack outlines included

in JEDEC Publication 95.

Figure 1

Chip Illustration

Figure 2

Die Attach Surface and Seal Area

SEMI G39-89 © SEMI 1986, 19895

Figure 3

Metallization Misalignment

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI G41-87 © SEMI 19871

SEMI G41-87

SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME

1 Preface

This specification is a guideline for high volume

production of leadframes, including internal package

plating, for plastic molded S.O. semiconductor

packages. It is a design guideline for packaging

engineers, leadframe stampers and mold manufacturers

and has been developed to meet the requirements of

automated assembly.

2 Applicable Documents

2.1 SEMI Specifications

SEMI G4 — Integrated Circuit Leadframe Materials

used in the Production of Stamped Leadframes

SEMI G10 — Mechanical Measurement for Plastic

Package Leadframes

2.2 Military Specifications

MIL-STD-105 — Sampling Procedures and Tables for

Inspection by Attributes

MIL-STD-883 — Test Methods and Procedures for

Microelectronics

3 Selected Definitions

burr — a fragment of excess material either horizontal

or vertical attached to the leadframe.

camber — curvature of the leadframe strip edge (see

Figure 1).

coil set — longitudinal bowing of the leadframe (see

Figure 2).

coined area — that area at the tip end of the bond

fingers coined to produce a flattened area for wire bond

(see Figure 3).

crossbow — transverse bowing of the leadframe (see

Figure 4).

functional area — the die attach pad and the lead tips.

lead twist — angular rotation of bonding fingers (see

Figure 5).

pits — shallow surface depressions or craters in the

leadframe material.

slug marks — random dents in the leadframe caused by

foreign material in the stamping die.

1 Military Standards, Naval Publications and Form Center, 5801

Tabor Avenue, Philadelphia, PA 19120

stamped leadframe terminology — (See Figure 6.)

Z plane — lead and pad planarity require a reference in

the Z dimension. The recommendation for the reference

plane, hereafter called the Z plane, is the average of the

two dambars when measured at their geometric center.

This reference method is incorporated into SEMI G10.

4 Ordering Information

4.1 Purchase orders for leadframes for plastic molded

S.O. packages furnished to this specification shall

include the following items:

1. Part specification number and revision level

2. Material

3. Number of leads

4. Material certification

5. Packaging and marking (see Section 8)

5 Dimensions

See Table 1 and Figure 7.

6 Defect Limits and Parameters

(See SEMI G10 for Measurement Methods)

6.1 Internal Frame Area

6.1.1 Minimum Flat Wire Bonding Area — 80% of

nominal lead width and 0.381 mm (0.015") in length.

6.1.2 Coin Depth

6.1.2.1 0.20 mm (0.008") material: 0.013 mm

(0.0005") minimum/0.02 mm (0.001") maximum.

6.1.2.2 0.25 mm (0.010") material: 0.013 mm

(0.0005") minimum/0.05 mm (0.002") maximum.

NOTE: Maximum coin depth may also be constrained by

minimum lead spacing requirement given in Section 6.1.3.

Minimum coin depth may also be constrained by minimum

bond area requirement given in Section 6.1.1.

6.1.3 X-Y Plane Lead Spacing and Location

6.1.3.1 Spacing between leads to be 0.152 mm

(0.006") minimum.

6.1.3.2 Leads to be located so that a 0.007" diameter

circle centered on the nominal center of the coined lead

in width and 0.152 mm (0.006") back from lead tip in

length shall be totally encompassed by the coined area.