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SEMI E107-1102 © SEMI 2001, 2002 2 5.1.8 electrical failure information — failure informati on generated by test equi pment; e.g. Bit Map Data, Bin Data and Anal og Data. 5.1.9 error class — specifies the type of el ectr…

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SEMI E107-1102 © SEMI 2001, 2002 1
SEMI E107-1102
SPECIFICATION OF ELECTRIC FAILURE LINK DATA FORMAT FOR
YIELD MANAGEMENT SYSTEM
This specification was technically approved by the Global Information & Control Committee and is the direct
responsibility of the Japanese Information & Control Committee. Current edition approved by the Japanese
Regional Standards Committee on July 19, 2002. Initially available at www.semi.org October 2002; to be
published November 2002. Originally published March 2001; previously published November 2001.
1 Purpose
1.1 The objective of this document is standardization
of the specific data format passed from the test
equipment to the Yield Management System. The Yield
Management System is a kind of data server for detail
test data and geometrical defect data of patterns on a
wafer as described in the Terminology section of this
document.
1.2 This document assumes a Yield Management
System in which test equipment electrical failure
information is managed and analyzed in an integrated
manner. Examples of test equipment failure information
include bit map data, bin data, and inpsection
information obtained by devices such as wafer
inspection equipment and review tools. Standardization
of the data file format helps to reduce the development
burden on customers and related vendors.
2 Scope
2.1 This document specifies the data file format for
transferring from test equipment to a Yield
Management System.
2.2 This document is an extension of the general map
data item standard, i.e. SEMI G81, and the general map
data format document, currently under development.
This document does not redefine the general
specification.
2.3 The scope of this document is just defining data
items and their formats. Data file creation methods,
data creating environments and file naming conventions
are outside of the scope of this document. Also,
communication protocols to transfer the data are
beyond the scope of this document.
2.4 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the user of this standard to establish
appropriate safety health practices and determine the
applicability or regulatory limitations prior to use.
3 Limitations
3.1 This standard defines extensional data for YMS
Link Data map for generic test data map standardized
by SEMI G81 and G85, data format of each item for
YMS Link Data is defined independently as extra
definition here.
4 Referenced Standards
4.1 SEMI Standards
SEMI E5 — SEMI Equipment Communication
Standard 2 Message Content (SECS-II)
SEMI E30.1 — Inspection and Review Specific
Equipment Model (ISEM)
SEMI G81 — Specification for Map Data Items
SEMI G85 — Specification for Map Data Format
NOTE 1: Unless otherwise indicated, all documents cited
shall be the latest published versions.
5 Terminology
5.1 Defintions
5.1.1 analog data — One of three categories of data:
measured values such as voltage or current obtained
when test equipment measures a semiconductor
device’s electrical characteristics, parameter values
which are test parameters when measuring, and limit
values which are decision parameters if test results are
pass or fail.
5.1.2 bin data — same as Category below.
5.1.3 category — data indicating the type of
electric
failure or rank of characteristics of die tested by the test
equipment. Used in the same manner as Bin Data in this
standard.
5.1.4 cell-logical-address — gives the electrical
location of a memory cell in a die.
5.1.5 cell-logical-io-number — number identifying the
IO data which can be simultaneously electrically
accessed within a memory device.
5.1.6 cell-physical-address — gives location of a
memory cell in a die on two-dimensional plane.
5.1.7 die — a unit equivalent to one die on a wafer.
Also known as Chip.
SEMI E107-1102 © SEMI 2001, 2002 2
5.1.8 electrical failure information — failure
information generated by test equipment; e.g. Bit Map
Data, Bin Data and Analog Data.
5.1.9 error class — specifies the type of electrical
failure configuration in a memory cell group. Bit-fail,
line-fail and block-fail are examples.
5.1.10 fail bit map data — data representing memory
cell electrical failure information according to its
location information, in units of the die or wafer.
5.1.11 inspection information — inspection results for
a wafer, indicating defect location and defect details
obtained as the result of inspection used in wafer
fabrication and the inspection process, such as
appearance inspection, contaminant inspection, etc.
5.1.12 test equipment — equipment which tests the
electrical characteristics and functions of
semiconductor devices.
5.1.13 test program name — name of program used on
test equipment when testing a die electrically.
5.1.14 yield management system (YMS) — a system
that stores visual inspection data of geometrical defects
on wafer and electrical test data of each die. The
system processes those data statistically to discover
correlation between them. Correlation leads to
discovery the cause of failures and understanding of
production situation in order to help improve yield.
Defect data is standardized in SEMI E30.1 (ISEM).
6 Requirements
6.1 Map Data Item — All map data items appear in
map data except those standardized in this document
shall be specified in the common map data item
document, SEMI G81.
6.2 Map Data Format — All map data formats appear
in map data except those standardized in this document
shall be specified in the common map data format
document, SEMI G85.
7 General
7.1 General File Format
NOTE 2: A standard for Data representation is currently
under development.
8 Description
8.1 The fail-bit map data item specifications defined in
this document are shown in Table 2. The columns in
this table are described in the following sections.
8.1.1 Item Name Column — The name by which the
data item is referenced.
8.1.2 Data Type Column — The type of the data as
defined in Table 1.
Table 1 Data Types and Sizes
Type Definition
String A string of ASCII characters from zero to
“Size” characters in length.
Integer A string of numeric characters (0..9) that
represent an integer value.
Float A string representing a floating point
value in exponent format.
8.1.3 Size Column — See SEMI G81.
8.1.4 Description Column — See SEMI G81.
8.1.5 Coordinate System Conventions — See SEMI
G81.
Table 2 Data Items for YMS Link
Item Name Data Type Size Description
Comment String 256 Comment Area.
[Comment] = ‘Engineering Test’
TestProgramName String 256 Name of test program when test equipment obtains test data.
[TestProgramName] = ‘pro123a’
TestEquipmentId String 256 Test equipment identification code.
[TestEquipmentId] = ‘tester1’
SEMI E107-1102 © SEMI 2001, 2002 3
Item Name Data Type Size Description
DieCoordinate String 13 The die coordinates’ origin location and coordinate axis direction for
expressing location coordinates within a die.
See Figure 2 and Table 7.
[DieCoordinate] = ‘TopLeftXY’
[DieCoordinate] = ‘BottomLeftXY’
[DieCoordinate] = ‘TopLeftYX’
[DieCoordinate] = ‘BottomLeftYX’
[DieCoordinate] = ‘TopRightXY’
[DieCoordinate] = ‘BottomRightXY’
[DieCoordinate] = ‘TopRightYX’
[DieCoordinate] = ‘BottomRightYX’
ErrorClassList String --- Error type category list, per error class definition. See Figure 2.
ErrorClassNumber String 3 Error class number from 0 to 255.
ErrorQuality String 16 Describes the quality of the specified [ErrorClassNumber]. This may be
“bit-fail” or “line-fail” or some other value defined by an application.
ErrorDescription String 256 A description of the specified [ErrorClassNumber], e.g. “100MHz”.
FailBitDataTemplate String --- Defines the data items and order for expressing the fail bit error class data
analyzed within a die by die address and coordinate values within the die.
See Figure 2.
Defines the items and order for outputting the following fail bit data. See
Table 3.
FailBitData String --- The list of data expressing the fail bit error class. Data analyzed within a
die in accordance with the fail bit data definition. Expresses it as die
address and coordinates within a die.
See Figure 2.
AnalogDataTemplate String --- Defines analog data items and order. These are measured values such as
voltage, current, etc. on measuring semiconductor device’s electrical
characteristics by the test equipment, setting values which are test
parameters when measuring, and limit values which are decision parameters
if test results are pass or fail.
See Table 4.
Invalid String 14 Defined to indicate invalid data for Analog Data field.
AnalogData String --- List of analog data, per analog data definition. These are the semiconductor
device’s electrical characteristics measured by the test equipment.
ErrorTotal Integer 10 Total number of electrical errors in the tested/analyzed substrate, by error
class type.
TestDie Integer 10 Total number of dies which were tested/analyzed on the substrate.
Table 3 Data Items for FailBitDataTemplate
Item Name Data Type Size Description
Seq Integer 10 Sequential number assigned in ascending order, starting with 1.
XAddress Integer 5 X address of defective die with fail bit data.
YAddress Integer 5 Y address of defective die with fail bit data.
XMin Float 14 X minimum coordinate value of fail bit data’s error range. Unit ‘um’.
XMax Float 14 X maximum coordinate value of fail bit data’s error range. Unit ‘um’.
YMin Float 14 Y minimum coordinate value of fail bit data’s error range. Unit ‘um’.
YMax Float 14 Y maximum coordinate value of fail bit data’s error range. Unit ‘um’.
XCenter Float 14 X-direction center point coordinate value of fail bit data’s error range. Unit ‘um’.
YCenter Float 14 Y-direction center point coordinate value of fail bit data’s error range. Unit ‘um’.
XSize Float 14 X-direction size of fail bit data’s error range. Unit ‘um’.