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SEMI G72.1-099 7 © SEMI 1997 2 Figure 1 292 Pin Plas tic Ball Grid Array 27 x 27 mm Body Desi gn

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SEMI G72.1-0997 © SEMI 19971
SEMI G72.1-0997
DESIGN PROPOSAL FOR BALL GRID ARRAY DESIGN LIBRARY:292
PIN PLASTIC BALL GRID ARRAY
Table 1 Plastic Ball Grid Array (PBGA) General Design Characteristics
Ball Count Signal I/O Body Size Pitch Matrix Array
Thermal
Enhan.
Profile
Height
Cavity
Orient.
Wirebond
Rings
292 231 27x27 1.27 20x20 depopulated 6x6 2.13 up 2
Substrate
Material
Metal
Layers
Die Inter-
connect
Encapsulation
Design / Material
Ball
Composition
JEDEC
Designation
Precondition-
ing Level
Design
No.
SEMI
Designa-
tion No.
BT Laminate 2(2S0P0G) wirebond overmolded epoxy 63/37 Sn/Pb MO-151
BAL-2, B
Level 3,Rev 0 PBD0001 G72.1
SEMI G72.1-0997 © SEMI 1997 2
Figure 1
292 Pin Plastic Ball Grid Array 27 x 27 mm Body Design
SEMI G72.1-0997 © SEMI 19973
Table 2 292 Pin Plastic Ball Grid Array 27x27 mm Body Design
Design No.
PBD0001 SEMI Standard BGA Design Library Revision Initial
Date
6/20/96
Page
2 of 8
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
w/b ring 1 A1 3
230 A2 4
225 A3 4
222 A4 4
218 A5 4
215 A6 4
213 A7 4
210 A8 4
206 A9 4
202 A10 4
201 A11 4
198 A12 4
194 A13 4
191 A14 4
188 A15 4
184 A16 4
181 A17 4
180 A18 4
175 A19 4
174 A20 3
1B1 1
229 B2 4
228 B3 4
224 B4 4
221 B5 4
217 B6 4
214 B7 4
211 B8 4
207 B9 4
203 B10 4
199 B11 4
197 B12 4
193 B13 4
190 B14 4
187 B15 4
183 B16 4
177 B17 4
176 B18 4
173 B19 3
171 B20 3
6C1 1
2C2 1
231 C3 4