semi合集-English.pdf - 第6088页

SEMI G15-93 © SEMI 198 2, 1996 2 Figure 1 8.2 Determ ine the onset of melting a n d refer to the manual for the tem perat ure correction m ethod. NOTE 2: There are oth er standard reference materials with higher m elting…

100%1 / 7923
SEMI G15-93 © SEMI 1982, 19961
SEMI G15-93
STANDARD TEST METHOD FOR DIFFERENTIAL SCANNING
CALORIMETRY OF MOLDING COMPOUNDS
1 Preface
1.1 ScopeThis document describes procedures for
evaluating epoxy molding compounds by differential
scanning calorimetry (DSC).
1.2 Units — This test method uses SI units.
2 Applicable Documents
2.1 Reference Documents
2.1.1 ASTM Specifications
1
ASTM E 793Test Method for Heats of Fusion and
Crystallization by Differential Scanning Calorimetry
ASTM E 967 — Practice for Temperature Calibration of
Differential Scanning Calorimeters and Differential
Thermal Analyzers
ASTM E 968 — Practice for Heat Flow Calibration of
Differential Scanning Calorimeters
2.2 Related Documents
2.2.1 ASTM Specifications
ASTM E 473 — Standard Definitions of Terms Relating
to Thermal Analyses
ASTM E 1269 — Test Method for Determining Specific
Heat by Differential Scanning Calorimetry
3 Significance
3.1 DSC provides a rapid method at incoming
inspection for evaluating molding compounds for
consistency in subsequent molding processes.
4 Interferences
4.1 Very small quantities of material are used in the
test. Lack of homogeneity may cause variable results.
4.2 Gas Purge — See Section 5.
4.3 Sample Pans — See Section 5.
5 Equipment
5.1 Differential Scanning CalorimeterCapable of
heating a sample from room temperature to 300°C with
a controlled heating rate.
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohoken, PA 19428-2959
NOTE 1: Gas Purge Considerations — A reactive gas purge
affects the material under test. A gas must be chosen that
reflects the molding conditions normally used for that
material (i.e., air or nitrogen).
5.2 Sampling Pans for DSC Cell (Aluminum with
crimping or hermetically sealed.) The pans must not be
reactive to the sample under test.
5.3 Process Controller — Capable of collecting,
calculating, and plotting the data resulting from the
calorimeter.
5.4 Analytical Balance — Accuracy 0.001 mg.
5.5 Tweezers and Microspatula
6 Sampling
6.1 When the method is used to evaluate incoming
molding materials, the sampling plan shall be agreed
between supplier and customer.
6.2 Powdered or granular molding compounds shall be
thoroughly mixed before sampling. If the compound is
supplied in a preform, a small section may be cut off
the preform with a blade.
7 Preparation of Samples
7.1 Protect samples from moisture absorption while
awaiting test.
8 Equipment Setup and Cal ibration
8.1 Temperature Calibration — (Refer to ASTM E
967.)
8.1.1 Follow the manufacturer's operating manual to
set up and run a calibration curve using indium
(Melting Point 156.6°C) (see Figure 1).
SEMI G15-93 © SEMI 1982, 1996 2
Figure 1
8.2 Determine the onset of melting and refer to the
manual for the temperature correction method.
NOTE 2: There are other standard reference materials with
higher melting points (see Table 1). Choose the standard
which best matches the range of interest for the material under
test.
Table 1
Reference Material Melting Point (°C)
Indium 156.6
Tin 232.0
Zinc 419.6
8.2.1 Indium is also used to calibrate the Heat of
Fusion for the DSC cell. Table 2 also lists the Standard
Heat of Fusion for alternate materials that may be used.
Table 2
Reference Material Heat of Fusion (J/g)
Mercury 11.44
Indium 28.42
Lead 23.16
Tin 59.23
Zinc 112.0
8.2.2 An area calculation of the indium melt provides
the Heat of Fusion for DSC cell (see Figure 1).
8.2.3 Refer to the operating manual to obtain the cell
constant and its correction.
9 Procedure
9.1 Sample Size — 2.000 to 12.000 mg may be used.
8.000 mg is commonly used. A small design of
experiments exercise may be used to obtain the
optimum sample size for the molding compound under
test. Different compound chemistries may have an
effect on the results if the sample size is not carefully
chosen.
Place the sample in the sample pan.
9.2 Use an empty sample pan with its cover as a
reference.
9.3 Carefully place the sample and reference pans onto
their respective thermal sensors in the DSC cell. Seal
the cell according to the manufacturer's instructions.
9.4 Set the heating rate to the optimum conditions
determined for that instrument and the specific material
under test. This rate will normally be between 5°C and
25°C per minute.
9.5 Activate the test sequence, and heat the sample
from room-temperature to 300°C in order to obtain the
DSC curve.
9.6 At the end of the run, remove the sample, and
allow the DSC cell to cool to room-temperature in
preparation for the next sample.
10 Results Report
10.1 The results report shall contain the following
items:
10.1.1 Sample and equipment details
Molding material name/number
Sample weight
Equipment used
Heating rate
Calibration constant
Any pertinent information regarding material or
equipment
10.1.2 Scan Results — The DSC curve shall indicate
the following:
Maximum peak exotherm — units °C
Exotherm onset — units °C
Exotherm — units joules/gram
NOTE 3: The total exotherm is determined by an area
calculation of the exotherm profile using a computer drawn
baseline.
SEMI G15-93 © SEMI 1982, 19963
11 Accuracy and Precision (s ee ASTM E 968)
11.1 Repeatability — Single Analyst — The percent
RSD over multiple days was determined to be 4.2%.
11.2 Reproducibility — Multilaboratory — The
percent RSD was determined to be 8.2%.
12 Alternate Procedures
12.1 Thermal Kinetic Modeling
12.2 Isothermal Differential Scanning Calorimetry
There is a current lack of interlaboratory correlation to
recommend this method.
NOTE 4: Manufacturers’ literature may be used to obtain
information on these methods.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.