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SEMI M55.1-0304 © SEMI 2004 4 Table 5 Laser Marking Requ irements (see figure 8 of SEMI M55) Property Dimension Units GEOMETRY dimension A 0.5 mm dimension B 2.0 mm dimension C 7.5 mm See Note 1. CHARACTER DIMENSIONS AND…
SEMI M55.1-0304 © SEMI 2004 3
tilt angle tilt angle
off towards [1120]
direction
off towards [1100 ]
dir ec tion
[1120]
dire cti on
[1120]
directi on
(1100) plane
(1100) p lan e
Figure 2
Direction of Tilt (left: (1120) option, right off axis (1100) option)
Table 4 Polished Wafer Defect Limits
Item Characteristics Maximum Defect Limit Test Condition Note
Front Surface
1 visible scratches none high intensity, unaided eye 1
2 pits (number) 10 high intensity, unaided eye 1
3 orange peel (area) 10 % diffuse, unaided eye 1
4 particles (number) 4 high intensity, unaided eye 1
5 edge chips and indents (number)
≤ 3 with maximum length and
width 1.0 mm
Back Surface
6 edge chips (number)
≤ 3 with maximum length and
width 1.0 mm
Bulk
7 cracks (number) none diffuse, unaided eye
8 micropipes (mean density) defined by customer and supplier
9 planar defects,
spacing >2 mm (number)
10 diffuse, unaided eye 1
10 planar defects,
spacing ≤ 2 mm (affected area)
10 % diffuse, unaided eye 1
11 crystallite (area) 5 % diffuse, polarisers 1
12 foreign polytypes (area) 10 % diffuse 1
Cumulative Defect Area
12 all listed defects of type “area” total 10 % 1
NOTE 1: The Edge-Exclusion X (See Figure 1 of SEMI M55) is 1 mm.
SEMI M55.1-0304 © SEMI 2004 4
Table 5 Laser Marking Requirements (see figure 8 of SEMI M55)
Property Dimension Units
GEOMETRY
dimension A 0.5 mm
dimension B 2.0 mm
dimension C 7.5 mm See Note 1.
CHARACTER DIMENSIONS
AND OUTLINE
not defined readable with unaided eye (SEMI M55)
CHARACTER SET Defined by SEMI M12
FORMAT OF ID-STRING
(see Note 2)
NNNNNNNNNNSSCC NNNNNNNNNN: (10 characters)
supplier defined ID of wafer, with a dash as separator.
Unused characters are filled with dash characters.
Alphanumeric.
SS: (2 characters)
Supplier Code as defined in SEMI AUX001. Alpha
only.
CC: (2 characters)
Checksum Characters generated by the algorithm
defined in SEMI M12.
The first character is alpha only, the second numeric
only.
NOTE 1: The total width of the marking window is twice dimension C.
NOTE 2: This definition of the ID-string is intended to identify wafers from different suppliers and to support use of OCR-techniques. Both
cannot be accomplished with the currently widely used proprietary formats for the ID-strings.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer' s instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
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respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
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Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI M55.2-0705 © SEMI 2005 1
SEMI M55.2-0705
SPECIFICATION FOR 76.2 mm ROUND POLISHED
MONOCRYSTALLINE 4H AND 6H SILICON CARBIDE WAFERS
This specification was technically approved by the global Compound Semiconductor Materials Committee.
This edition was approved for publication by the global Audits and Reviews Subcommittee on May 20, 2005.
It was available at www.semi.org in June 2005 and on CD-ROM in July 2005.
1 Purpose
1.1 This subordinate standard detail the dimensional values and other information required for 76.2mm polished
monocrystalline silicon carbide wafers.
2 Scope
2.1 The complete specification for this product includes all general requirements of SEMI M55, Specification For
Polished Monocrystalline Silicon Carbide Wafers.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
3 Limitations
3.1 The backside finish properties, dopant and resistivity are not addressed, as currently these properties depend
strongly on the quick evolving technology and suitable limits for a standard do not exist.
4 Referenced Standards and Documents
SEMI M13 — Specification for Alphanumeric Marking of Silicon Wafers
SEMI AUX1 — List of Wafer Supplier Identification Codes
5 Terminology
5.1 None.
6 Requirements
Table 1 Dimension and Tolerance Requirements
Property Dimension Tolerance Units
DIAMETER 76.2
0.25
mm
PRIMARY FLAT LENGTH 22.0
2.0
mm
SECONDARY FLAT LENGTH 11.0
1.5
mm
BOW 0
25
µm
WARP 0 <25 µm
TOTAL THICKNESS VARIATION 0 <25 µm
TOTAL INDICATOR READING 0 <25 µm
THICKNESS 350
25
µm
Table 2 Orientation and Flat Location Requirements
Property Dimension
SURFACE ORIENTATION
#1, #2
Tilt angle (see Figure 2 in SEMI M55)
Option 1:”on axis” 0 + 0.25°