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SEMI F46-0999 © SEMI 1999 4 8.6 Filtration Optio ns  Recircul a t i on filtratio n of either QC tanks or the Product storag e tank is importan t to control particle levels in the final chemical. Recirculation filtration…

SEMI F46-0999 © SEMI 19993

and/or company codes.

7.3.4 An appropriate component design must be used

for the gas/liquid interface(s).

7.4 The OSCG System  The appropriate OSCG

system will be defined based on overall capacity

requirements.

7.4.1 The OSCG system can provide feed gas

purification and chemical generation within a stand

alone packaged unit or use externally purified feed

gases. Optional Feed gas purification may also be

provided in this package.

7.4.2 The OSCG system will have a dedicated control

system to control all process parameters and monitor all

system safety interlocks including external safety

systems.

7.4.3 The OSCG will provide pressurized chemical to

the Product Quality verification subsystem.

7.5 Product Quality Verification  All OSCG

installation will include some type of Product sampling

and quality verification scheme.

7.5.1 The standard quality verification scheme will

provide for an in-line, “Clean Sample” station to allow

for random samples to be taken for analysis.

7.5.2 A SPC quality assurance scheme can be utilized

to track and record product chemical purity and assay

guides. Readings are plotted using X-bar/R format and

reacted to based on standard SPC rules.

7.5.3 In this scheme product chemical is transferred to

the Product storage tank directly from the OSCG

system, through the sampling subsystem or directly to

chemical delivery systems.

7.6 Product Storage  All OSCG implementation

will include a Product chemical storage scheme to

ensure chemical availability to the customer.

7.6.1 Product storage is achieved, typically, by

including an appropriately sized storage tank. This tank

becomes the source to the chemical distribution system.

7.6.2 Product storage volume is defined to provide

suitable inventory of product chemical storage. This

will provide chemical available to the distribution

system during periods of both scheduled and

unscheduled maintenance.

7.6.3 Additionally, a back-up supply of prequalified

chemical may be available to transfer into the Product

tank, if required.

7.7 Central Monitoring System  A central CPU

based monitoring system is required for multiple

purposes in the overall implementation.

7.7.1 The central CPU will communicate with all

subsystems and tanks to share information, as required,

to ensure total system operations.

7.7.2 The central CPU also provides data logging and

database features to track and log product quality and

system failure data as required.

7.7.3 The central CPU can also provide a remote

monitoring feature and interface with the customer’s

facility tracking system (if desired).

8 Optional Configurations and Support

Systems

8.1 Feed Gas Supply  Some customers may already

have an existing source of an appropriate Feed gas for

the OSCG system. Implementation schemes can be

configured to utilize this existing gas storage and

supply system. The existing system will need to meet

the vendors guides for gas purity and line pressures.

8.2 Product Storage and Staging Tanks  Some

customers may already have tanks that can be used for

Product Storage and/or staging applications.

Implementation schemes can be configured to utilize

these existing storage tanks. The existing tanks must

meet vendors guides for materials, inlets/outlets, and

volume. Level sensor data will be provided to the

central CPU system.

8.3 Multiple OSCG Systems  Depending on capacity

requirements, OSCG installations can be configured to

have multiple Generator systems in parallel. All

product outputs should have the capability to be

sampled individually before combining into a common

product stream for storage.

8.4 Support Systems  Various support systems and

options can be provided to support the overall

implementation scheme.

8.4.1 Stand-alone, water-cooled Chiller(s) may be

required, if the house chilled water is not available.

8.4.2 Redundant pump options should be available in

any pumping system to allow for either manual switch

over or automatic back-up.

8.4.3 Transfer pumping systems or transfer options

should be available for the transfer of chemical from or

to remote storage tanks.

8.5 Chemical Distribution  Chemical distribution

systems may or may not be in existence at specific

customer sites. The distribution of chemical from the

product storage to use points will be important to

maintain chemical purity. These distribution systems

should be available as a directly supplied option or

offered through a sub-contracted supplier.

SEMI F46-0999 © SEMI 1999 4

8.6 Filtration Options  Recirculation filtration of

either QC tanks or the Product storage tank is important

to control particle levels in the final chemical.

Recirculation filtration options should be provided,

depending on the specific chemical storage

configuration.

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer's

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user's attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI F47-0200 © SEMI 1999, 20001

SEMI F47-0200

SPECIFICATION FOR SEMICONDUCTOR PROCESSING EQUIPMENT

VOLTAGE SAG IMMUNITY

This specification was technically approved by the Global Facilities Committee and is the direct

responsibility of the North American Facilities Committee. Current edition approved by the North American

Regional Standards Committee on December 15, 1999. Initially available on www.semi.org January 2000; to

be published February 2000. Originally published September 1999.

1 Purpose

1.1 Semiconductor factories require high levels of

power quality due to the sensitivity of equipment and

process controls. Semiconductor processing equipment

is especially vulnerable to voltage sags. This document

defines the voltage sag ride-through capability required

for semiconductor processing, metrology, and

automated test equipment.

1.2 The requirements in this international standard

were developed to satisfy semiconductor industry

needs. While more stringent than existing generic

standards, this industry-specific specification is not in

conflict with known generic equipment regulations

from other regions or generic equipment standards from

other organizations (see Related Information section).

1.3 It is the intent of this standard to provide

specifications for semiconductor processing equipment

that will lead to improved selection criteria for sub-

components and improvements in equipment systems

design. While it is recognized that in certain extreme

cases or for specific functions battery storage devices

may be appropriate, it is not the intent of this standard

to increase the size or use of battery storage devices

provided with equipment. Focus on improvements in

equipment component and system design should lead to

a reduction or elimination in the use of battery storage

devices to achieve equipment reliability during voltage

sag events.

2 Scope

2.1 This document specifies the minimum voltage sag

ride-through capability design requirements for

equipment used in the semiconductor industry. The

expected equipment performance capability is shown

graphically on a chart representing voltage sag duration

and percent deviation of equipment nominal voltage.

Standard evaluation test method references are also

included.

2.2 The primary focus for this specification is

semiconductor processing equipment including but not

limited to the following tool types:

• Etch equipment (Dry & Wet),

• Film deposition equipment (CVD & PVD),

• Thermal equipment,

• Surface prep and clean,

• Photolithography equipment (Stepper & Tracks),

• Chemical Mechanical Polishing equipment,

• Ion Implant equipment,

• Metrology equipment, and

• Automated test equipment.

2.3 This specification applies to se miconductor

processing equipment to include the equipment

mainframe and all subsystems whose electrical power is

directly affected by the operation of the equipment’s

EMO system.

2.4 This standard does not purport to address safety

issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

3 Limitations

3.1 Not included in this standard are over voltage

conditions, voltage sag duration of less than 0.05

seconds (50 milliseconds), and voltage sag duration of

greater than 1.0 seconds. If necessary, the Information

Technology Industry Council (ITIC) “CBEMA-curve”

contained in IEEE 446, IEEE 1100, and SEMI E51 can

be used to specify additional requirements outside the

range of this document (see Related Information,

Section R1-1).

3.2 This specification does not address wafer quality

with regard to processing variation caused by voltage

sags. It is recommended that each equipment supplier

consider the effects of voltage sags on their equipment

processes. If voltage sags above the defined line can

result in known wafer quality problems, then an appro-

priate notification-only scheme should be considered in

the equipment design. To be in conformance with this

standard that notification scheme should not be

classified as an equipment interrupt per SEMI E10.

3.3 This standard addresses specifications for

semiconductor processing equipment voltage sag

immunity. Factory systems voltage sag immunity and

electric utility voltage sag performance are covered in