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SEMI E74-0301 © SEMI 1998 , 2001 9 RELATED INFORM A TI ON 1 AP P L I C AT I O N N OT E S NOT E: T his re lated inform ation is n ot a n offic ial part of SEMI E 74 and is n ot intended t o modify or superc ede the of fic…

SEMI E74-0301 © SEMI 1998, 2001 8

6.3 Incoming Power Supply

6.3.1 Table 8 and Table 9 specify the required TMP incoming AC power supply connector and pin assignments.

Table 8 Incoming AC Power Supply Connector (pump side)

No. Items Connector Type Referenced Standard Pin Assignments Remarks

1 Single phase,

200V

− 230V

± 10%

50/60 Hz

Receptacle (male) SEMI S2 See Table 9

Table 9 Pin Assignment for Incoming Power Supply Connector

No. Pin No. Item Remarks

1 1 or A Hot AC

2 2 or B Cold single phase

3maximum or last

pin number in the

connector

Earth/Ground When using a connector that has a special grounding pin

not included in the standard pin arrangement, the last pin

becomes a blank pin. (See Related Documents for an

example of specification for this connector.)

7 Related Documents

NOTE 2: All documents cited will be the latest published versions.

7.1 DIN Standard

DIN VDE 0627 — Connectors and plug-and-socket devices; for rated voltages to 1000 V

, up to 1200 V

, and

rated currents up to 500 A for each pole

7.2 Military Standard

MIL-PRF-24308 — General Specification for Connectors, Electric, Rectangular, Non-Environmental, Miniature,

Polarized Shell, Rack, and Panel

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant

literature respecting any materials mentioned herein. These standards are subject to change without notice.

The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted

material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights, are entirely their own responsibility.

2 Deutsches Institut für Normung e.V., Beuth Verlag GmbH Burggrafenstrasse 4-10, D-10787 Berlin, Germany

3 Military Standards, Naval Publication and Form Center, 5801 Tabor Avenue, Philadelphia, PA 19120

SEMI E74-0301 © SEMI 1998, 20019

RELATED INFORMATION 1

APPLICATION NOTES

NOTE: This related information is not an official part of SEMI E74 and is not intended to modify or supercede the official

standard. This related information is optional and contains information that is not required to conform to this standard.

NOTE 1: While this standard was developed to specify

vacuum pumps installed with 300 mm equipment, the

standard should also be applied to vacuum pumps

installed with 200 mm equipment.

NOTE 2: ICF flange is available on request for inlet

flange.

NOTE 3: In order to save space and reduce cost, the

connector for the control and running status signals

should be a minimum size required for the number of

pins specified in the standard. If the additional signal

connections are required another connector should be

added to the pump.

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature

respecting any materials mentioned herein. These

standards are subject to change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E76-0299 



 SEMI 1998, 1999

SEMI E76-0299

GUIDE FOR 300 mm PROCESS EQUIPMENT POINTS OF

CONNECTION TO FACILITY SERVICES

This Guide was technically approved by the Global Facilities Committee and is the direct responsibility of

the North American Facilities Committee. Current edition approved by the North American Regional

Standards Committee on August 15, 1998. Initially available at www.semi.org January 1999; to be published

February 1999. Originally published September 1998.

This document replaces E76-0998 in its entirety.

1 Purpose

1.1 Factory design variations make it difficult for

equipment manufacturers to predict or agree on

consistent points of connection for hookup of equipment

to facility services. Similarly, device manufacturers

cannot easily pre-facilitate their factories for equipment

because the connections on the equipment are not

consistently located. Standardization of connection

locations and utilizing pre-facilitation strategies

decreases the cost of and time required for equipment

installation.

1.2 This document is a guide for 300 mm equipment

manufacturers to define the positioning of the

equipment points of connection (EPOC), required on

semiconductor processing equipment for hookup to

facility utility services. The document identifies

locations for the EPOC’s and provides EPOC

consistency recommendations that should allow for

efficient equipment installation. In addition, this

document defines strategies to support the device

manufacturer’s ability to pre-facilitate the utility point

of connection (UPOC). Recommendations for supplier-

provided EPOC documentation are also included.

2 Scope

2.1 This guide addresses three areas that are necessary

to improve the efficiency of and reduce the duration of

equipment installations.

a) Recommendations for EPOC location, grouping,

consistency and reduction to increase confidence in

the accuracy and repeatability of EPOC’s, and

reduce the amount of work required to hookup

equipment. As a result, device manufacturers can

employ standard pre-facilitation strategies and

increase the efficiency of equipment installation.

b) Pre-facilitation recommendations that provide the

ability for UPOC’s to be efficiently and accurately

installed prior to equipment delivery, thus allowing

immediate hook-up of the equipment upon arrival

in the wafer fab. This includes recommendations

for jigs, templates, mating pedestal bases, and

associated interface panels.

c) Documentation recommendations to be required by

the device manufacturer and provided by the

equipment supplier relative to EPOC location,

group, consistency, pre-facilitation strategies and

hardware. This includes additional documentation

recommended to support equipment installations

but not directly related to EPOC’s.

2.2 This guide applies to 300 mm semiconductor

processing equipment and any supplier-provided

support equipment for installation into new factories.

2.3 The following groups of utilities are covered in this

guide.

• Electrical Power

• Data communications

• Exhaust and other process effluents

• Process fluids (liquids and gases)

• Support equipment interconnects

2.4 The primary focus for this guide is hookup of

semiconductor processing equipment including but not

limited to the following equipment types.

• Etch equipment (Dry and Wet)

• Film deposition equipment (CVD, PVD and

Plating)

• Thermal equipment

• Surface prep and clean

• Photolithography equipment (Stepper and

Tracks)

• Chemical Mechanical Polishing equipment

• Ion Implant equipment

• Metrology equipment

3 Limitations

3.1 This standard does not apply to assembly and test

equipment.

3.2 International, national, and local codes, regulations