semi合集-English.pdf - 第5523页

SEMI P10-0705 © SEMI 1990, 2005 18 [FINAL_QC_AUDITOR] { ADDITIONAL_RESULTS_INFO } END_MASK_RESULTS_OPTIONS <vendor_info> = START_VENDOR_INFO [VENDOR_CONTACT] [VENDOR_P H ONE] {VENDOR_ADDRESS} [VENDOR_FAX] [VENDOR_ …

SEMI P10-0705 © SEMI 1990, 2005 17

[<vendor_info>]

billing_information>]

materials_used >]

{MFG_SITE_REQD} [MFG_SITE_USED]

[PRODUCT_TYPE] [PRODUCT_MAGNIFICATION]

[MASK_NAME]

{ TITLE_TEXT [TITLE_TYPE] }

[DUE_DATE_TIME_COMMITTED] [ELAPSED_TIME_COMMITTED]

[MILESTONE [ADDITIONAL_MILESTONE_INFO] ]

[PERIODIC_UPDATE [ADDITIONAL_MILESTONE_INFO] ]

[ESTIMATED_ARRIVAL [ADDITIONAL_MILESTONE_INFO] ]

[MASK_SHIPPED_DATE_TIME]

[FINAL_AUDIT_DATE_TIME]

[DESIGN_RULE]

[<wafer_exposure_data> <aerial_image_data>]

[FAB_TECHNOLOGY] [WAFER_FAB]

[JOB_ONLY_APPROVED] [JOB_WITH_PATTERNS_APPROVED]

{PATTERN_APPROVED} [ALL_PATTERNS_APPROVED]

[APPROVAL_GRANTED]

[MIRROR_MASK] [MASK_ROTATION]

[CUSTOMER_SPEC CUSTOMER_SPEC_REVISION]

{WAIVER} {WAIVER_OVERRIDE}

{ [BARCODE_TYPE] BARCODE_TEXT BARCODE_ROTATION }

[SHIPPING_METHOD_USED]

[MEASURED_PERCENT_CLEAR]

[CENTRALITY] [MEASURED_CENTRALITY]

litho_information>}

pattern_group_results>}

phase_shift_measurements>]

{<registr_measurements>}

closure_measurements>}

cd_group_measurements>}

cd_set_results>}

cd_xy_results>}

cd_iso_dense_results>}

{<defect_measurements>}

[THROUGH_PELLICLE_DEFECTS {<defect_measurements>} ]

{<surface_insp_measurements>}

[QUALITY_GROUP_ID]

SEMI P10-0705 © SEMI 1990, 2005 18

[FINAL_QC_AUDITOR]

{

ADDITIONAL_RESULTS_INFO}

END_MASK_RESULTS_OPTIONS

<vendor_info> = START_VENDOR_INFO

[VENDOR_CONTACT] [VENDOR_PHONE] {VENDOR_ADDRESS}

[VENDOR_FAX] [VENDOR_EMAIL]

[

FINAL_QC_AUDITOR]

[VENDOR_ORDER_ID]

END_VENDOR_INFO

<billing_information> = START_BILLING_INFORMATION

[

BLANKET_PO_NUMBER] [PO_NUMBER] [SO_NUMBER] [RELEASE_NUMBER]

END_BILLING_INFORMATION

<materials_used> = START_MATERIALS_USED

[TOP_PELLICLE_USED] [

BOTTOM_PELLICLE_USED]

[PACKAGE_USED]

substrate>] END_MATERIALS_USED

<substrate> = START_SUBSTRATE

BLANK_LENGTH [BLANK_WIDTH] BLANK_THICKNESS

BLANK_TYPE [BLANK_GRADE]

[

BLANK_FLATNESS] [BLANK_FLATNESS_USED] [BLANK_VENDOR]

[BLANK_BIREFRINGENCE_REQD] [BLANK_BIREFRINGENCE_USED]

{<coating>}

[

BLANK_INDEX_OF_REFRACTION]

[

BLANK_LOT] [BLANK_DATE_OF_MFG]

euv_blank_type>] END_SUBSTRATE

<coating> = START_COATING

COATING_TYPE [COATING_COMPOSITION] [COATING_THICKNESS]

[COATING_REFLECTANCE] [COATING_TRANSMITTANCE]

[COATING_WAVELENGTH] [COATING_GRADE]

[COATING_PHASE] [COATING_OPTICAL_DENSITY]

[COATING_LOT_NUMBER] [COATING_DATE_TIME]

[COATING_MASK_VENDOR_APPLIED] [COATING_EQUIP_USED]

END_COATING

<euv_blank_type> = START_EUV_BLANK_TYPE

EUV_BLANK_TYPE

EUV_FLATNESS_FRONT

EUV_FLATNESS_BACK

EUV_MULTILAYER_COMPOSITION

EUV_CAPPING_COMPOSITION

SEMI P10-0705 © SEMI 1990, 2005 19

EUV_MMR_WAVELENGTH

EUV_MEAN_PEAK_REFLECTIVITY

EUV_PEAK_REFLECTIVITY_UNIFORMITY

EUV_ABSORBER_COMPOSITION

EUV_ABSORBER_OPTICAL_PROPERTIES

EUV_BLANK_RESISTANCE

EUV_EXPANSION_COEFF

END_EUV_BLANK_TYPE

<wafer_exposure_data> = START_WAFER_EXPOSURE_DATA

WAFER_EXPOSURE_NUMERICAL_APERATURE

[WAFER_EXPOSURE_SIGMA]

[WAFER_EXPOSURE_SIGMA_INNER WAFER_EXPOSURE_SIGMA_OUTER]

WAFER_EXPOSURE_ILLUMINATION

END_WAFER_EXPOSURE_DATA

<aerial_image_data> = START_AERIAL_IMAGE_DATA

AIM_WAVELENGTH

[AIM_INTENSITY_VARIATION_DELTA]

[AIM_FLUX_INTENSITY_DELTA]

[AIM_CD_DELTA]

END_AERIAL_IMAGE_DATA

<litho_information> = START_LITHO_INFORMATION

{ [LITHO_EQUIP_REQD] {EQUIP_SITE_REQD}

{ [

LITHO_MODEL_REQD] {LITHO_MODE_REQD} } }

[LITHO_EQUIP_USED] [EQUIP_SITE_USED]

[LITHO_MODEL_USED] [LITHO_MODE_USED]

[MACHINE_SERIAL_NUMBER]

[MASK_SERIAL_NUMBER]

[PROCESS]

[WRITE_DATE_TIME] [ELAPSED_WRITE_TIME]

[OPERATOR]

END_LITHO_INFORMATION

<pattern_group_results> = START_PATTERN_GROUP_RESULTS

PATTERN_GROUP_ID

phase_shift_measurements>}

registr_measurements>}

closure_measurements>}

cd_group_measurements>}

cd_set_results>}

cd_xy_results>}

{<cd_iso_dense_results>}