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SEMI G38-0996 © SEMI 1987, 2004 8 APPENDIX 1 REPORT FORMAT NOTICE : This ap pendix was approved as a n official part of SEMI G38 by f ull letter ba llot procedure. The following format is a sample of report format: 1. De…
SEMI G38-0996 © SEMI 1987, 2004 7
Figure 3
Test Board Orientation Inside Wind Tunnel
SEMI G38-0996 © SEMI 1987, 2004 8
APPENDIX 1
REPORT FORMAT
NOTICE: This appendix was approved as an official part of SEMI G38 by full letter ballot procedure.
The following format is a sample of report format:
1. Description of Package
1.1 Package Type
Package Name ________________ (per JEDEC or EIAJ)
Pin Counts ________________ pins
Special Specification ________________ Yes ________________ No
1.2 Test Chip
Chip per SEMI G32 ________________ Yes ________________ No
Chip Size ________________ mm x ________________ mm
Chip Thickness ________________ mm
1.3 Leadframe
Leadframe Material Fe/Ni Alloy, Cu, Cu Alloy, Other (________________)
Leadframe Thickness ________________ mm
Die Pad Size ________________ mm x ________________ mm
1.4 Package Dimension & Compound
Package Size ________________ mm x ________________ mm
Package Thickness ________________ mm
Compound Material ________________________________
1.5 Others
Die Attach Material ________________________________
Heat Sink/Spreader ________________ Yes ________________ No
2. Description of Test Board
Test Board per SEMI G42 ________________ Yes ________________ No
No. of Layers ________________________________
3. Measurement Result
Power Dissipation ________________ W
SEMI G38-0996 © SEMI 1987, 2004 9
Units: °C/W
Air Velocity (m/s)
Sample No.
0 1 3 5
1
2
3
4
5
6
7
8
9
10
Average
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the risk of infringement of such rights, are entirely their own responsibility.
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