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SEMI S14-0704 © SEMI 2000, 2004 2 3.4 This d ocument applies to equi pment in its scope when the equipment is us ed in the environment specified by the equipm ent supp lier. Specifically, it does not a pply to t he behav…
SEMI S14-0704 © SEMI 2000, 2004 1
SEMI S14-0704
SAFETY GUIDELINES FOR FIRE RISK ASSESSMENT AND
MITIGATION FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
These safety guidelines were technically approved by the Global Environmental Health and Safety
Committee and are the direct responsibility of the North American Environmental Health and Safety
Committee. Current edition approved by the North American Regional Standards Committee on April 22,
2004. Initially available at www.semi.org June 2004; to be published July 2004. Originally published
February 2000; previously published November 2003.
NOTICE: Paragraphs entitled “NOTE” are not an
official part of this document and are not intended to
modify or supersede the official Safety Guideline.
These have been supplied by the Task Force to enhance
usage of the Safety Guideline.
NOTICE: The intent of the task force that produced
this document is that conformance to the “should”
provisions of this guideline comprises conformance
with this guideline.
1 Purpose
1.1 This document provides considerations to the
manufacturers of semiconductor manufacturing
equipment that will assist them in assessing and
mitigating the risk to equipment and product associated
with fire and combustion by-products.
1.2 Although these guidelines are written in the form
of an assessment tool, they are intended for use
throughout the design and development of
semiconductor manufacturing equipment.
1.3 These guidelines may also be used by the users of
such equipment and by other interested parties to assess
and compare the described risks of various equipment
designs or in the design and evaluation of ancillary
equipment or modifications.
1.4 These guidelines are not intended to specify which
techniques (e.g., selection of materials or detection
systems) are to be used to mitigate fire risk. These
guidelines do, however, recommend that the traditional
risk management hierarchy of elimination, engineering
controls, administrative controls, warning and work
practices be followed.
1.5 The appropriate application of these guidelines will
result in a report which identifies, analyzes and assesses
residual fire risks.
2 Scope
2.1 These guidelines apply to equipment used to
manufacture, measure, assemble, and test semiconduc-
tor products which is intended to be located in clean-
rooms used for semiconductor manufacturing processes
or areas within their recirculation airstream. They
apply to all of the components of the equipment, as
described herein.
NOTE 1: This document is not limited to the structural or
large-area components of equipment.
2.2 This document applies to fire risks originating
within the subject equipment that may result in damage
to it, other equipment, products, or the facility.
2.3 This document identifies considerations for
assessing the fire risk of semiconductor manufacturing
equipment, means of categorizing the risks, and means
of mitigating the risks.
NOTICE: This safety guideline does not purport to
address all of the safety issues associated with its use.
It is the responsibility of the users of this safety
guideline to establish appropriate safety and health
practices and determine the applicability of regulatory
or other limitations prior to use.
3 Limitations
3.1 These guidelines do not establish acceptance
criteria for residual risk.
3.2 This document recommends a hierarchy of
approaches (e.g., elimination of a hazard is preferable
to an engineering control) but neither prescribes which
specific risk mitigation methods (e.g., change of
material or elimination of an ignition source) are to be
used nor ranks their relative merit.
3.3 These guidelines apply to the protection of
property; they do not apply to the protection of
personnel.
NOTE 2: Protection of personnel from fire risk is within the
scope of SEMI S2.
SEMI S14-0704 © SEMI 2000, 2004 2
3.4 This document applies to equipment in its scope
when the equipment is used in the environment
specified by the equipment supplier. Specifically, it
does not apply to the behavior of equipment when it is
subject to an external fire.
3.5 This document is not intended to be used to assess
compliance with regulatory requirements, nor is it
intended to be adopted as regulation.
3.6 Because of these limitations, it may be appropriate
for purchasers of equipment to specify the applicable
codes and standards and the acceptable level of residual
risk.
NOTE 3: Applicable regional, and national codes, inter-
national regulations, and the equipment manufacturer’s and
user’s requirements must also be considered. When a conflict
exists, the regional and national codes take precedence.
4 Referenced Standards
4.1 SEMI Standards
SEMI E10 — Specification for Definition and
Measurement of Equipment Reliability, Availability,
and Maintainability (RAM)
SEMI E70 — Guide for Tool Accommodation Process
SEMI S2 — Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment
SEMI S7 — Safety Guidelines for Environmental,
Safety, and Health (ESH) Evaluation of Semiconductor
Manufacturing Equipment
SEMI S10 — Safety Guideline for Risk Assessment
and Risk Evaluation Process
4.2 NFPA Documents
1
National Fire Protection Association: NFPA 12 —
Standard on Carbon Dioxide Fire Extinguishing
Systems
National Fire Protection Association: NFPA 13 —
Standard for the Installation of Sprinkler Systems
National Fire Protection Association: NFPA 72 —
National Fire Alarm Code
National Fire Protection Association: NFPA 2001 —
Standard on Clean Agent Fire Extinguishing Systems
4.3 Factory Mutual Document
2
Factory Mutual Research Corp.
Standard 4910 — Clean
Room Materials Flammability Test Protocol
1 National Fire Protection Association, 1 Batterymarch Park, Quincy,
MA 02269, Website: www.nfpa.org
2 Factory Mutual Research Corp., 1151 Boston-Providence Turnpike,
Norwood, MA 02062, phone: 781-762-4300, fax: 781-762-9375,
website: http//www.factorymutual.com
4.4 Underwriters Laboratory Documents
3
Underwriters Laboratory Standard 94 — Tests for
Flammability of Plastic Materials for Parts in Devices
and Appliances
Underwriters Laboratories Standard 746A — Polymeric
Materials - Short Term Property Evaluations
Underwriters Laboratories Standard 746B — Polymeric
Materials - Long Term Property Evaluations
Underwriters Laboratories Standard 746C — Polymeric
Materials - Use in Electrical Equipment Evaluations
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
5 Terminology
5.1 Definitions
5.1.1 accredited testing laboratory — an independent
organization dedicated to the testing of components,
devices, or systems; competent to perform evaluations
based on established safety standards and recognized by
a governmental or regulatory body. [SEMI S2]
5.1.2 cleanroom — a confined area in which the
humidity, temperature, particulate matter, and
contamination are precisely controlled within specified
parameters. [SEMI E70]
5.1.3 combustible liquid — a liquid that will burn and
has a flash point at or above 37.8° C (100° F).
5.1.3.1 For the purpose of this guideline, a combustible
liquid, when used by a system capable (under normal or
single-fault conditions) of heating it above its flash
point, is considered a flammable liquid.
5.1.4 combustible material — for the purpose of this
document, a combustible material is any material which
does not meet the definitions in this section for
noncombustible materials.
NOTE 4: A list of criteria, guidelines and standards that may
be used to evaluate the fire properties of materials is included
in Appendix 2.
5.1.5 downtime — the time when the equipment is not
in a condition, or is not available, to perform its
intended funtion. It does not include any portion of non-
scheduled time. [SEMI E10]
NOTE 5: Downtime may be considered according to the
definition of SEMI E10, assuming commited availability of
the parts in question.
5.1.6 flammable liquid — a liquid having a flash point
below 37.8° C (100° F).
3 Underwriters Laboratory, 333 Pfingsten Rd, Northbrook, IL 60062
SEMI S14-0704 © SEMI 2000, 2004 3
5.1.7 hazard — a condition that is a prerequisite to a
mishap.
5.1.8 hazardous voltage — unless otherwise defined by
an appropriate international standard applicable to the
equipment, voltages greater than 30 volts rms, 42.4
volts peak, 60 volts dc are defined in this document as
hazardous voltage.
NOTE 6: The specified levels are based on normal conditions
in a dry location environment.
5.1.9 ignition energy — sufficient energy to ignite a
combustible material. The energy required depends on
the form of the energy and the composition and form of
the combustible material.
NOTE 7: The combustible material may be solid, liquid, or
gas.
5.1.10 likelihood — the expected frequency with which
a mishap will occur. Usually expressed as a rate (e.g.,
events per year, per product, per wafer processed).
5.1.11 mishap — an unplanned event or series of
events that results in death, injury, occupational illness,
damage to or loss of equipment or property, or
environmental damage.
5.1.12 noncombustible material — a material that, in
the form in which it is used and under the conditions
anticipated, will not ignite, burn, support combustion,
or release flammable vapors when subjected to fire or
heat. Typical noncombustible materials are metals,
ceramics, and silica materials (e.g., glass and quartz).
5.1.13 process chemicals — solids, liquids, and gases
used in the normal use of the equipment included in the
scope of this document.
NOTE 8: Solids, liquids, and gases used in the maintenance
procedures (e.g., isopropanol used as a cleaning agent)
specified by the equipment supplier should be considered as
well as those used in operation.
5.1.14 pyrophoric material — a chemical that will
spontaneously ignite in air at or below a temperature of
54.4° C (130° F).
5.1.15 residual risk — that risk which remains after
engineering, administrative, and work practice controls
have been implemented.
5.1.16 risk — the expected losses from a mishap,
expressed in terms of severity and likelihood.
5.1.17 safe shutdown condition — a condition in which
all hazardous energy sources are removed and
hazardous production materials are removed or
contained, unless this results in additional hazardous
conditions.
5.1.18 semiconductor manufacturing process — those
manufacturing steps which are part of the creation of
active or passive electrical devices on a semiconducting
wafer, including the deposition of passivation layers
after final metallization, but excluding testing and
dicing.
5.1.19 severity — the extent of the worst credible loss
from a mishap caused by a specific hazard.
5.1.20 supervisory alarm — an alarm indicating a
supervisory condition.
5.1.21 supervisory condition — a condition in which
action or maintenance is needed to restore or continue
proper function.
5.1.22 trouble alarm — an alarm indicating a trouble
condition.
5.1.23 trouble condition — a condition in which there
is a fault in a system, subsystem or component that may
interfere with proper function.
6 Fire Risk Assessment
6.1 Overview
6.1.1 This section provides criteria for evaluation of
the risks associated with several types of fire hazards.
6.1.2 For each identified hazard described in Section 6,
the evaluator should analyze the contributing, causal,
and mitigating factors. The evaluator should also
review any assessment of the material, component, or
equipment as a whole by an accredited testing
laboratory.
6.1.3 The risk assessment should include both normal
operation and the consequence of reasonably foresee-
able, single-point failures within the equipment. It
should not include exposure to fire or external ignition
sources not within the intended use environment.
6.1.4 Certifications by an accredited testing laboratory
of materials, components, or the equipment as a whole
may be used in the fire risk assessment. However, such
certifications are valid only to the extent that the
conditions of use for the certification correlate to the
conditions of use for the equipment whose fire risk is
being assessed.
NOTE 9: For example, a personal computer certified to IEC
60950 might be incorporated into equipment for use as a
controller. The material flammability requirements of IEC
60950 may or may not be sufficient for this use of the
personal computer, depending upon its exposure to oxidizers
and external sources of ignition when incorporated into the
equipment. Also, the levels of smoke tolerable in the
environment for which a general industry standard was
written may exceed those tolerable in semiconductor
manufacturing cleanrooms. Furthermore, if the equipment is