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SEMI D12-95 © SEMI 1995, 2003 2 Figure 2 Substrate Corner Dimensions (shown in 0,0 orie ntation) NOTICE: SEMI makes no warranties or representations as to the suitability o f the standards set forth herein for any partic…
SEMI D12-95 © SEMI 1995, 2003 1
SEMI D12-95 (Reapproved 0703)
SPECIFICATION FOR EDGE CONDITION OF FLAT PANEL DISPLAY
(FPD) SUBSTRATES
This specification was technically approved by the Global Flat Panel Display Committee and is the direct
responsibility of the Japanese FPD Materials and Components Committee. Current edition approved by the
Japanese Regional Standards Committee on April 28, 2003. Initially available at www.semi.org June 2003 to
be published July 2003. Originally published in 1995.
1 Purpose
1.1 This document defines various aspects of the edges
of a flat panel display substrate and describes their
relationships. It assumes the existence of terminology
described in other SEMI flat panel display documents.
It applies to substrates whose nominal thickness
specification is 1.1 mm.
2 Scope
2.1 Significance — The edges of a flat panel display
substrate are important in both the specifications for
and uses of the material. They effect the means for
producing, handling, storing, and processing substrates.
Defining the terminology and the geometric properties
of these edges will assist both the producers and users
of substrates and processing/inspection equipment.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI D3 — Quality Area Specification for Flat Panel
Display Substrates
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Definitions
4.1.1 corner — of a substrate, any corner other than the
orientation corner.
4.1.2 edge length — of a substrate, the nominal length
of an edge, including that portion at the edge corner(s)
from which material may have been removed for
finishing purposes. It is “… defined by two dimensions
X and Y, with nominal and tolerance values for each.”
4.1.3 orientation convention — a means for denoting
the rotational orientation of a substrate.
4.1.4 orientation corner — the corner of a substrate
which identifies the pattern surface and rotational
orientation.
5 Edge Condition
5.1 All edges shall be treated for purposes of operator
safety and to minimize particulate generation. Edges
shall be chamfered per Figure 1; other edge treatments
are being developed as outlined in Related Information
1.
5.2 Other edge-related parameters shall be per Table 1.
6 Corner Condition
6.1 The orientation corner is asymmetrical for all
substrates, with dimensions per Figure 2.
6.2 The edge condition within all corner areas shall
meet the criteria of Section 5.
Table 1
Parameter Nominal Tolerance
Length < 400 mm
≥ 400 mm
± 0.2 mm
± 0.3 mm
Squareness
≤ ± 1/1000 of longer edge for
chamfered edge
Figure 1
Chamfered Edge
SEMI D12-95 © SEMI 1995, 2003 2
Figure 2
Substrate Corner Dimensions
(shown in 0,0 orientation)
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer' s instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
SEMI D12-95 © SEMI 1995, 2003 3
RELATED INFORMATION 1
NOTICE: This related information is not an official part of SEMI D12 and is not intended to modify or supercede
the official standard. Rather, this note describes methods for producing FPD substrate edges which may be under
development. Publication was authorized by full letter ballot procedures.
R1-1 Current Practice
R1-1.1 The edges of FPD substrates are modified
during the substrate manufacturing process so that, in
subsequent panel processing, operator safety is
improved and particulate generation is minimized.
Currently, a “chamfered edge” process is in general use.
This modifies the two “corners” of each edge as shown
in Figure 1.
R1-2 Future Developments
R1-2.1 Other edge treatments may prove more
efficient, and several alternate approaches are under
development. Two of these are a “Radiused Edge” and
“Rounded Edge,” shown in Figures R1-1 and R1-2. The
radiused edge initially appears simple, but appropriate
values of R, for various substrate thicknesses (T), are
being examined for manufacturability. For cases where
R > T, the proper “edge blend,” where R intercepts the
substrate pattern and back surfaces, may prove difficult
to define and control.
Figure R1-1
Radiused Edge
Figure R1-2
Rounded Edge
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
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