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SEMI E137-1104 © SEMI 2004 2 4.5 Western W ood Products Associat ion (WWP A) 4 Western Lumber Grading R u les (WLGR) NOTICE: Unless ot herwise indi cated, all documents cited shall be the latest published versions. 5 Ter…

SEMI E137-1104 © SEMI 2004 1

SEMI E137-1104

GUIDE FOR FINAL ASSEMBLY, PACKAGING, TRANSPORTATION,

UNPACKING, AND RELOCATION OF SEMICONDUCTOR

MANUFACTURING EQUIPMENT

This guide was technically approved by the Global Gases Committee and is the direct responsibility of the

North American Gases Committee. Current edition approved by the North American Regional Standards

Committee on July 11, 2004. Initially available at www.semi.org September 2004; to be published

November 2004.

NOTICE: This standard replaces SEMI E49.1, which has been removed from publication as of the November 2004

(1104) publication cycle.

1 Purpose

1.1 The objective of this document is to establish

standard guidelines for activities specific to the final

assembly, packaging, transportation, unpacking, and

relocation of semiconductor manufacturing equipment

(SME) to the cleanroom manufacturing area.

2 Scope

2.1 This standard has been developed as a guide for

final assembly through relocation of SME, separate

subassemblies, and components from the customer’s

loading dock/receiving area to their cleanroom

manufacturing area for both high and ultrahigh purity

applications.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 Specific guidance associated with environment,

health, and safety (EHS) concerns are not in the scope

of this document.

NOTE 1: The SEMI EHS Technical Committee is working

on a new related safety guideline document that provides EHS

considerations for SME preparation, packaging, shipping, and

handling including the handling of shipping and packaging

materials.

3.2 Process specifications related to wafer particles

and/or quality (e.g., ionic contamination) are not in the

scope of this document. Parameters, such as particles

per wafer pass (PWP), should be in the customer’s

specific equipment process performance specification.

4 Referenced Standards

4.1 SEMI Standards

SEMI C41 — Specifications and Guidelines for 2-

Propanol

SEMI F63 — Guidelines for Ultrapure Water Used in

Semiconductor Processing

4.2 ISO Standard

ISO 14644-1 — Cleanrooms and Associated Controlled

Environments, Part 1: Classification of Air Cleanliness

4.3 APA  The Engineered Wood Association

NOTE 2: The APA  Engineered Wood Association was

formerly known as the American Plywood Association.

PS 1 — Voluntary Product Standard for Construction

and Industrial Plywood

4.4 USA Department of Defense (DOD)

MIL-D-3464 — Military Specification – Desiccants,

Activated, Bagged, Packaging Use and Static

Dehumidification

MIL-PRF-131 — Performance Specification – Barrier

Materials, Watervaporproof, Greaseproof, Flexible,

Heat-sealable

1 International Organization for Standardization, ISO Central

Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,

Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30,

Website: /www.iso.ch

2 APA-The Engineered Wood Association, 7011 So. 19th, Tacoma,

WA 98466, (253) 565-6600, Fax: (253) 565-7265 Website:

http://www.apawood.org

3 United States of America (USA) Department of Defense (DOD)

ASSIST Quick-Search, Website:

http://www.dodssp.daps.mil/products.htm

SEMI E137-1104 © SEMI 2004 2

4.5 Western Wood Products Association (WWPA)

Western Lumber Grading Rules (WLGR)

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

5 Terminology

5.1 Abbreviations and Acronyms

5.1.1 DOD — Department of Defense

5.1.2 EPS — Expanded Polystyrene

5.1.3 IPA — Isopropyl Alcohol (2-propanol)

5.1.4 ISO — International Organization for

Standardization

5.1.5 PO — Purchase Order

5.1.6 PWP — Particles Per Wafer Pass

5.1.7 SEMI — Semiconductor Equipment and

Materials International

5.1.8 SME — Semiconductor Manufacturing

Equipment

5.1.9 UPW — Ultrapure Water

5.1.10 USA — United States of America

5.1.11 WLGR — Western Lumber Grading Rules

5.1.12 WWPA — Western Wood Products Association

6 Cleaning and Wrapping Materials

6.1 For cleaning and triple wrap packaging, the

following materials are recommended:

6.1.1 UPW (reference SEMI F63)

6.1.2 IPA (reference SEMI C41)

6.1.3 Ultralow particle generation, ultralow extractable

ion level, polyester, ISO ST 14644-1 (subsequently

called ISO) Class 5 cleanroom-compatible swabs and

wipes with sealed edges

6.1.4 Ultralow particle generation, hydrocarbon-free,

ultralow extractable ion level, ~150 µm (0.006 in.)

thick, natural polyethylene film

6.1.5 Ultralow particle generation adhesive tape

4 Western Wood Products Association (WWPA), 522 SW Fifth Ave.

Suite 500, Portland, Oregon 97204-2122, Tel: 503-224-3930, Fax:

503-224-3934, Website: http://www.wwpa.org

7 Assembly and Pre-Packaging Procedures

7.1 Pre-Assembly

7.1.1 Machining, sawing, welding, brazing, grinding,

sanding, and other manufacturing operations

incompatible with cleanrooms should be completed

before components are brought into the clean assembly

area.

7.1.2 All SME components should be vacuumed,

blown off with filtered air, and cleaned with a solution

of 10 to 70% IPA diluted in UPW using wipes and

swabs immediately prior to being brought into the clean

assembly area.

7.1.3 Cutting oils, lubricants, and solder flux should be

removed before components are brought into the clean

assembly area.

7.2 Clean Assembly Area

7.2.1 All components of the SME should be assembled

in at least an ISO Class 6 or better (ISO Class 5

preferred) cleanroom.

7.2.2 A set of clean assembly tools should be

maintained in the clean assembly area.

7.2.2.1 If this is not possible, tools should be

vacuumed, blown off with filtered air, and cleaned with

a solution of 10 to 70% IPA diluted in UPW using

wipes and swabs immediately prior to each time they

reenter the clean assembly area.

7.2.2.2 The assembly tools in the clean assembly area

should be cleaned periodically and as needed if they

become contaminated during usage.

7.3 Pre-Packaging

7.3.1 All SME with water (including UPW) or other

liquids should be fully emptied and completely dried

using dry, hydrocarbon-free air or nitrogen.

7.3.1.1 All SME with UPW that comes in direct

contact with the production units (e.g., wafers) should

have lines, baths, tanks, etc. flushed with a bacteria

retardant (e.g., H

solution, iodine/UPW solution)

before emptying them fully.

7.3.2 All utility lines should be capped before and

during shipment.

7.3.3 The SME with vacuum chambers should have

these chambers and vacuum lines sealed and shipped

under vacuum.

7.3.4 The SME should be clearly marked showing

correct lifting points for removal from shipping

container.

SEMI E137-1104 © SEMI 2004 3

7.3.5 Following final assembly and test, all exposed

surfaces should be thoroughly cleaned with a solution

of 10 to 70% IPA diluted in UPW using wipes and

swabs.

7.3.6 The SME should be inspected thoroughly for

cleanliness.

7.3.6.1 The supplier should provide a copy of their

inspection results (e.g., marked checklist) with the

SME.

8 Triple Wrap Strategy

8.1 The following procedures support the strategy of

totally enclosing and sealing the SME, separate

subassemblies, or support components in three layers of

protective wrapping (see Section 9) so that each layer

forms a protective seal against moisture and particles.

8.2 Each individual wrap layer is intended to be

removed at a specific stage of delivery and relocation

(see Section 16) adhering to the following guidelines.

8.2.1 Inner Wrap — This inner wrap should stay with

the SME, separate subassemblies, and components all

the way into the final cleanroom or a staging area of the

same cleanliness level for wipe down. The wrap should

be cleaned prior to movement into the cleanroom.

8.2.2 Middle Wrap — This middle wrap should stay

with the SME, separate subassemblies, and components

until they reach at least an ISO Class 7 intermediate

staging area. The wrap should be cleaned before

leaving the customer’s loading dock/receiving area and

again before it is removed in the staging area.

8.2.3 Outer Wrap — This wrap is used to protect the

SME, separate subassemblies, and components while in

transit to the loading dock. While the SME, separate

subassemblies, and components are on the customer’s

loading dock/receiving area, the outer shipping

materials should be removed. The wrap should also be

cleaned and removed.

9 Packaging Procedures

9.1 Packaging in Clean Assembly Area — The SME,

separate subassemblies, and components should then be

totally enclosed in a clean polyethylene inner wrap

using tape as required.

9.1.1 A humidity indicator should be included inside of

the initial wrapping layer.

9.1.2 If two sets of pallets are used, the inner pallet

should also meet the requirements of Section 10.2 and

should be enclosed with the SME, separate

subassemblies, and components.

9.1.2.1 The inner pallet should be clearly marked

showing correct lifting points for removal from

shipping container.

9.2 Packaging in Dedicated Clean Packaging Area —

After the inner (i.e., first) wrap is applied, the SME,

separate subassemblies, and components should be

relocated to a dedicated clean (ISO Class 7 or better)

packaging area.

9.2.1 SME, separate subassemblies, and components

should then be totally enclosed in two more

independent layers (i.e., middle and outer wraps) of

clean polyethylene film using tape as required.

9.2.2 After the SME, separate subassemblies, and

components are triple wrapped, they should be placed

on a pallet (see Sections 10 and 11) so that the triple

wrapping is not damaged or violated.

9.2.2.1 The pallet should be movable (with SME,

separate subassemblies, and components attached to it)

with a conventional pallet jack or forklift.

9.2.2.2 The SME, separate subassemblies, and

components should be capable of placement on and

removal from the pallet with a conventional pallet jack

or fork lift without compromising or tearing any of the

triple wrapping.

9.3 After placement on the pallet, the SME, separate

subassemblies, and components should be relocated to a

separate crating area.

10 Crating Procedures

10.1 Design

10.1.1 The maximum outside crating dimensions

should be sized not to exceed the maximum size

requirements for method(s) of shipment (e.g., airfreight,

air-ride trailers).

10.1.1.1 Crating shape and dimensions should be

optimized to obtain transportation cost savings, when

possible.

10.1.2 To ensure crate stability in transit, any crate

over 1.2 m (48 in.) tall should be constructed so that the

narrowest other dimension is no less than half the

crate’s height.

10.2 Crating/Packaging Materials

10.2.1 All wood products used should meet the

regulatory requirements (e.g., heat treated wood

regulations) of the country of delivery and any interim

countries that the SME may be transported through.