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SEMI E26.1-92 © SEMI 1992, 2004 1 SEMI E26.1-92 (Withdrawn 1104) RADIAL CLUSTER TOOL FO OTPRINT 300 mm STANDARD This standard was technically appr oved by the Global Physical Interfaces & Carriers Com mittee and is t…
SEMI E26-92 © SEMI 1992, 2004 6
Figure R1-1
Example of Nonradial Cluster Tool Applicability
Figure R1-2
Reach Space and Footprint Restrictions
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SEMI E26.1-92 © SEMI 1992, 2004 1
SEMI E26.1-92 (Withdrawn 1104)
RADIAL CLUSTER TOOL FOOTPRINT 300 mm STANDARD
This standard was technically approved by the Global Physical Interfaces & Carriers Committee and is the
direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition
approved by the North American Regional Standards Committee on August 16, 2004. Initially available at
www.semi.org September 2004; to be published November 2004. Originally published in 1992; last
published June 1999.
Minor editorial changes were made to this document to conform to editorial guidelines.
NOTICE: This document was balloted and approved
for withdrawal in 2004.
1 Introduction
1.1 The standard provides the requirements to extend
the limits of applicability of SEMI E26 from 200 mm
diameter wafers or smaller to 300 mm diameter wafers
or smaller.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the user of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
2 Referenced Documents
2.1 SEMI Documents
SEMI E26 — Radial Cluster Tool Footprint Standard
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
3 Requirements
3.1 Fixed Dimensions — Two of the fixed dimensions
given in SEMI E26 are changed (see Section R1-1):
The fixed distance along the interface plane is increased
from 400.0 mm (15.75 in.) to 500.0 mm (19.69 in.) and
the slant distance separating X2 and X3 (see Section
R1-2) is increased from 270.0 mm (10.63 in.) to 420.0
mm (16.54 in.).
3.2 Variables — The variables given in SEMI E26 are
restated in Table 1 to reflect the increase in fixed
dimensions (see Sections 3.1 and R1-3).
3.3 Restriction on Alpha — The values of alpha are
restricted to 45° 90° (see Section R1-4).
Table 1 Definitions of Module Footprint 300 mm
Variable (Units are in mm)
L
520.0
a
L
2
250.0
cos
2
A
R
360.0
L
2
260.0
cos
2
A
M
457.5
L
2
260.0
cos
2
W
1
640.0sin
2
500.0
W
2
1480.0sin
2
500.0
X
1
320.0 cos
2
X
2
360.0 cos
ec
2
L
2
250.0
cot
2
320.0cos
2
X
3
360.0cos
ec
2
L
2
250.0
cot
2
740.0 cos
2
X
4
457.5cos
ec
2
L
2
250.0
cot
2
740.0 cos
2
SEMI E26.1-92 © SEMI 1992, 2004 2
RELATED INFORMATION 1
NOTE: This related information is not an official part of
SEMI E26.1 but was reapproved for publication by full letter
ballot procedures on February 28, 1999.
R1-1 Interface Plane Reach Dimension
R1-1.1 The 320.0 mm slant distance adjacent to the
interface plane (see Figure 1 in SEMI E26)
accommodates the reach of the human arm and
therefore applies to the 200 mm standard and to the 300
mm standard (see Section 3.1).
R1-2 Large Modules
R1-2.1 Large modules such as batch process modules
can be accommodated in the region of the module
footprint defined by the width W2 (see Figure 1 in
SEMI E26). An increase in the slant distance between
X2 and X3 from 270.0 mm to 420.0 mm leads to an
increase in W2 sufficient to accommodate most large
modules (see Section 3.1).
R1-3 Selected Design Data
R1-3.1 The transport module handler extension is the
distance from the common point (see SEMI E26) to the
wafer transport position (defined in SEMI E22, "Cluster
Tool Module Interface: Transport Module End Effector
Exclusion Volume Standard"). The maximum extension
in millimeters is related to L, alpha, and the transport
maximum reach (specified as 380.0 mm in SEMI
E21.1, "Cluster Tool Module Interface 300 mm:
Mechanical Interface and Wafer Transport Standard")
by:
0.380
2
cot
2
L
R1-3.2 Transport module handler extensions and
module footprint dimensions (calculated from the
expressions in Table 1) for selected values of alpha are
given in Table R1-1. Alpha values corresponding to
values of N for an N-sided regular polygon transport
module are noted (see Section 3.2).
R1-4 Restriction on Alpha
R1-4.1 If < 45˚ (N > 8 for an N-sided regular
polygon transport module), process modules must be
reduced in size or located further from the interface
plane than would be the case for 45˚ 90˚.
Table R1-1 Module Footprint Dimensions and Transport Module Handler Extensions*
α(degrees) a
α
W1(mm) W2(mm) X1(mm) X2(mm) X3(mm) X4(mm) TMHE**(mm)
90 (N=4) 7.1 952.5 1546.5 226.3 725.4 1022.4 1160.3 640.0
84 7.4 928.2 1490.3 237.8 764.7 1076.8 1222.5 668.8
78 7.8 902.8 1431.4 248.7 808.4 1134.8 1289.7 701.1
72 (N=5) 8.1 876.2 1369.9 258.9 857.6 1197.4 1363.3 737.9
66 8.4 848.6 1306.1 268.4 914.0 1266.2 1445.2 780.4
60 (N=6) 8.7 820.0 1240.0 277.1 979.8 1343.5 1538.5 830.3
56 8.8 800.5 1194.8 282.5 1030.6 1401.4 1609.1 869.0
51.428 (N=7) 9.0 777.7 1142.1 288.3 1097.3 1475.7 1700.4 919.9
48 9.1 760.3 1102.0 292.3 1155.0 1538.7 1778.4 964.0
45 (N=8) 9.2 744.9 1066.4 295.6 1212.2 1600.3 1855.0 1007.7
* Calculated for L = 520.0 mm
** Transport Module Handler Extension