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SEMI M25-95 © SEMI 1995, 2003 2 5.5.1 Calibration wa fers must be handle d and stored with great ca re to avoi d contamination a n d dam age. 5.5.2 The bell-s haped peak in the LPD histogram of a calibration wafer which …
SEMI M25-95 © SEMI 1995, 2003 1
SEMI M25-95 (Withdrawn 1103)
SPECIFICATION FOR SILICON WAFERS FOR CALIBRATION OF
LIGHT POINT DEFECT WAFER INSPECTION SYSTEMS WITH
RESPECT TO THE DIAMETER OF POLYSTYRENE LATEX SPHERES
NOTICE: This document was balloted and approved
for withdrawal in 2003.
1 Purpose
1.1 This document describes the specifications to be
met by bare silicon wafers used for calibrating surface
inspection systems with respect to the diameter of
polystyrene latex spheres. This document does not
intend to establish manufacturing procedures for
calibration wafers.
Note 1: This specification might be used as the basis for
making calibration substrates with other materials and/or
surfaces.
2 Scope
2.1 Bare silicon wafers on which latex-spheres of a
known diameter are deposited are used as standards for
the calibration of bare wafer inspection systems. The
response curve of the systems is generated for the
calibration of the systems with respect to the sizing of
polystyrene latex (PSL) spheres, not for counting them.
3 Referenced Documents
3.1 SEMI Standard
SEMI M1 — Specifications for Polished
Monocrystalline Silicon Wafers
4 Terminology
4.1 Light-Point Defect (LPD) — An isolated, localized
effect on the wafer surface or in the substrate wafers
resulting in increased light scattering intensity above a
threshold (unit LSE).
Note 2: LPD is a general term and it includes for example
latex spheres and other localized surface irregularities.
4.2 Latex-Sphere Equivalent (LSE) — The size unit of
an LPD expressed as the diameter of a latex-sphere
which scatters the same amount of light as the LPD.
This is indicated by adding “LSE” to the length unit
used, e.g., 0.2 µ m LSE.
Note 3: Sizing may be different for other materials and shapes
than PSL spheres because of the different optical designs of
inspection systems.
4.3 Response Curve (RC) — The relation between
measured scattered light intensity and latex-sphere
diameters for a calibration surface inspection system.
The RC depends on the light source used and may
contain non-monotonic regions.
4.4 LPD histogram — The distribution of the counts of
LPD’s per unit length over their size as expressed in
LSE.
5 Requirements
5.1 Substrates — The wafers used as substrates for the
deposition of latex-spheres must be bare silicon with a
native oxide surface and they have to meet the
requirements of SEMI M1. In addition to the M1
specification, the surface conditions (for example,
roughness) must be in compliance with Section 5.5.2.
Note 4: The substrate wafer must be measured before latex
sphere deposition with the same type of instrument to ensure
that the conditions of 5.5.2 are fulfilled.
5.2 Latex-Spheres — The latex-spheres used must be
certified with respect to their diameter and they must be
traceable to the Standard Reference Materials (SRM) of
the National Institute of Standards and Technology
(NIST), former National Bureau of Standards (NBS).
The certification methodology must be in accordance
with the technologies used by NIST.
Note 5 : If the PSL are not traceable to NIST, the certification
method should be fully documented.
5.3 Range of Latex-Sphere Diameters — The diameters
of the latex-spheres used for calibration must be
selected so that the measurement range for the intended
application is covered. Sufficient latex-sphere
diameters must be used to achieve the required
accuracy of the RC.
Note 6: For surface inspection systems using laser light
source(s), it is recommended to avoid latex-sphere diameters
corresponding approximately to the wavelength of the laser
used and its multiples of the laser used.
5.4 Density of Latex-Spheres Deposited — The density
of the deposited latex-spheres, full or partial wafer
coverage, must be selected in such a way that the peak
of the histogram of the latex-sphere diameters is at least
100% above the background counts. It has to be
verified that the indicated (relevant) peak in the
histogram is generated by single, isolated latex-spheres
of the specified diameter. A density of 5–15 latex-
spheres per square centimeter is recommended.
5.5 Background Contamination
SEMI M25-95 © SEMI 1995, 2003 2
5.5.1 Calibration wafers must be handled and stored
with great care to avoid contamination and damage.
5.5.2 The bell-shaped peak in the LPD histogram of a
calibration wafer which is generated by the latex-
spheres must be well-defined and must be well above
the background level. The bell-shaped curve has to go
down to less than 50% of its peak value on both sides of
the maximum within a diameter range of ± 15% as
referred to the nominal latex-sphere diameter.
5.6 Multiple Deposition of Latex-Spheres —
Deposition of latex-spheres with different, well-defined
diameters on a calibration wafer is allowed if all the
conditions of this specification are met for each kind of
deposited latex-sphere size.
6 Packaging
6.1 Special packing requirements shall be subject to
agreement between the supplier and the purchaser.
Otherwise all wafers shall be handled, inspected, and
packed in such a manner as to avoid chipping,
scratches, and contamination, and in accordance with
the best industry practices to provide ample protection
against damage during shipment.
7 Data to Accompany Calibration Wafers
7.1 Certificate for average and standard deviation of
the diameter of the latex spheres used, including the
production lot number of latex-spheres used.
7.2 Date of production and certification of calibration
wafer.
7.3 Histogram, as defined above.
7.4 Approximate number of deposited latex-spheres in
a specified area.
7.5 Wafer identification.
7.6 Name and address of the originator of the
calibration wafers.
7.7 LPD’s wafer map.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI M26-0304 © SEMI 1995, 2004 1
SEMI M26-0304
GUIDE FOR THE RE-USE OF 100, 125, 150 AND 200 mm WAFER
SHIPPING BOXES USED TO TRANSPORT WAFERS
This guide was technically approved by the Global Silicon Wafer Committee and is the direct responsibility
of the Japanese Silicon Wafer Committee. Current edition approved by the Japanese Regional Standards
Committee on January 9, 2004. Initially available at www.semi.org February 2004; to be March 2004.
Originally published in 1995; last published in 1996.
1 Purpose
1.1 This document is a guide for box cleaning services,
wafer suppliers, and wafer users for the re-use of 100,
125, 150 and 200 mm wafer shipping boxes.
1.2 Its purpose is to reduce the total cost relating to
transport of 100, 125, 150 and 200 mm wafers from the
wafer supplier to the customers.
2 Scope
2.1 This Guide stipulates materials relating to transport
of 100, 125, 150 and 200 mm wafers using shipping
boxes.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI M31 — Provisional Mechanical Specification for
Front-Opening Shipping Box Used to Transport And
Ship 300 mm Wafers
SEMI M45 — Provisional Specification for 300 mm
Shipping System
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Defintions
4.1.1 bag — a package used for sealing the outside of
the wafer box. Typically two or three types of different
plastic film and aluminum film are laminated, and these
are usually heat-sealed. (SEMI M45)
4.1.2 carrier — an open structure that holds one or
more substrates. (SEMI M31)
4.1.3 label — The label on the wafer shipping box
identifying the product and its manufacturer (see SEMI
M45.)
4.1.4 recycle — to use an already used item for some
other useful purpose. (SEMI M45)
4.1.5 re-use — to repeat use of an item in its original
shape for the same purpose as initially intended. (SEMI
M45)
4.1.6 seam tape — adhesive-coated tape employed to
seal the seam between the cover and the base of a wafer
shipping box.
4.1.7 secondary container — the outermost box of the
smallest transport unit. Typically cardboard boxes or
similar boxes are used. (SEMI M45)
4.1.8 shipping box — a protective container for a
carrier and/or wafer(s) that is used to ship wafers from
the wafer suppliers to their customers. (SEMI M31)
5 Suitability for Re-Use
5.1 The ability to re-use wafer boxes and cassettes is
adversely affected by certain characteristics. Some of
these characteristics also impact on the ability to
recycle.
5.2 Wafer Shipping Box
5.2.1 After a customer has transferred an accepted
wafer to a fab carrier, the wafer shipping box must be
returned to the supplier without having used it for any
other purpose. The wafer shipping box will be inserted
into a bag sealed prior to return to the wafer supplier
using protective bag (agreed upon by supplier and
customer).
5.2.2 The wafer shipping box will maintain its
dimensional stability throughout its useful life.
5.2.3 Wafer shipping box materials will be recyclable
after useful life.
5.2.4 The following characteristics are recommended:
5.2.4.1 generic embossed markings (e.g., model name,
model number, manufacturer' s information),
5.2.4.2 embossed recycle symbol, trademark symbol,
mold markings,
5.2.4.3 removable labels with low residue, low tack
adhesives,