semi合集-English.pdf - 第6229页

SEMI G46-88 © SEMI 1988 6 Heating T i me t H (sec onds) DUT #1 CU (m V/A) DUT#9 CU (m V/A) 1 × 10 -4 43 43 1.5 43 43 24 3 4 3 34 3 4 3 44 3 4 3 64 3 4 3 84 3 4 3 1 × 10 -3 45 45 1.5 45 45 24 7 4 7 34 8 4 8 45 0 5 0 65 1 …

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SEMI G46-88 © SEMI 19885
Figure 2A
Waferforms Associated with Figure 1A
Figure 2B
Waferforms Associated with Figure 2B
Figure 3
Data Results for Initial 15-Piece Sample for tH
Value of 200 ms
SEMI G46-88 © SEMI 1988 6
Heating Time t
H
(seconds)
DUT #1 CU
(m V/A)
DUT#9 CU
(m V/A)
1 × 10
-4
43 43
1.5 43 43
24343
34343
44343
64343
84343
1 × 10
-3
45 45
1.5 45 45
24747
34848
45050
65153
85863
1 × 10
-2
63 70
1.5 75 86
2 85 100
3 100 122
4 112 140
6 130 168
8 145 190
1 × 10
-1
157 208
1.5 179 243
2 195 268
3 220 308
4 239 337
6 265 373
8 285 398
1 × 10
0
300 416
1.5 323 449
2 340 470
3 362 497
4 377 518
6 398 518
8 411 563
1 × 10
1
421 578
Figure 4
Heating Curve Data for Highest and Lowest Reading Devices from Figure 3
SEMI G46-88 © SEMI 19887
Figure 5
Figure 6
Interpretation of Heating Curves of Figure 5
NOTE: Inflection point in curve occurs at approximately t
H
= 400 ms.