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SEMI G69-0996 © SEMI 1996, 2004 12 A1-2.3 Figure A1-2 Dependence of Measurement Results on Sample Size

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11 SEMI G69-0996 © SEMI 1996, 2004
APPENDIX 2
SAMPLE SIZE
NOTICE: The material in this appendix is an official part of SEMI G69 and was approved by full letter ballot
procedures.
A1-2
A1-2.1 Results of adhesive strength measurement made by some companies using the same leadframe material and
molding compound are shown in Figure A2-1. The figures show that apparent adhesive strength decreases with an
increase in adhesive area due to residual stress.
A1-2.2 Sample size in this document was determined in consideration of the effect of residual stress and easiness of
handling for samples.
SEMI G69-0996 © SEMI 1996, 2004 12
A1-2.3
Figure A1-2
Dependence of Measurement Results on Sample Size
13 SEMI G69-0996 © SEMI 1996, 2004
APPENDIX 3
EFFECTIVENESS OF RESIDUAL STRESS SEPARATION IN THREE-
POINT BENDING METHOD
NOTICE: The material in this appendix is an official part of SEMI G69 and was approved by full letter ballot
procedures.
A1-3
A1-3.1 Since the three-point bending method can eliminate the effect of residual stress and also that of stress
distribution on the interface (stress singularity at the adhering edges), the measurement results are almost
independent of sample dimensions (Figure A3-1
2
). This method can evaluate both the true adhesive strength and the
magnitude of residual stress; mainly due to the thermal expansion mismatch between materials, simultaneously
(Figures A3-2 and A3-3
3
).
Figure A3-1
Dependence of Measurement Results on Specimen Dimensions
Figure A3-2
Dependence of Adhesion Strengths on Adherend Material
2 A. Nishimura, I. Hirose, and N. Tanaka, “A New Method for Measuring Adhesion Strength of IC Molding Compounds”, ASME Journal of
Electronic Packaging, Vol. 114, pp. 407-412, 1992
3 A Nishimura amd N. Tanaka, “Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination within
Package”, Advanced in Electronic Packaging, edited by T.R. Hsu et al., ASME, EEP-Vol. 10.2, pp. 765-773, 1995