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SEMI S24-0705 © SEMI 2005 1 SEMI S24-0705 SAFETY GUIDELINE FOR MULT I-EMPLOYER WORK AREAS This specification was technicall y approved by the globa l Environmental Health and Safet y Committee. This edition was approved …

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SEMI S23-0705 © SEMI 2005 13
Example Calculation (idling) for Recipe “X”
Electricity
Mean real power = 4.16E + 1 kW
Heat Input per Year = 4.16E + 1 kW × 2190 hr = 9.11E + 4 kWh (no other heat input sources)
Air Exhaust
Specified source temperature = 18°C Measured average output temperature = 23°C
Mean temperature difference = 5°C Measured exhaust rate = 50 cfm (5.1E + 3 m
3
/hr)
Volume used per year = 5.1E + 3 m
3
/hr × 2190 hr = 1.12E + 7 m
3
Heat Removal per year = (5°C × 1.12E + 7 m
3
× 3.24E 4 kWh/(m
3
°C) = 1.81E + 4 kWh
Cooling Water
Specified ambient temperature = 20°C Measured average output temperature = 22°C
Mean temperature difference = 2°C Measured flow rate = 1 L/m (0.06 m
3
/hr)
Volume used per year = 0.06 m
3
/hr × 2190 hr = 1E + 2 m
3
Heat Removal per year = (2°C × 1E + 2 m
3
× 1.16 kWh/(m
3
°C) = 2E + 2 kWh
Room Heat Burden
9.11E + 4 kWh – 1.81E + 4 kWh – 2E + 2 kWh = 7.28E + 4 kWh
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
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Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
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Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
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consent of SEMI.
SEMI S24-0705 © SEMI 2005 1
SEMI S24-0705
SAFETY GUIDELINE FOR MULTI-EMPLOYER WORK AREAS
This specification was technically approved by the global Environmental Health and Safety Committee. This
edition was approved for publication by the global Audits and Reviews Subcommittee on May 20, 2005. It
was available at www.semi.org in June 2005 and on CD-ROM in July 2005.
1 Purpose
1.1 This safety guideline provides methods to establish safe working environment where personnel of different
companies (entities) share a work area in a fab or where work by employees of one company in one area may
comprise a hazard to employees of another company in an adjacent area.
2 Scope
2.1 Applicability
2.1.1 This Safety Guideline applies to work areas shared by personnel of different companies, such as equipment
suppliers, facility suppliers, user’s contractors and users.
2.1.2 This Safety Guideline applies where work by employees of one company in one work area comprises a hazard
to employees of another company in an adjacent work area.
2.1.3 The work activities to which this safety guideline applies include installation, start-up, de-installation, wafer
size conversion, and overhaul.
2.2 Criteria Established
2.2.1 This guideline establishes criteria for the user’s, supplier’s and contractor’s responsibility for a safe working
environment.
2.2.2 This guideline establishes criteria for the responsibilities of each supplier’s and contractor’s work supervisors.
2.2.3 This guideline establishes criteria for a Safety Supervisors' Communication Council (SSCC) as the
organization to ensure human safety in multi-employer work areas and where work by employees of one company in
one work area comprises a hazard to employee of another company in an adjacent work area.
2.2.4 This guideline establishes criteria for methods of safety patrol with the user's support in multi-employer work
areas and where work by employees of one company in one work area comprises a hazard to employees of another
company in an adjacent work area.
2.2.5 This guideline contains the following sections:
Purpose
Scope
Limitation
Referenced Standards
Terminology
General Concept
User Actions
Work Supervisor
Safety Supervisors’ Communication Council (SSCC)
Safety Patrol
NOTE 1: An example of observation check sheet for the safety patrol is given in the RI 1.
SEMI S24-0705 © SEMI 2005 2
NOTICE: This safety guideline does not purport to address all of the safety issues associated with its use. It is the
responsibility of the users of this safety guideline to establish appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior to use.
3 Limitations
3.1 This safety guideline is not intended to supersede the applicable codes and regulations of the region where the
equipment is used.
4 Referenced Standards and Documents
4.1 SEMI Standards
SEMI S2 Environmental, Health and Safety Guideline for Semiconductor Manufacturing Equipment
SEMI S19 Safety Guideline for Training of Semiconductor Manufacturing Equipment Installation, Maintenance
and Service Personnel
SEMI S21 Safety Guideline for Worker Protection
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
5 Terminology
5.1 Abbreviations and Acronyms
5.1.1 FPD — Flat Panel Display
5.1.2 PPE — Personal Protective Equipment
5.1.3 SSCC — Safety Supervisors’ Communication Council
5.2 Definitions
5.2.1 Definitions in SEMI S2, SEMI S19 and SEMI S21 are incorporated herein by reference, unless the term is
defined within this section.
5.2.2 abnormality — a condition or behavior different from normal or predetermined state that can result in an
incident or accident.
5.2.3 adjacent work area — a work area that shares a common boundary with the work area being considered. The
common boundary may separate the areas horizontally (e.g., the areas are on opposite sides of a wall) or vertically
(e.g., one work area is in a cleanroom and the other in the subfab directly underneath it).
5.2.4 contractor — a company hired to accomplish a contractually specified scope of work, such as constructing a
facility or providing service.
5.2.5 de-installation — the process of disconnecting, disassembling, and moving semiconductor or FPD
manufacturing equipment from its point of installation, including movement of assemblies and further preparation
(e.g., isolating, decontaminating, component disposal) of chemically contaminated semiconductor or FPD
manufacturing equipment for a safe move.
5.2.6 equipment supplier — party who provides equipment to and communicates directly with the user. A supplier
may be a manufacturer, an equipment distributor, or an equipment representative.
5.2.7 fab — a facility in which semiconductor devices or flat panel displays are manufactured.
5.2.8 facility supplier — party who provides a facility or facility service (e.g., nitrogen) to, and directly
communicates with, the user. A facility supplier may be a construction company, a manufacturer or distributor of
facility equipment (e.g., deionization systems), or a facility service provider.
5.2.9
installation — the activities performed after the equipment is received at a user site through preparation for
initial service, including transportation, lifting, uncrating, placement, leveling, and facilities fit up. [SEMI S8]
5.2.10 multi-employer fab — a fab in which employees of more than one company work. The workers may or may
not be present at the same time for a fab to be considered “multi-employer”.