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SEMI E83-1000 © SEMI 1999 , 2000 4 resp ecting a ny mater ials ment ioned herei n. T hese standards are s ubject to change without notice. The user’s attention is called to the possib ility that compliance w it h this st…

SEMI E83-1000 © SEMI 1999, 20003

RELATED INFORMATION 1

APPLICATION NOTES

NOTE: This related information is not an official part of SEMI E83, but was approved for publication by full letter ballot

procedures on July 14, 2000.

R1-1 The intent of this standard is to provide manually

guided 300mm carrier transport PGVs a standard flange

for docking and to facilitate a safe, quick, and

repeatable PGV to load port carrier transfer method or

mechanism. Standardization of features on the flange is

intended to allow for interoperability between PGV

designs and the docking flange.

R1-2 SEMI E64 defines Zone L as an exclusion zone

in SEMI E15.1 compliant tools. It is intended that the

docking flange be mounted in this zone.

R1-3 The docking interface flange includes features to

allow for the following minimum functionality of the

PGV to flange docking procedure:

• Stopping PGV motion

• Guidance of PGV to flange

• x, y & theta alignment of the PGV to the flange

• Locking of PGV to flange

• Docking parallel or perpendicular to the flange

R1-4 The PGV side of the interface may include

additional features to allow for all or some of the

following functionality:

• Compliance to the docking flange

• To dampen impact of docking forces

R1-5 No features on the standard docking flange

provide an adjustable feature to indicate the height

(dimension as H defined by SEMI E15.1) the load port

horizontal datum plane has been adjusted to.

R1-6 It is likely that the alignment error and tolerance

stack up between the docking interface flange and the

equipment load port will not provide sufficient

accuracy alone for accurate pick/placement of a pod

onto the kinematic couplings on the load port.

R1-7 Possible sources of alignment error are:

• Cleanroom floor height and level

• PGV wheels and framework

• Installation accuracy of docking interface flange

• Stability of mounting

R1-8 It may be necessary to use additional alignment

methods to improve accuracy of pod placement onto the

kinematic couplings.

R1-9 It is expected that the interface device be floor

mounted. Thus, the equipment must not require the use

of support pedestals or other support structures under

the floor below Zone L.

R1-10 The docking flange should sustain docking

impact for the lifetime of the flange without any

performance degradation.

• Assume 90kg (200lb) PGV moving at 0.3m/s

(1ft/sec)

• Assume 250,000 docking cycles within a flange

lifetime

• Recommended to design for 3x safety factor for

single docking cycle

R1-11 Flange must be quick remove, replace, align and

calibrate.

R1-12 Surface B' (shown on Figure 2) allows docking

mechanism designs to grab onto the docking flange

without using the docking pin for support.

R1-13 The method of attaching the vertical pin to the

flange is not defined in this standard. Docking flange

designers should be aware of the docking forces

incurred on this pin and design the attachment method

accordingly.

R1-14 The method of attaching the flange to the floor

is not defined in this standard. Docking flange

designers should be aware of the docking forces

incurred on the flange and/or pin and design the

attachment method accordingly.

R1-15 This standard specifies the radii of certain edges

found on the docking flange. It is recommended that

edges that do not have a specified radius are radiused or

broken to eliminate sharp edges.

R1-16 It is left to user to define the needed flange

length (w2×2) at the time of placing an order.

NOTICE:. SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature

SEMI E83-1000 © SEMI 1999, 2000 4

respecting any materials mentioned herein. These

standards are subject to change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E84-0305

SPECIFICATION FOR ENHANCED CARRIER HANDOFF PARALLEL I/O

INTERFACE

This specification was technically approved by the Global Physical Interfaces & Carriers Committee and is

the direct responsibility of the Japanese Physical Interfaces & Carriers Committee. Current edition approved

by the Japanese Regional Standards Committee on November 24, 2004. Initially available at www.semi.org

January 2005; to be published March 2005. Originally published June 1999; last published March 2004.

1 Purpose

1.1 Due to the migration to large wafer sizes, future semiconductor factories will use extensive automated material

handling systems (AMHS) to transfer wafer carriers, including FOUPs and open cassettes, of increasing weight. The

parallel input/output (PI/O) control signals between the production equipment and the AMHS must be better defined

for more reliable and efficient carrier handoffs (load/unload) at production equipment load ports.

1.2 The purpose of this specification is to enhance the capabilities of the parallel I/O interface defined in SEMI E23

in order to support improvements in the reliability and efficiency of carrier transfer. The enhanced capabilities

include continuous handoff, simultaneous handoff, and the capabilities of error detection on the interface.

NOTE 1: The specifications in this document shall be considered independent from the specifications in SEMI E23; therefore,

use of this specification does not require SEMI E23.

2 Scope

2.1 The scope of this specification is limited to communications associated with the material handoff operations

between the active equipment (for example, AMHS equipment including AGV, RGV and OHT) and the passive

equipment (for example, production equipment including process and metrology equipment; stockers, etc). This

scope also extends to interbay AMHS active equipment (i.e., OHS and stockers equipped with transfer devices) and

passive equipment (i.e., OHS and stockers not equipped with transfer devices). This specification defines the

enhanced parallel I/O interface signals used to handoff carriers between the production equipment and the AMHS.

Figures 1 and 2 show examples of types of AMHS equipment.

2.2 This enhanced carrier handoff parallel I/O interface specification includes:

 Signal definition including load port assignment signals (¶6.1),

 Carrier handoff sequence definitions and time diagrams (¶6.2),

 Error indication, detection, and recovery (¶¶6.3 and 6.4),

 Connector type, signal, and pin assignment (¶6.4), and

 Interface sensor unit size to be located at load port defined by SEMI E15.1 (applicable for systems designed to

handle 300 mm wafer carriers).

2.3 The enhanced carrier handoff parallel I/O interface controls the handoff of a carrier to and from the passive

equipment by the active equipment. This parallel I/O interface only controls the automated handoff operation of the

carrier. The handoff is the operation in which a carrier is transferred from one piece of equipment to another. Both

the active and passive equipment manage this operation. The factory level controller (i.e., host) does not manage the

handoff operation. Figure 3 shows applications for the parallel I/O interface specified in this document.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish appropriate safety and health practices and determine the

applicability of regulatory or other limitations prior to use.

3 Limitations

3.1 Data for the material that is transferred (handed off) is managed through the equipment’s factory interface.

Material management by the factory level controller is outside the scope of this document.