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SEMI G41-87 © SEMI 1987 8 NOTICE: T hese standards do n ot purport to address safety issues, if any, ass o ciated with their use. It is the responsibility of t he user of these standards to establish appropriate safety a…

SEMI G41-87 © SEMI 19877

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20 Lead Dual SOIC .300 (Wide)

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24 Lead Dual SOIC .300 (Wide)

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28 Lead Dual SOIC .300 (Wide)

SEMI G41-87 © SEMI 1987 8

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI G42-0996 © SEMI 1986, 2004 1

SEMI G42-0996 (Reapproved 1104)

SPECIFICATION FOR THERMAL TEST BOARD STANDARDIZATION

FOR MEASURING JUNCTION-TO-AMBIENT THERMAL RESISTANCE

OF SEMICONDUCTOR PACKAGES

This specification was technically reapproved by the Global Assembly & Packaging Committee and is the

direct responsibility of the Japanese Packaging Committee. Current edition approved by the Japanese

Regional Standards Committee on July 23, 2004. Initially available at www.semi.org September 2004; to be

published November 2004. Originally published in 1986; previously published September 1996.

1 Purpose

1.1 This document provides the requirements for a

standard thermal resistance test board to be used in

junction- to-ambient thermal resistance measurement of

a semiconductor package under still- and forced-air

condition as a referee method.

2 Scope

2.1 This document describes the thermal resistance test

board for measurement of the following packages:

• Dual-In-Line Packages (DIP),

• Plastic Chip Carrier Package (PCC),

• Quad Flat Package (QFP),

• Pin Grid Array Package (PGA), and

• Ball Grid Array Package (BGA).

2.2 This document uses SI units.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Referenced Standards

3.1 Information regarding the methods for measuring

junction-to-ambient thermal resistance, the proper

design and use of thermal test chips, and material

specifications for printed circuit boards, can be found in

the applicable documents listed below.

3.2 SEMI Standards

SEMI G32 — Guideline for Unencapsulated Thermal

Test Chip

SEMI G38 — Test Method for Still- and Forced-Air

Junction-to-Ambient Thermal Resistance

Measurements of Integrated Circuit Packages

3.3 Military Specifications

MIL-P-13949 — Material Specification for NEMA

Grade G-10 Printed Circuit Board Material

MIL-STD-883C — Method 1012.1, Thermal

Characteristics

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

4 Terminology

4.1 Definitions

4.1.1 junction temperature,T

— in degrees Celsius is

used to denote the temperature of the semiconductor

junction in the microcircuit in which the major part of

the heat is generated. Usually the measured junction

temperature is only indicative of the temperature in the

immediate vicinity of the element used to sense the

temperature.

4.1.2 junction-to-ambient thermal resistance, R

θJA

—

in degrees Celsius/watt is the temperature difference

between the junction and the ambient, divided by the

power dissipation P

4.1.3 power dissipation, P

— in watts is the heating

power applied to the device causing a junction-to-

reference point temperature difference.

4.1.4 temperature sensitive parameter, TSP — is the

temperature dependent electrical characteristic of the

junction under test which can be calibrated with respect

to temperature and subsequently used to detect the

junction temperature of interest.

5 Ordering Information

5.1 The material required for making the thermal test

board can be ordered through any electronic supply

store.

1 United States Military Standards, Available through the Naval

Publications and Forms Center, 5801 Tabor Avenue, Philadelphia,

PA 19120-5099, USA. Telephone: 215.697.3321