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SEMI E30.5-0302 © SEMI 2001, 2002 2 5.1.5 factory automation cont roller, n . — a computer system that prov ides integration of factory shop control and busi ness s ystems with semi cond uctor eq uipme nt. 5.1.6 feature,…

SEMI E30.5-0302 © SEMI 2001, 20021

SEMI E30.5-0302

SPECIFICATION FOR METROLOGY SPECIFIC EQUIPMENT MODEL

This specification was technically approved by the Global Information and Control Committee and is the

direct responsibility of the North American Global Information and Control Committee. Current edition

approved by the North American Information and Control Committee on October 14 and November 27,

2001. Initially available at www.semi.org December 2001; to be published March 2002. Originally

published July 2001.

The complete specification for this product includes all

general requirements of SEMI E30.

1 Purpose

1.1 This document establishes a Specific Equipment

Model (SEM) for Metrology equipment (MSEM). The

MSEM consists of equipment characteristics and

behaviors that are applicable to this class of equipment

and are required to be implemented in addition to the

SEMI E30 fundamental requirements and additional

capabilities.

2 Scope

2.1 The scope of this document is limited to defining

the behavior of Metrology equipment as perceived by a

SEMI Equipment Communications Standard II (SECS

II/SEMI E5) host that complies with the SEMI E30

model. It defines the view of the equipment through the

SECS II link. It does not define the internal operation of

the equipment. It includes a specific processing state

model as the basis for all equipment behavior of this

class.

2.2 This document assumes that the SEMI E30

fundamental requirements and all additional capabilities

except those noted in SEMI E30 Capabilities Section in

this document have been implemented on the MSEM

equipment. This document expands the SEMI E30

Standard requirements and capabilities in the areas of

the processing state model, collection events, Process

Program management, remote commands, data item

variables, and coordinate systems.

2.3 This standard does not purport to address safety

issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

3 Limitations

3.1 The intent of this document is to facilitate the

integration of Metrology equipment into an automated

semiconductor factory. This document accomplishes

this by defining an operational model for Metrology

equipment as viewed by a factory automation

controller. This definition provides a standard host

interface and equipment operational behavior. This

document applies specifically to Metrology equipment

as used in a semiconductor factory environment. It is

possible that this methodology and techniques may

apply to other industries.

3.2 MSEM job parameters that specify material (e.g.,

carrier ID and substrate ID) and material locations (e.g.,

carrier location ID and carrier slot ID) are intended for

metrology equipment for 200 mm and smaller substrate.

4 Referenced Standards

NOTE 1: As listed or revised, all documents cited shall be the

latest publications of adopted standards.

4.1 SEMI Standards

SEMI E5  SEMI Equipment Communications

Standard II (SECS II)

SEMI M20 — Specification for Establishing a Wafer

Coordinate System

SEMI M21  Assigning Addresses to Rectangular

Elements in a Cartesian Array

SEMI E37.1  High Speed Messaging Service

(HSMS-SS) Single Session

SEMI E58  Automated Reliability and Availability

Standard (ARAMS)

5 Terminology

5.1 Definitions

5.1.1 alignment, n. — a procedure in which a

coordinate system is established on a substrate or a

portion of a substrate.

5.1.2 alignment mark, n. — a feature on a substrate

selectively used for alignment.

5.1.3 alignment site, n. — a point within a feature on a

substrate selectively used for alignment.

5.1.4 cleanup, n. — deselection of the current Process

Program and removal of all material to output locations

and any equipment specific activities required to

transition the equipment into the IDLE state.

SEMI E30.5-0302 © SEMI 2001, 2002 2

5.1.5 factory automation controller, n. — a computer

system that provides integration of factory shop control

and business systems with semiconductor equipment.

5.1.6 feature, n. — a distinctive item in a pattern, or a

physical characteristic of the substrate. (e.g., line,

point, a wafer flat).

5.1.7 field, n. — an exposure repeated in a regular

manner on a substrate.

5.1.8 global alignment, n. — procedure which

establishes a coordinate system for the entire substrate

(see alignment). For silicon wafers, this coordinate

system is defined in MSEM as the SEMI M20

coordinate system.

5.1.9 global pattern alignment, n. — a procedure

which establishes a coordinate reference system relative

to repeating features on an entire substrate. For silicon

wafers, this coordinate system is defined in MSEM as

the M20P coordinate system.

5.1.10 logical port, n. — one or more physical input or

input/output ports that are controlled by the same

execution of a Process Program.

5.1.11 M20P, adj. — a designation used for the global

coordinate system defined within MSEM, that is

established relative to a pattern on a silicon wafer.

5.1.12 material, n. — a piece or pieces of substrate,

one or more substrate, a lot, a batch, or a run.

5.1.13 metrology equipment, n. — any equipment that

collects and reports information on specific

predetermined sites or features on a substrate with

consistent data structure, or reports general information

about the entire substrate.

5.1.14 notch, n. — a cut on the edge of a wafer that is

commonly located with respect to a specific crystal

plane that adheres to the SEMI M1 standard.

5.1.15 pattern, n. — the physical features on a

substrate.

5.1.16 pre-align, n. — any alignment done prior to

placing a substrate on a measurement process location.

5.1.17 registration, n. — positioning error between two

features on different layers of a substrate.

5.1.18 safe state, n. — a state in which the equipment

presents no danger to the product or user. This implies

that safety interlocks are in place such that the

equipment can be serviced without harm to the operator

and that the material being processed has been removed

from the processing station into an accessible location.

5.1.19 secondary alignment, n. — a procedure which

improves the accuracy of the coordinate system

mapping on a substrate in a limited area of the

substrate.

5.1.20 site, n. — a single point on a substrate used for

alignment, or the center of an area of the substrate

within which measurements are made.

5.2 Abbreviations and Acronyms

5.2.1 GEM, n. — Generic Equipment Model

5.2.2 SEM, n. — Specific Equipment Model

5.2.3 SEM, n. — Scanning Electron Microscope

5.2.4 TCP/IP, n. — Transmision Communication

Protocol/Internet Protocol.

6 Communication Requirements

6.1 It is required that any MSEM compliant equipment

follow the Communications State Model in SEMI E30.

In addition MSEM compliant equipment shall support

the High Speed Messaging Service (HSMS-SS)

communication Standard, and the SECS-I standard for

sending SECS II messages over TCP/IP or RS232. The

user may determine which of these two lower level

transmission protocols is used in each installation. The

reason for HSMS-SS requirement is the large volume

of data that can be generated by this class of equipment.

7 State Models

7.1 In this section are defined the equipment-specific

processing state model and other state models necessary

to portray the expected operational states of the

equipment to enable host tracking and control in place

of a local operator. See SEMI E30 and Other

References section for additional information on state

charts general rules and utilization.

7.2 Processing State Model Requirements  The

Processing state model is required to be implemented as

defined in the next sections of this document. A state

model consists of the following: state model diagram,

state definitions and a state transition table. A state

model represents the host's view of the equipment, not

necessarily the actual equipment operation. All MSEM

state model transitions shall be mapped sequentially

into the appropriate actual equipment events that satisfy

the requirements of those transitions. In certain

implementations, the equipment may enter a state and

have already satisfied all of the conditions required by

the MSEM state model for transition to another state.

The equipment makes the required transition without

any additional actions in this situation.

7.3 Some equipment may need to include additional

states. Additional states may be added, but shall not

change the MSEM defined state transitions. All

expected transitions between MSEM states must occur.

INIT

IDLE with

Alarms

PROCESSING ACTIVE

IDLEABORTED

SETTING

READY

WORKING

UNLOAD

EXECUTING

STOPPING

ABORTING

ALARM

PAUSED

PAUSE

PROCESS

PAUSED

PROCESS

PAUSING

CHECKING

3233

LOAD

Figure 1

Generic MSEM Processing State Model Diagram