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SEMI D12-95 © SEMI 1995, 2003 1 SEMI D12-95 (Reapproved 0703) SPECIFICATION FOR EDGE CONDIT ION OF FLAT PANEL DISPLAY (FPD) SUBSTRATES This specification was technic ally approved b y the Global Flat Panel Display Commit…

SEMI D11-95 © SEMI 1995, 2003 4

Figure 2

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particular application. The determination of the suitability of the standard is solely the responsibility of the user.

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literature respecting any materials mentioned herein. These standards are subject to change without notice.

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material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights, are entirely their own responsibility.

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SEMI D12-95 © SEMI 1995, 2003 1

SEMI D12-95 (Reapproved 0703)

SPECIFICATION FOR EDGE CONDITION OF FLAT PANEL DISPLAY

(FPD) SUBSTRATES

This specification was technically approved by the Global Flat Panel Display Committee and is the direct

responsibility of the Japanese FPD Materials and Components Committee. Current edition approved by the

Japanese Regional Standards Committee on April 28, 2003. Initially available at www.semi.org June 2003 to

be published July 2003. Originally published in 1995.

1 Purpose

1.1 This document defines various aspects of the edges

of a flat panel display substrate and describes their

relationships. It assumes the existence of terminology

described in other SEMI flat panel display documents.

It applies to substrates whose nominal thickness

specification is 1.1 mm.

2 Scope

2.1 Significance — The edges of a flat panel display

substrate are important in both the specifications for

and uses of the material. They effect the means for

producing, handling, storing, and processing substrates.

Defining the terminology and the geometric properties

of these edges will assist both the producers and users

of substrates and processing/inspection equipment.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Referenced Standards

3.1 SEMI Standards

SEMI D3 — Quality Area Specification for Flat Panel

Display Substrates

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

4 Terminology

4.1 Definitions

4.1.1 corner — of a substrate, any corner other than the

orientation corner.

4.1.2 edge length — of a substrate, the nominal length

of an edge, including that portion at the edge corner(s)

from which material may have been removed for

finishing purposes. It is “… defined by two dimensions

X and Y, with nominal and tolerance values for each.”

4.1.3 orientation convention — a means for denoting

the rotational orientation of a substrate.

4.1.4 orientation corner — the corner of a substrate

which identifies the pattern surface and rotational

orientation.

5 Edge Condition

5.1 All edges shall be treated for purposes of operator

safety and to minimize particulate generation. Edges

shall be chamfered per Figure 1; other edge treatments

are being developed as outlined in Related Information

5.2 Other edge-related parameters shall be per Table 1.

6 Corner Condition

6.1 The orientation corner is asymmetrical for all

substrates, with dimensions per Figure 2.

6.2 The edge condition within all corner areas shall

meet the criteria of Section 5.

Table 1

Parameter Nominal Tolerance

Length < 400 mm

≥ 400 mm

± 0.2 mm

± 0.3 mm

Squareness

≤ ± 1/1000 of longer edge for

chamfered edge

Figure 1

Chamfered Edge

Figure 2

Substrate Corner Dimensions

(shown in 0,0 orientation)

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer' s instructions, product labels,

product data sheets, and other relevant literature,

respecting any materials or equipment mentioned

herein. These standards are subject to change without

notice.

By publication of this standard, Semiconductor

Equipment and Materials International (SEMI) takes no

position respecting the validity of any patent rights or

copyrights asserted in connection with any items

mentioned in this standard. Users of this standard are

expressly advised that determination of any such patent

rights or copyrights, and the risk of infringement of

such rights are entirely their own responsibility.