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SEMI D10-95 © SEMI 1995, 2003 4 NOTE 4: A negative result indi cates loss of material, and positive result indicates m aterial gain. 9.2.3 Method C (Surf ace Haze) 9.2.3.1 Measure total transmitta nce, Tt, and diffuse tr…

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SEMI D10-95 © SEMI 1995, 2003 3
material durable to the test media and conditions. (Wax,
varnish, epoxy resins, adhesive tape, etc., may be used.)
9 Procedure
9.1 Test Specimen Processing
9.1.1 Prepare cylindrical wide-mouthed sealable
vessels, sample holders, etc., made of materials which
do not react with the test medium under the test
conditions. Use a reaction vessel in which the test
specimen, while on the sample holder, is sufficiently
immersed in the required volume of test reagent.
9.1.2 Place the test specimen on the sample holder with
spacing of 1 to 2 cm between the test specimen and
bottom of the empty vessel. When a part of the
specimen is coated by protective material, position the
sample so that its coated portion faces down. The test
specimen may be leaned against the vessel wall if the
test is to be done in relatively brief or slightly corrosive
conditions, or in concentrated, extremely corrosive
media.
9.1.3 Pour the test reagents into the reaction vessel.
Volume of the test medium shall be 5 to 10 ml per cm
2
of specimen surface area. Preheat the test medium to
the specified test temperature.
9.1.4 Place the reaction vessel in the preheated shaker
bath with specified shaking stroke and frequency. Close
the reaction vessel loosely, and expose the specimen at
specified temperature for specified time.
9.1.5 At the completion of specified test time,
immediately remove the reaction vessel from the shaker
bath. Remove the test specimens from the reaction
vessel using soft forceps, and rinse the specimens
immediately by deionized water at appropriate
temperature. When the specimen temperature is high
following this process, rinse the specimens completely
with water of gradually decreasing temperature. Finish
it by deionized water at room temperature. Less caution
is required when the reaction temperature is low. A
synthetic rubber or plastic glove may be used instead of
forceps if sufficient care is taken. In all cases, the
surface of the test specimen shall not be scrubbed.
Never dry the test specimen during this operation.
Generation of cracks or chips due to thermal or
mechanical shocks should be avoided.
9.1.6 For Method B samples, remove coating by
appropriate non-corrosive method, and clean samples
again. In this case, residue from the coating material
should not contaminate the overall test specimen.
9.1.7 Place the test specimens on a clean heat-resistant
sample holder, and dry them at 140 ± 10° C for 30
minutes.
9.1.8 Place the specimens in the desiccator and allow
them to cool to room temperature.
9.2 Measurement Method
9.2.1 Method A (Weight Change)
9.2.1.1 Weigh the test specimen to 0.1 mg or 0.01 mg
as required, using the balance.
9.2.1.2 Calculate the areal weight change with the
following equation.
W
A
=
W
2
–
W
1
A
(2)
where
W
1
= the initial weight of the test specimen in mg,
W
2
= weight of the test specimen in mg after the test,
A = is surface area of test specimen in cm
2
,
as calculated in 8.2, and
W
A
= the areal weight change, in mg• cm
-2
.
NOTE 2: A negative result indicates a real weight loss, and a
positive result indicates a real weight gain.
9.2.1.3 Calculate penetration depth of corrosion, P, of
the test sample by the following equation.
P
=
10
W
A
D
(3)
where
W
A
= the areal weight change in mg• cm
-2
D = the density of the substrate material in mg
•
cm
-3
(see 9.2.1.4) and
P =
p
enetration depth in
µ
m
NOTE 3: A negative result indicates loss of material, and a
positive result indicates material gain.
9.2.1.4 When density of the materials is unknown, use
the value measured by the method described in ASTM
C729.
9.2.2 Method B (Profilometry)
9.2.2.1 Measure the height, H, in µ m, of the step
between the unetched (coated) section and the etched
(uncoated) section by a calibrated surface profilometer.
Trace length shall be between 2 and 4 mm, with the
boundary between the two sections located near the
center of the trace.
Repeat this measurement at least 3 times.
9.2.2.2 Calculate the average penetration depth P:
P =
H
1
+
H
2
+
•
•
•
••+
H
N
N
(4)
SEMI D10-95 © SEMI 1995, 2003 4
NOTE 4: A negative result indicates loss of material, and
positive result indicates material gain.
9.2.3 Method C (Surface Haze)
9.2.3.1 Measure total transmittance, Tt, and diffuse
transmittance, Td, and calculate the haze value from the
following expression:
H =
Td
Tt
× 100 (5)
where
Tt = total transmittance,
Td = diffuse transmittance, and
H = haze value in %.
10 Reporting Results
10.1 Report date and time of test, ambient temperature,
test operator, test conditions (reagent and concentration,
volume of the test medium, test temperature, test time,
stroke length, and frequency of shaking), specimen size
and total surface area, specimen cleaning method, and
the following:
10.1.1 Method A — The areal weight change (W
A
), the
initial weight of the specimen (W
1
), the density of the
substrate material (D), and calculated depth of
corrosion (P).
10.1.1.1 Method B — Penetration depth (P).
10.1.1.2 Method C — The average, maximum and
minimum value of total transmittance (Tt), diffuse
transmittance (Td), and haze value (H).
10.2 Remarks — In a typical test, one specimen is
immersed in an unused medium of specified volume in
a reaction vessel during a specified time. However, as
long as various conditions are described in the report,
even irregular methods may be allowed. Repetitive
usage of a medium may not markedly affect the result
when the test is done in relatively brief or slightly
corrosive conditions, or in concentrated, extremely
corrosive media.
11 Precision and Accuracy
11.1 Interlaboratory evaluation of these test methods is
planned to verify their suitability and reliability. Until
the results are established, use of this test method for
commercial transactions is not recommended unless the
parties to the test establish the degree of correlation that
can be obtained.
11.2 No standards exist against which any bias of this
test method can be evaluated.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer' s instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
SEMI D10-95 © SEMI 1995, 2003 5
RELATED INFORMATION 1
NOTICE: This related information is not an official part of SEMI D10 and is not intended to modify or supercede
the official standard. Publication was authorized by full letter ballot procedures. Determination of the suitability of
the material is solely the responsibility of the user.
NOTICE: This related information does not purport to address all of the safety issues associated with its use. It is
the responsibility of the user of this related information to establish appropriate safety and health practices and
determine the applicability of regulatory limitations prior to use.
R1-1.1 The following chemicals and test conditions are recommended when this test is applied to flat panel display
glass substrates:
Buffered hydrofluoric acid (1:5) 49% HF, 49% NH
4
F, at 40° C for 10 minutes.
Hydrofluoric acid nitric acid (1:5) 49% HF, 70% HNO
3
, at 40° C for 10 minutes.
Hydrochloric acid (diluted) (1:1) 36% HCl, H
2
O, at
50° C for 20 minutes.
Sodium hydroxide solution (10%) at 50° C for 20 minutes.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
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the contents in whole or in part is forbidden without express written
consent of SEMI.