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SEMI G61-94 © SEMI 1994 9 Any pin, lead, h eat sink/stud braze areas where more than 5% of the periph er y is not cov ered by the braze fillet and any voids extend under the brazed ele ment. 7.3.11 M echanical Damage 7.3…

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SEMI G61-94 © SEMI 1994 8
7.2.6.1 Die Attach Areas (includes bare ceramic die
attach areas) — Excluding a 0.015" (0.381 mm) wide
zone around the periphery of the cavity, any foreign
material exceeding 0.001" (0.0254 mm) in height or a
surface dimension of 0.020" (0.508 mm). Acceptable
foreign material shall not cover more than 5% of the die
attach area.
7.2.6.2 Seal Area (includes bare ceramic die attach
areas) — Any foreign material exceeding 0.001"
(0.0254 mm) in height or a surface dimension of 0.020"
(0.508 mm). The seal ring width shall not be reduced by
more than 30% of its width at any point by foreign
material. Acceptable foreign material shall not cover
more than a total of 10% of the seal ring area.
7.2.6.3 Wire Bond Fingers — Any foreign material in
the critical area defined in Figure 8.
7.2.6.4 Solder Pads/Castellations, Contact Pads, and
Heat Exchange Areas — Any foreign material
exceeding 0.001" (0.0254 mm) in height or a surface
dimension of 0.010" (0.254 mm). Acceptable foreign
material shall not cover more than 10% of these areas.
7.3 Pins, Leads, Metal Seal Rings, or Heat Sinks/Studs
NOTE 17: If the heat sink is used as the die attach area, the
following conditions must not violate the criteria in Sections
7.1 and 7.2 for defect size and accumulation.
7.3.1 Plating Voids — Voids, expos ing base material
or underplate, with any dimension exceeding 0.005"
(0.127 mm) or with a total accumulation of more than
5% of the surface area of any pin, lead, heat sink/stud,
or braze. If the total accumulation of voids is less than
5% of the area of an element of a package feature, a
sample of the defective units shall be submitted to Salt
Atmosphere testing per MIL-STD-883, Method 1009,
Condition A. If the sample passes this test, the lot shall
be acceptable
Voids, exposing base material or underplate, in the seal
ring plating violating the criteria of Section 7.2.
7.3.2 Scratches or Scrapes — Any buildup of the
metallization, or exposure of the base material or
underplate, which exceeds 5% of the surface area of
any pin, lead, heat sink/stud, or braze. If the total
accumulation of scratches or scrapes is less than 5% of
the area of an element of the package feature, a sample
of the defective units shall be submitted to salt
atmosphere testing per MIL-STD-883, Method 1009,
Condition A. If the sample passes this test, the lot shall
be acceptable.
7.3.3 Nicks
7.3.3.1 Any nick in pins or leads exce eding 10% of the
diameter or thickness.
7.3.3.2 Any nick in the heat sink/stud which violates
void or pit criteria.
7.3.3.3 Any nicks in the seal ring area which violate
the criteria of Section 7.2.
7.3.4 Pits
7.3.4.1 External Surfaces — Any pit e xceeding 0.005"
(0.127 mm) in depth or 0.010" (0.0254 mm) in a
surface dimension.
Metal seal rings shall have no more than three
acceptable sites, and there must be a minimum
separation of 0.030" (0.762 mm) required between
acceptable sites. The width of the seal ring must not be
reduced by more than 30% of its designed width at any
point. Acceptable pits shall not cover more than 5% of
heat sinks/studs. Acceptable pits shall not cover more
than 25% of pins or leads.
7.3.4.2 Internal Surfaces (Die Attach Areas) — Any
pit exceeding 0.001" (0.0254 mm) in depth and
violating the plating void criteria per Section 7.2.1.1.
7.3.5 Plating Nodules — Any nodul e exceeding the
criteria for burrs in Section 7.3.7.
7.3.6 Foreign Material — Any particulate or film-like
(stain) foreign material exceeding 0.001" (0.025 mm) in
height or an accumulation of sites in excess of 5% of
the surface area of any pin, lead, or heat sink/stud. Any
foreign material reducing the separation between two
active metal areas to less than 50% of the designed
separation.
7.3.7 Burrs — Any burr in excess of 0.002" (0.051
mm) height or 0.005" (0.127 mm) in a major
dimension.
7.3.8 Blistering or Peeling — Any evidence of
blistering or peeling.
NOTE 18: Blistering and peeling on a lead frame tie-bar are
acceptable. Discoloration is not cause for rejection unless a
functional test is affected (e.g., solderability).
7.3.9 Corrosion — Any evidence of corrosion.
7.3.10 Braze
7.3.10.1 Excessive Braze — Any separ ation between
active metal areas which is reduced to less than 50% of
the designed separation.
Any excessive braze which interferes with the intended
use of the package (e.g., excessive braze height which
prevents proper seating of a package).
7.3.10.2 Insufficient Fillet — Pin, lead, heat sink/stud
braze areas where more than 25% of the periphery is
not covered by the braze fillet, provided the voided
areas do not extend under the brazed component.
SEMI G61-94 © SEMI 19949
Any pin, lead, heat sink/stud braze areas where more
than 5% of the periphery is not covered by the braze
fillet and any voids extend under the brazed element.
7.3.11 Mechanical Damage
7.3.11.1 Broken, Kinked, or Missing Pins or Leads
7.3.11.2 Twist — Any pin or lead twist ed by more
than 10° from the untwisted condition.
7.3.11.3 Pin or Lead Sweep — Any location of the tip
of the pin or lead exceeding 0.010" (0.0254 mm) away
from the vertical (or horizontal, for flat packs) datum
passing through the mid-point of the pin or lead at the
point of brazing to the contact pad.
7.3.11.4 Pin or Lead Tweeze — Any location of the
tip of the pin or lead exceeding 0.010" (0.0254 mm)
away from the vertical datum passing through the mid-
point of the pin or lead at the point of brazing to the
contact pad.
7.3.11.5 Threads — Any damage to the threads on
studs.
7.4 Package Construction
7.4.1 Pins and Leads — Location.
7.4.1.1 Pin or Lead Offset — Any offset from the pin
or lead true position exceeding 0.005" (0.127 mm).
7.4.1.2 Lead-to-Lead or Pin-to-Pin Separation — Any
separation exceeding 10% of the designed separation,
up to an allowable maximum of 0.010" (0.254 mm).
7.4.1.3 Side-to-Side Misalignment — Any
misalignment exceeding the limits shown in Table 6.
Table 6
Package Type
Maximum Allowable Side-to-Side
Misalignment inch (mm)
Dual-in-Line 0.010 (0.254)
Flat Packs 0.005 (0.127)
Leaded Chip Carriers 0.005 (0.127)
Pin Grid Arrays 0.005 (0.127)
NOTE 19: During inspection, the combination of offset,
separation, and side-to-side misalignment shall also meet
limits agreed between user and supplier.
7.4.2 Ceramic Layer Misalignment — Any
misalignment between layers exceeding 0.005" (0.127
mm) in either the X or Y planes.
7.4.3 Metallization Alignment to Ceramic — Any
misalignment exceeding the limits defined on the
package drawing.
8 Incoming Inspection and Functional Tests
8.1 Incoming Inspection — Packa ges shall be
inspected in the following sequence.
8.1.1 Dimensional inspection to the requirements of
Section 5. All dimensions shall be measured by
techniques agreed between supplier and customer
except as follows:
8.1.1.1 Seal ring flatness shall be measured per SEMI
G6.
8.1.2 Visual inspection per Section 7.
8.1.3 Metallization — Plating.
8.1.3.1 Thickness — Shall be measured by x-ray
fluorescence per ASTM B 568. The location of the
areas to be measured, which include die and wire bond
and seal ring areas, the tolerance and acceptable
standards shall be agreed between user and supplier.
8.1.3.2 Temperature Resistance — Sh all be evaluated
per SEMI G8.
8.1.3.3 Plating Hardness — Die and wire bond and
seal ring areas — shall be measured per ASTM B 578
to limits defined by MIL-G-45204 if specified by
agreement between vendor and customer.
8.1.3.4 Pin, Lead, Solder Castellation, or Solder Pad
Solderability — Shall be tested per SEMI G35.
8.1.4 Pin, Lead, Seal Ring, or Heat Sink/Stud
Hardness — Shall be measured per ASTM E 18 if
specified by agreement between vendor and customer.
8.1.5 Pin or Lead Integrity — Shall be evaluated per
MIL-STD-883, Method 2004.
NOTE 20: After each test, the plating shall be evaluated for
continuity per SEMI G35.
8.1.5.1 Tension — Per Test Condition A except as
shown in Table 7.
Table 7
Pin/Lead Dimension
inches (mm)
Minimum Tension
lbs (kg)
Round Pin
0.008 (0.203) 1.0 (0.455)
0.018 (0.457) 10.0 (4.55)
Rectangular Lead
0.018 ×=0.010
(0.457=×=0.254)
10.0 (4.55)
8.1.5.2 Fatigue — Per Test Condition B2 if specified
by agreement between user and supplier.
8.1.5.3 Torque — Per Test Condition C1 if specified
by agreement between user and supplier.
SEMI G61-94 © SEMI 1994 10
8.1.5.4 Solder Pad Adhesion — Per Test Condition D
if specified by agreement between vendor and
customer.
8.1.6 Stud Integrity — Shall be evaluated per MIL-
STD-883, Method 2004, Test Condition C2. Torque to
be agreed between user and supplier.
8.1.7 Heat Sink Integrity — Test sha ll be agreed
between user and supplier.
8.2 Functional Testing — The seq uence of functional
testing shall be as shown in Figure 9. (Packages shall be
sequentially subjected to all tests.)
NOTE 21: All procedures used to functionally test the
components shall be agreed between user and supplier.
8.2.1 Die Attach
8.2.1.1 Visual Inspection
Eutectic Bonding — Visually inspect the alloy wet-out
after die attach. The minimum wet-out requirement
shall be 100% of the die perimeter.
Silver Glass, Epoxy, or Polyimide Bonding — 100% die
perimeter coverage shall be required.
NOTE 22: 100% coverage for resin bonding is not a function
of package acceptability but is required to standardize die
testing. The inability of the resins to wet the surface of the die
attach area due to contamination is cause for rejection.
8.2.1.2 Die Shear Test — Perform des tructive testing
per MIL-STD-883, Method 2019.
8.2.1.3 Radiographic Inspection for Voids — Perform
inspection per MIL-STD-883, Method 2012.
8.2.1.4 Ultrasonic Inspection for Voids, Delamination,
and Cracks — Perform inspection per MIL-STD-883,
Method 2030.
NOTE 23: These tests may also be performed after
environmental testing. In the case of very large die, the die
shear test may not be appropriate to fully evaluate the
package. In these cases, die sizes or alternative tests agreed
between user and supplier shall be used. In the case of
eutectic die attach, the results from these tests may also be
indicative of poor functionality of the gold die attach
metallization.
8.2.2 Wire Bond — On wire bonds that meet the
requirements of MIL-STD-883, Method 2010, perform
destructive testing per MIL-STD-883, Method 2011,
Test Condition D. Bonds which cause lifted
metallization from the wire bond fingers or which fail
the pull test criteria shall be cause for package rejection.
NOTE 24: The inspection level A or B, for Method 2010,
shall be agreed between vendor and customer. The pull test
shall be performed at pre-seal and post-seal. The minimum
average pull strength, standard deviation, and acceptable
rupture modes shall be agreed between user and supplier.
8.2.3 Seal
8.2.3.1 Visual Inspection — Criteria shall be agreed
between user and supplier.
8.2.4 Hermeticity — Performed per MIL-STD-883,
Method 1014, Test Condition A or B and C, the
package must maintain hermetic integrity after each
environmental test or sequence of tests.
NOTE 25: Internal water-vapor content may also be measured
per MIL-STD-883, Method 1018.
8.2.5 Environmental Testing — Env ironmental
evaluation shall include, but not be limited to, the
following tests.
NOTE 26: The sequence of testing and the sample sizes for
each sub-group shall be agreed between user and supplier.
Packages with heat sinks or studs require the environmental
tests to be evaluated on an individual basis. The materials,
form factor, and method of attachment may not be suitable for
the tests noted due to the generation of overly severe stresses.
The appropriate tests shall be agreed between user and
supplier.
8.2.5.1 Temperature Cycle — Per MIL-STD-883,
Method 1010, Condition C on packages without a heat
sink or stud, or Condition B for packages with a heat
sink or stud.
8.2.5.2 Thermal Shock — Per MIL-STD-883, Method
1011, Condition C.
8.2.5.3 Vibration Fatigue — Per MIL-STD-883,
Method 2005, Test Condition B for packages without a
heatsink.
8.2.5.4 Mechanical Shock — Per MIL-STD-883,
Method 2002, Test Condition B for packages without a
heatsink.
8.2.5.5 Constant Acceleration — Per MIL-STD-883,
Method 2001, Test Condition A for packages without a
heatsink.
NOTE 27: Y1 axis only for cavity-up packages, Y2 axis only
for cavity-down packages.
8.2.5.6 Additional Testing — Additional tests
performed during package qualification may include
evaluation of electrical and thermal characteristics,
corrosion resistance, and alpha particle emissions.
These tests may be performed on a periodic basis to
maintain package qualification. These tests may
include, but are not limited to, the following.
Insulation Resistance — Per MIL-STD-883, Method
1003, to test conditions agreed between user and
supplier.
Lead Inductance — Per SEMI Test Method G23 or
using an impedance analyzer by a method agreed
between user and supplier.