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SEMI E78-1102 © SEMI 1998,2002 23 RELATED INFORMATION 3 EXAMPLE FOR ADDING ELECTROSTATIC COMPATABILITY REQUIREMENTS TO PURCHASING DOCUMENTS FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT NOTE: This related information is not …

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SEMI E78-1102 © SEMI 1998, 2002 22
R2-3.6 Ionizers in equipment must deliver ionization
over a wide range of humidity and temperature
conditions. Back-end assembly and test areas often do
not have the level of temperature and humidity control
found in front-end wafer production. Ionizers installed
in the cramped spaces of production equipment will be
close to the product, in areas surrounded by grounded
metal parts. Ionizers should isolate the emitter points
from both the product and adjacent grounded surfaces.
Ionizers should produce sufficient ions to discharge
static on surfaces and products moving at high speeds
despite losses to ground. Most ionizers require
maintenance and periodic verification of their
performance.
R2-4 Problem of Controlling Static Charge in
Manufacturing Equipment
R2-4.1 The interior of high speed production
equipment presents a challenge to most static control
methods. The cost of production space is high and
requires that equipment occupying the space be
compact and operate at as high a speed as practical.
Product is moved through small spaces at high speed by
a variety of robotic and other mechanisms. Triboelectric
charging (charge generation due to friction or contact
and separation of dissimilar materials) and contact with
ground are almost unavoidable. Grounding of
equipment parts that contact the product presents added
difficulties when the equipment parts are moving at
high speeds. Dissipating charge from insulating
surfaces and integrated circuit (IC) packages may be
difficult if the charged surfaces are not accessible.
Using ionizers in these confined spaces presents
challenges.
SEMI E78-1102 © SEMI 1998,2002 23
RELATED INFORMATION 3
EXAMPLE FOR ADDING ELECTROSTATIC COMPATABILITY
REQUIREMENTS TO PURCHASING DOCUMENTS FOR
SEMICONDUCTOR MANUFACTURING EQUIPMENT
NOTE: This related information is not an official part of SEMI E78 and is not intended to modify or
supercede the official standard. Determination of the suitability of the material is solely the responsibility of
the user.
R3-1 Purpose
Purchasing semiconductor manufacturing equipment
that meets SEMI E78 Electrostatic Compatibility
requirements can reduce the cost of ownership of the
equipment by reducing operating problems and product
defects, by eliminating costly equipment modifications
after delivery, and by making the equipment available
for use more quickly after delivery.
The purpose of this Related Information 3 is only to
describe an example of specifications for electrostatic
compatibility that are meant to form part of a general
purchasing document for production equipment or
minienvironments.
R3-1.1 Limitations — Related Information 3 is only
one possible example of defining E78 compliance
requirements for equipment. Users may include all, or
any part of it, modifying it as necessary in their
purchase documents. Users are responsible for
determining the appropriate level of static control
protection depending on their specific circumstances.
R3-2 Terminology (Reference: ESD
Association Glossary ADV1.0)
R3-2.1 conductive material — electrostatic conductive
materials have a surface resistance of < 1 × 10
4
Ω or a
surface resistivity of < 1 × 10
5
Ω/square when tested
according to ESD Association ESD STM11.11, or a
volume resistance of < 1 × 10
4
Ω or a volume resistivity
of < 1 × 10
4
Ω-cm when tested according to ESD
Association ANSI/ESD STM11.12. (Other national or
international (IEC) standards may be substituted).
R3-2.2 static dissipative material — electrostatic
dissipative materials have a surface resistance between
1 × 10
4
Ω and < 1 × 10
11
Ω or a surface resistivity of
between 1 × 10
5
Ω/square and < 1 × 10
12
Ω/square
when tested using ESD Association ESD STM11.11, or
a volume resistance of between 1 × 10
4
Ω and < 1 ×
10
11
Ω or volume resistivity between 1 × 10
4
Ω-cm and
< 1 × 10
11
Ω-cm when tested using ESD Association
ESD STM 11.12. (Other national or international (IEC)
standards may be substituted)
R3-3 General Static Control System
Description
R3-3.1 The static control system shall provide
electrostatic charge and ESD control to meet the
recommendations for Level 2 (or 1, 3, or 4 as agreed
upon) contained in SEMI standard E78 Electrostatic
Compatibility: Guide to Assess and Control
Electrostatic Discharge (ESD) and Electrostatic
Attraction (ESA) for Equipment. These
recommendations are defined in Section 12.5 Table 1.
R3-3.2 The static control system shall consist of the
following items, applied as needed to assure
compliance.
R3-3.2.1 Grounding of conductive equipment parts
when feasible.
R3-3.2.2 Static dissipative materials to replace
insulators when feasible.
R3-3.2.3 Ionization sources to control static charge on
process essential insulators or isolated conductors,
particularly when they are part of the product (e.g.,
oxide-coated silicon, epoxy-packaged devices, reticles).
R3-4 General Static Control System Design
Requirements
R3-4.1 Grounding
R3-4.1.1 Conductive equipment parts shall maintain a
resistance to chassis ground or to electrical ground of
less than 1 ohm. (Reference – ESD Association
standards ANSI EOS/ESD S6.1 Grounding --
Recommended Practice and ESD SP10.1 Automated
Handling Equipment. Other national or international
(IEC) standards may be substituted)
R3-4.1.2 In critical applications, as determined by the
user, constant monitoring of equipment grounding shall
be required. In some cases, local electrical safety
regulations may prohibit the use of this method. A
suitable test method to capture short interruptions of
ground connections may need to be used.
R3-4.1.3 Resistance measurements for moving
equipment parts shall be made with the equipment in
operation.
SEMI E78-1102 © SEMI 1998, 2002 24
NOTE 3: Grounding methods to prevent the generation and
accumulation of static charge are not necessarily sufficient for
conduction at high frequencies, or to provide electrical safety.
R3-4.2 Static Dissipative Materials
R3-4.2.1 Insulators shall be replaced with grounded
static dissipative materials when feasible.
R3-4.3 Ionizers
R3-4.3.1 Charge on insulators or isolated conductors in
the product handling path, product, or reticles (if used
by the equipment to produce product) shall be
controlled with ionizers.
R3-4.3.2 Ionizer performance shall be measured using
ESD Association standard ANSI ESD STM3.1
Ionization. (Other national or international [IEC]
standards may be used.)
R3-4.4 Cleanroom Compatibility
If equipment or materials are to be installed in a
cleanroom, all static control system components shall
demonstrate compatibility with cleanroom class
requirements.
NOTE 4: The user may need to define cleanroom
compatibility requirements for static control materials here
(such as, particle shedding, outgassing, and chemical
compatibility) if such requirements are not defined elsewhere
in the purchasing document. (Reference ESD TR11-01 −
Electrostatic Guidelines and Considerations for Cleanrooms
and Clean Manufacturing)
R3-5 Compliance Testing
R3-5.1 Compliance testing shall be done by:
a) a capable independent third party, or
b) the equipment manufacturer, or
c) the end user
to demonstrate that the equipment meets the
recommendations for Level 2 (or 1, 3, or 4 as agreed
upon) contained in SEMI standard E78.
R3-5.2 Acceptance testing of the static control system
performance shall be performed at the actual
equipment use location.
R3-6 Referenced Standards
(The following ESD Association Standards and
Advisories
4
are referenced above. The may be other
equivalent national or international standards covering
these areas.)
ESD ADV1.0 — Glossary of Terms
4 ESD Association, 7900 Turin Road, Rome, NY 13440 USA.
ANSI ESD STM3.1 — Ionization
ANSI/ESD S6.1 — Grounding – Recommended
Practice
ESD SP10.1 — Automated Handling Equipment
ESD STM11.11 — Surface Resistance Measurement of
Static Dissipative Planar Materials
ANSI/ESD STM11.12 — Volume Resistance
Measurement of Static Dissipative Planar Materials
ESD TR11-01 — Electrostatic Guidelines and
Considerations for Cleanrooms and Clean
Manufacturing
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
the contents in whole or in part is forbidden without express written
consent of SEMI.