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SEMI E106-1104 © SEMI 2000, 2004 11 RELATED INFORMATION 1 NOTICE : This related information is not an official part of SEMI E106 and is not meant to modify or supersed e it in any way. Rather , these notes are prov ided …

SEMI E106-1104 © SEMI 2000, 2004 10

I300I Guidelines on 300 mm Process Tool Mechanical Interfaces for Wafer Lot Delivery, Buffering, and Loading

Integrated Minienvironment Design Best Practices

SEMI E106-1104 © SEMI 2000, 2004 11

RELATED INFORMATION 1

NOTICE: This related information is not an official part of SEMI E106 and is not meant to modify or supersede it

in any way. Rather, these notes are provided primarily as a source of information to aid in the application of the

standard. As such, they are to be considered as reference material only. The standard should be referred to in all

cases.

R1-1 Standards Endorsed by Users — Section 8 lists documents in which the members of I300I and/or J300E have

endorsed SEMI 300 mm standards or have specified methods for testing compliance with those standards.

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacture's instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

By publications of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E108-0301 © SEMI 20011

SEMI E108-0301

TEST METHOD FOR THE ASSESSMENT OF OUTGASSING ORGANIC

CONTAMINATION FROM MINIENVIRONMENTS USING GAS

CHROMATOGRAPHY/MASS SPECTROSCOPY

This test method was technically approved by the Global Metrics Committee and is the direct responsibility

of the European Equipment Automation Committee. Current edition approved by the European Regional

Standards Committee on December 20, 2000. Initially available at www.semi.org February 2001; to be

published March 2001.

1 Purpose

1.1 The purpose of this standard is to define a test

method for the determination of the outgassing organic

contamination from minienvironments used for storage

and transport of wafers using gas chromatography/mass

spectroscopy (GC/MS).

1.2 This test method is intended as an alternative to

SEMI E46. The main difference between SEMI E46

and this document is that SEMI E46 defines a test

method which is based on ion mobility spectroscopy

(IMS) as the measurement technique while this

standard is based on gas chromatography/mass

spectroscopy in combination with thermal desorption.

Additionally, this test method provides a procedure for

testing the outgassing of organic compounds in a

complete minienvironment. The results of SEMI E46

and this document are given in different units.

2 Scope

2.1 The test method provided in th is document is

applicable to the assessment of the outgassing of

organic contamination from minienvironments.

2.2 Gas chromatography/mass spe ctroscopy is chosen

as the method to determine organic contamination

because it is commonly used for characterization and

quantification of organic compounds. In combination

with thermal desorption, it provides a method for the

identification of organic compounds in the atmosphere

(i.e., inside the minienvironment) as well as directly

from source materials, and transferred contaminants.

This method can also be used to evaluate materials and

processes used in semiconductor industry.

2.3 This test method is based on ASTM F1982.

2.4 This standard does not purport to address safety

issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety health practices and determine the

applicability or regulatory limitations prior to use.

3 Limitations

3.1 The test methodologies, metric s and applications

provided in this standard are limited by the following

constraints:

3.1.1 The specific recovery of comp ounds by the

proposed standard method strongly depends on the

setup of the apparatus used. This has been taken into

account by the use of the “reference-cocktail”, see

Section 9.2.

3.2 Identification of the source of organic compounds

inside the minienvironment is out of the scope of this

test method. For a procedure for the analysis of

outgassing organic compounds from individual

materials using gas chromatography/mass spectroscopy,

see IDEMA M11-99.

3.3 This test method does not prov ide a procedure how

to use the obtained data for assessing the risks that

come from individual compounds.

4 Referenced Standards

4.1 SEMI Standards

SEMI E46 — Test Method for the Determination of

Organic Contamination from Minienvironments

SEMI F21 — Classification of Airborne Molecular

Contaminant Levels in Clean Environments

4.2 ASTM Standard

ASTM F1982 — Standard Test Methods for Analyzing

Organic Contaminants on Silicon Wafer Surfaces by

Thermal Desorption Gas Chromatography.

4.3 IDEMA Standard

IDEMA M11-99 — General Outgas Test Procedure by

Dynamic Headspace Analysis

1 American Society for Testing and Materials, 100 Barr Harbor

Drive, West Conshohocken, PA 19428-2959, website: www.astm.org

2 International Disk Drive Equipment and Materials Association,

3255 Scott Blvd., Suite 2-102, Santa Clara, CA 95054-3013, website: