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SEMI E91-0600 © SEMI 1999 , 2000 2 4.8 job — a lot, proces sed with a s i n gle process program o n PSEM equ ip m ent. 4.9 l oad — move material to the p r o b ing or marking location from the cassette. 4.10 lot — a g ro…

SEMI E91-0600 © SEMI 1999, 20001

SEMI E91-0600

SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL

(PSEM)

This specification was technically approved by the Global Information & Control Committee and is the direct

responsibility of the Japanese Communications Committee. Current edition approved by the Japanese

Regional Standards Committee on January 14, 2000. Initially available at www.semi.org March 2000; to be

published June 2000. Originally published September 1999.

1 Purpose

1.1 This document establishes a S pecific Equipment

Model for prober equipment (PSEM). The PSEM

consists of equipment characteristics and behaviors that

apply to this class of equipment and are required to be

implemented in addition to the fundamental

requirements and additional capabilities specified in

SEMI E30 (GEM). The intent of this document is to

facilitate the integration of prober equipment into an

automated semiconductor factory. This document

accomplishes this by defining an operational model for

prober equipment as viewed by a factory automation

controller. This definition provides a standard host

interface and equipment operational behavior.

2 Scope

2.1 The scope of this document is limited to the

definition of prober equipment behavior as perceived

by a Semiconductor Equipment Communications

Standard (SECS-II) (SEMI E5) host that complies with

GEM. The document defines the view of the equipment

through the SECS communications link, but does not

define the internal operation of the equipment. It

includes a specific processing state model as the basis

for the behavior of all equipment of this class.

2.2 This document requires that th e GEM fundamental

requirements and applicable additional capabilities have

been implemented on the prober equipment. This

document expands GEM Standard requirements and

capabilities in the areas of the processing state model,

collection events, remote commands, data item

variables and process program management, and adds

Prober Job state model to GEM Standard requirements

and capabilities. This document does not include the

definition of the treatment of Multiple Stage.

2.3 This document applies to the class of prober

equipment in which the wafer is unloaded from the

same slot in the same carrier which loaded the wafer

after processing.

2.4 This standard does not purport to address safety

issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

3 Referenced Standards

3.1 SEMI Standards

SEMI E5 — SEMI Equipment Communications

Standard 2 Message Content (SECS-II)

SEMI E30 — Generic Model for Communications and

Control of Manufacturing Equipment (GEM)

SEMI M20 ― Specification for Establishing a Wafer

Coordinate System

SEMI M21 ― Specification for Assigning Addresses to

Rectangular Elements in a Cartesian Array

3.2 Other Documents

Harel, D., “Statechart: A Visual Formalism for

Complex Systems”, Science of Computer Programming

8 (1987) 231-274.

NOTE 1: As listed or revised, all documents cited shall be the

latest publications of adopted standards.

4 Terminology

4.1 alignment — a procedure in which a coordinate

system is established on a substrate.

4.2 bin — categorized data of die as a result of

measurement.

4.3 cassette — a physical object containing one or

more substrate locations (see slot). For example, a

SEMI standard cassette is a carrier with 25 substrate

slot locations.

4.4 die — 1. A field sub-unit. 2. An area of substrate

that contains the device being manufactured.

4.5 execution area — the area from which a current

copy of the process program instructions are executed.

4.6 inker — a resource of the prober. The

electromechanical units to put ink mark on die.

4.7 instruction data — the Result Data to refer on the

inspection process.

1 Elsevier Science, P.O. Box 945, New York, NY 10159-0945,

http://www.elsevier.nl/homepage/browse.htt

SEMI E91-0600 © SEMI 1999, 2000 2

4.8 job — a lot, processed with a s ingle process

program on PSEM equipment.

4.9 load — move material to the p robing or marking

location from the cassette.

4.10 lot — a group of one or more s ubstrates of the

same type (e.g., wafers, masks, CDs).

4.11 map — a list of coordinate positions of die on a

substrate. MAP is defined in accordance with SEMI

M21 in this document.

4.12 map data — the categorized d ata of die as a

result of measurement associated with coordinates.

Map data also have an information that identifies origin

die.

4.13 marking — the process of the prober that making

an ink mark on a die using the inker.

4.14 material — 1. The basic unit o f process,

physically a cassette or some cassettes. 2. A lot.

4.15 measurement — making a test , contacting the

probe card and the die. The tester sends to the prober a

categorized data as a result of test.

4.16 probe card — the electromech anical interface

necessary to enable temporary electrical contact

between the substrate to be tested and the tester

resource. May consist of multiple components.

4.17 re-inspection — a process whe re the same

substrate is tested again by using the inspected map

data.

4.18 slot — a physical location with in a cassette

capable of containing a substrate. (Also referred to as a

carrier location).

4.19 state — 1. A static set of cond itions. If the

conditions are met, the state is current (SEMI E30). 2.

A state reacts predictably to specific stimuli.

4.20 substrate — 1. The basic unit of material,

processed by PSEM equipment such as wafers.

4.21 testing equipment — an equipment class

generally consisting of integrated mechanisms and

controls for performing electrical tests of packaged

devices and or wafer die during the manufacturing

process.

4.22 unload — remove materials to the cassette slots

from the probing or marking location.

4.23 wafer end — the end of measuring process of a

wafer.

5 State Model

5.1 The purpose is to define the eq uipment-specific

processing state model and Prober Job state models

necessary to portray the expected operational states of

the equipment to enable host tracking and control in

place of a local operator.

5.1.1 The processing state models in this document are

required for implementing an PSEM-compliant prober,

in addition to the required state models in SEMI E30. A

state model consists of a state model diagram, state

definitions, and a state transitions’ table. A state model

represents the host’s view of the prober, but not

necessarily the actual prober operations. All PSEM

state model transitions shall be mapped sequentially

into the actual equipment events that satisfy the

requirements of those transitions. In certain

implementations, the prober may enter a state and has

already satisfied all of the conditions required by the

PSEM state model for transition to another state. In this

situation, the prober makes the required transition

without any additional actions.

5.1.1.1 Various symbols used in a state diagram are

described in Figure 1.

a) State

b) Transition

c) Default Entry Point

d) History

e) Conditional Selector

f) Terminator

Figure 1

Various Symbols Used in a State Diagram

5.1.2 Some equipment may need to include additional

states. However, any additional states must not change

the PSEM-defined state transitions. All expected

transitions between PSEM states must occur.

5.2 PSEM Processing State Model

5.2.1 Purpose

5.2.1.1 The purpose of the PSEM Processing State

Model is to make an accurate model for the behavior of

the PSEM prober from Processing State Model defined

in SEMI E30.

5.2.2 PSEM Processing State Model Diagram

INIT

IDLE with

Alarms

IDLE

EXECUTING

(PROBING)

MAINTENANCE

ABORTING

CHECKING

PAUSED

SETTING UP

PAUSING

PAUSED

ALARM PAUSED

STOPPING

PROCESS PAUSE

PAUSE

PROCESSING ACTIVE

PROCESS

SETTING UP

Figure 2

PSEM Processing State Model Diagram