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SEMI D12-95 © SEMI 1995, 2003 3 RELATED INFORMATION 1 NOTICE : This rela ted inform ation is not an official part of SEM I D12 and is not intended to m odify or supercede the official standa rd. Rather, this note describ…

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SEMI D12-95 © SEMI 1995, 2003 2
Figure 2
Substrate Corner Dimensions
(shown in 0,0 orientation)
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer' s instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
SEMI D12-95 © SEMI 1995, 2003 3
RELATED INFORMATION 1
NOTICE: This related information is not an official part of SEMI D12 and is not intended to modify or supercede
the official standard. Rather, this note describes methods for producing FPD substrate edges which may be under
development. Publication was authorized by full letter ballot procedures.
R1-1 Current Practice
R1-1.1 The edges of FPD substrates are modified
during the substrate manufacturing process so that, in
subsequent panel processing, operator safety is
improved and particulate generation is minimized.
Currently, a “chamfered edge” process is in general use.
This modifies the two “corners” of each edge as shown
in Figure 1.
R1-2 Future Developments
R1-2.1 Other edge treatments may prove more
efficient, and several alternate approaches are under
development. Two of these are a “Radiused Edge” and
“Rounded Edge,” shown in Figures R1-1 and R1-2. The
radiused edge initially appears simple, but appropriate
values of R, for various substrate thicknesses (T), are
being examined for manufacturability. For cases where
R > T, the proper “edge blend,” where R intercepts the
substrate pattern and back surfaces, may prove difficult
to define and control.
Figure R1-1
Radiused Edge
Figure R1-2
Rounded Edge
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
the contents in whole or in part is forbidden without express written
consent of SEMI.
1 SEMI D13-1101 © SEMI 1995, 2001
SEMI D13-1101
TERMINOLOGY FOR FPD COLOR FILTER ASSEMBLIES
These specifications were technically approved by the Committee and are the direct responsibility of the
Japanese FPD Materials and Components Committee. Current edition approved by the Japanese Regional
Standards Committee on April 19, 2001. Initially available at www.semi.org August 2001; to be published
November 2001. This document was originally published in 1995.
1 Purpose
1.1 These terms and definitions describe various
elements and characteristics of FPD color filter (CF)
assemblies. They are intended to assist in future CF
standardization activity.
2 Scope
2.1 Color filters comprise the front plate assembly in a
colored flat panel display. They consist of a number of
material layers such as glass substrate, color filter layer,
black matrix, overcoat layer, and Indium Tin Oxide
(ITO) films. Each of these layers has various properties
which may need to be specified, produced, controlled,
and characterized. This document provides an overview
of these layers, with terms and definitions for selected
elements, and indicates the appearance of some color
filter defects. This document may be useful in
developing material specifications, inspection criteria,
and test methods.
2.2 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the user of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
3 Limitations
3.1 This document does not contain detailed
measuring and test methods. Such methods may be
developed separately, and references to them may be
incorporated into color filter specification documents
where appropriate. The assembly of color filters into a
flat panel display assembly is not covered herein.
4 Related Standards
4.1 SEMI Standards
SEMI D3 — Quality Area Specification for Flat Panel
Display Substrates
SEMI D20 Defect Terminology for Flat Panel
Display Masks
SEMI D21 Terminology for Flat Panel Display
Masks
SEMI M21 — Specification for Assigning Addresses to
Rectangular Elements in a Cartesian Array
5 Color Filter Elements (see Figure 1)
5.1 alignment control projection
a rib-shaped
protrusion created within the display pixel on the color
filter film surface for the purpose of controlling
alignment direction of the liquid crystal.
5.2 backside ITO film
a thin film of Indium Tin
Oxide formed on the glass surface on the back of the
color filter substrate.
5.3 black matrix (BM) — layer which blocks light
transmission. It provides a boundary between color
filter pixels, preventing the transmitting light between
adjacent pixels.
5.4 color filter layer — colored layer through which
light is transmitted. It is deposited in three colors—red,
green, and blue—which are patterned to produce an
array of contiguous, rectangular, or square-shaped
pixels.
5.5 glass substrate — the base material onto which
black matrix and color filter layer are deposited. Also
called the Front Plate. After assembly into a Display, its
back surface faces the observer. See SEMI D3 and
SEMI D21 for parameters, definitions, and dimensional
specifications.
5.6 ITO Film — a thin film of Indium Tin Oxide.
5.7 overcoat layer — transparent material deposited
over the color filter material. This provides a smooth
surface and enough adhesion for subsequent ITO
material deposition.
5.8 post spacer
a fixed pillar-shaped spacer formed
outside of the pixel opening.
5.9 reflective film
a light-reflective layer created on
the color filter substrate below the color filter layer.
6 Color Filter Pixel (RGB) La yout
6.1 The color filter pixels are arranged in one of
several array patterns. The array is constructed from m
vertical columns and n horizontal rows of identical
pixels of dimensions a horizontally and b vertically.
The number of pixels in different rows and columns