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SEMI G58-94 © SEMI 1994 4 7.3.3 Voids — 0.0 05" (0 .127 mm) m a x i m um allowable dimension with no more than four allo w ed and a m inimum separati o n of 0.030" ( 0.762 mm ) between site s. 7.4 L eadframe 7.…

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SEMI G58-94 © SEMI 19943
6.4.2 Finish — Lead bond areas.
6.4.2.1 Metallization — Aluminum.
6.4.2.1.1 Thickness — 100 – 600 microinches (0.0025
– 0.015 mm).
6.4.2.1.2 Coverage — Total coverage for a distance of
0.030" (0.762mm) minimum as measured from the lead
tip. Maximum length is defined by the lead bond cavity
size.
6.4.2.1.3 Composition — 99.4% minimum for clad
aluminum, 99.99% minimum for vapor deposited
aluminum.
6.4.2.2 Metallization — Gold.
6.4.2.2.1 Thickness — 50 – 225 microinches (0.0013 –
0.0057mm).
6.4.2.2.2 Coverage — See paragraph 6.4.2.1.2.
6.4.2.2.3 Composition — See SEMI G21 and MIL-G-
45204.
6.4.3 Leadframe Finish — External areas (if
specified).
6.4.3.1 Metallization — Gold (see Section 6.4.2.2).
7 Defect Limits
The following defects shall be rejected if the limits
shown are exceeded:
NOTE 3: The criteria apply to purchased pre-assemblies or,
where applicable, to units assembled by the customer to
process conditions agreed between vendor and customer.
7.1 Ceramic Components
7.1.1 Cracks — Not allowed.
7.1.2 Chips — See Figures 1 and 2.
7.1.2.1 Corner Chips — 0.030" (0.762 mm) × 0.030"
(0.762 mm) × 25% of package element thickness.
7.1.2.2 Edge Chips — 0.060" (1.524 mm) × 0.030"
(0.762 mm) × 25% of package element thickness.
7.1.2.3 Critical Seal Area — Chips must not reduce
the critical seal path length, at any point, to less than
one-half the nominal design dimension. No more than
four chips are allowed in this area regardless of loss of
seal length.
7.1.3 Burrs, Projections (Fins), and Blisters
7.1.3.1 Base, Window Frame, and Cap — 0.005"
(0.127 mm) maximum allowable dimension or greater
than 0.003" (0.076 mm) height.
7.1.3.2 Die Attach Surface — 0.001" (0.025 mm)
maximum above the metallization surface excluding a
zone, 0.010" (0.25 mm) wide, around the periphery of
the cavity maximum allowable dimension is 0.005"
(0.127 mm).
7.1.4 Camber — Shall be specified on the component
drawing.
7.2 Glass Sealant
7.2.1 Chips and Voids — 0.010" (0.254 mm)
maximum allowable dimension, with exposed or
covered ceramic. No more than four chips or voids are
allowed in the critical seal area. These defects must also
meet the requirements of Table 1 in Section 7.2.2.4.
7.2.2 Glass Misalignment (after glass flow) — See
Figure 3.
7.2.2.1 Glass Overhang — 0.15" (0.381 mm)
maximum extension from the ceramic edge.
7.2.2.2 External Rundown — 50% of component
thickness maximum.
7.2.2.3 Rundown into Lead Bond Cavity — 0.010"
(0.254 mm) maximum extension from the top surface
of the cavity.
7.2.2.4 Pullback — See Table 1.
Table 1 Maximum Allowable Pullback
External 0.015" (0.381 mm)
Internal 0.101" (0.254 mm)
NOTE 3: Glass pullback, at any point, shall not reduce the
critical seal path width to less than one-half the designed
width. (See Figure 2.)
7.2.2.5 Foreign Material — 0.020" (0.508 mm)
maximum allowable dimension but 0.010" (0.254 mm)
in the critical seal area, with no more than four sites
allowed and a minimum separation of 0.030" (0.762
mm) between sites.
7.3 Die Attach Cavity Metallization — Excluding a
0.010" (0.254 mm) wide zone around the periphery of
the cavity, the following criteria apply:
7.3.1 Foreign Material, including Glass Splatters —
no more than four areas with 0.005" (0.13 mm)
maximum dimension or greater than 0.001" (0.025 mm)
height.
7.3.2 Metallization Lumps — No more than four
allowed. If the metallization is Gold and eutectic Gold-
Silicon die attach is to be used, then the lumps may not
exceed 0.010" (0.254 mm) in diameter and 0.005"
(0.127 mm) height. If eutectic bonding is not used, then
the lumps will be treated as foreign material per Section
7.3.1
SEMI G58-94 © SEMI 1994 4
7.3.3 Voids — 0.005" (0.127 mm) maximum
allowable dimension with no more than four allowed
and a minimum separation of 0.030" (0.762 mm)
between sites.
7.4 Leadframe
7.4.1 Lead Bond Areas — the minimum lead bond
area on the lead tip is defined in Figure 4.
In these bond areas, the following defects are not
allowed:
7.4.1.1 Voids or Pits — Exposure of base material
with any dimension larger than 0.001" (0.0254 mm).
7.4.1.2 Discoloration, Blistering, or Peeling of the
Metallization
7.4.1.3 Scratches or Scrapes — Any build-up of the
metallization, or exposure of the base material.
7.4.1.4 Foreign Material including Glass Splatter or
Projections — No more than four sites, each with a
maximum dimension of 0.001" (0.0254 mm).
7.4.1.5 Glass Wetting or Cracking — Any lead finger
which is not firmly embedded in the glass.
7.4.1.6 Glass Pullback from the Lead Tip — Greater
than 0.010" (0.254 mm).
7.4.1.7 Glass Bulge between Lead Fingers — Greater
than 0.005" (0.127 mm) height above the fingers except
as agreed between vendor and customer for narrow
pitch leads where this limit may cause wire bond
interference problems.
7.4.1.8 Lead Tip Coplanarity (Pre-assembled Bases,
Leadframes, and Window Frames) — Greater than
0.006" (0.15 mm) difference in the position of the top
surface of the lead from highest lead to lowest lead.
7.4.1.9 Lead Tip Pitch — Greater than ± 0.002" (0.051
mm) variation from true position.
7.4.2 I nternal Lead Areas, excluding Lead Bond Areas
— In these areas, the following defects are not allowed:
7.4.2.1 Burrs and Projections or Pits — With a
maximum dimension greater than 0.002" (0.0508 mm)
in height or depth.
7.4.2.2 Foreign Material (including Plating
Discoloration) — With a major dimension in the
surface plane greater than 0.015" (0.381 mm) or
exceeding 0.002" (0.0508 mm) in height.
7.4.2.3 Voids which Expose Base Metal — With a
major dimension greater than 0.002" (0.0508 mm).
7.4.2.4 Blistering or Peeling of Metallization
7.4.2.5 Scratches and scrapes which cause metal build-
up or expose base material.
7.4.3 External Lead Areas
NOTE 4: Non-functional areas of the leadframe, such as tie-
bars, shall not be subjected to inspection.
7.4.3.1 Unplated Leads
NOTE 5: Plated leads shall also be required to pass these
criteria.
7.4.3.1.1 Scratches — Causing loss of more than 25%
of the leadframe thickness.
7.4.3.1.2 Voids — In violation of Section 7.4.3.1.1 or
loss of more than 10% of the design width of a
leadframe detail.
7.4.3.1.3 Burrs — In excess of 0.002" (0.051 mm) in
height and 0.005" (0.127 mm) in the major dimension.
7.4.3.2 Plated Leads
7.4.3.2.1 Scratches and Scrapes — Exposure of base
material or loss of plating integrity over 5% of the area
of a lead finger.
7.4.3.2.2 Voids — Exposure of base material.
7.4.3.2.3 Blistering or Peeling
7.4.3.2.4 Staining, Foreign Material, or
Contamination — In excess of 5% of the area of a lead
finger.
7.4.4 Lead Assembly
7.4.4.1 Lead Tip Overhang — 0.010" (0.254 mm)
maximum from the cavity wall, see Figure 5.
7.4.4.2 Lead Misalignment — 0.010" (0.254 mm)
maximum, see Figure 6.
7.4.5 Window Assembly Misalignme nt — 0.015"
(0.381 mm) maximum, see Figure 7.
8 Incoming Inspection and Functional Tests
8.1 Incoming Inspection
8.1.1 Dimensional inspection per Section 6.
8.1.2 Visual inspection per Section 7 at 10×
magnification with vertical lighting.
8.1.3 Metallization
8.1.3.1 Die Attach Metallization — Thickness shall be
measured by standard cross-sectioning without
smearing or by X-Ray fluorescence.
8.1.3.2 Lead Bond Metallization — Thickness shall be
measured by X-ray fluorescence.
SEMI G58-94 © SEMI 19945
8.1.3.3 External Lead Plating (if applicable)
8.1.3.3.1 Thickness — Shall be measured by X-ray
fluorescence.
8.1.3.3.2 Solderability — Shall be tested per MIL-
STD-883, Method 2003.
8.2 Functional Testing
NOTE 6: All procedures used to functionally test the
components shall be agreed between user and supplier.
The sequence of functional testing shall be as shown in
Figure 8.
8.2.1 Die Attach
8.2.1.1 Visual Inspection
Eutectic Bonding — Visually inspect the alloy wet-out
after die attach. The minimum wet-out requirement
shall be 100% of the die perimeter.
Silver Glass, Epoxy, or Polyimide Bonding — 100% die
perimeter coverage shall be required.
NOTE 7: 100% coverage for resin bonding is not a function
of package acceptability but is required to standardize die
shear testing. The inability of the resins to wet the surface of
the die attach area due to contamination is cause for rejection.
8.2.1.2 Die Shear Test — Perform destructive testing
per MIL-STD-883, Method 2019.
NOTE 8: This test may also be performed after environmental
testing. In the case of very large die, this test may not be
appropriate to fully evaluate the package. In these cases, die
sizes, agreed between vendor and customer, shall be used.
Alternatively, die pull testing may be used by agreement
between vendor and customer.
8.2.1.3 Radiographic Inspection for Voids — Perform
inspection per MIL-STD-883, Method 2012.
8.2.1.4 Ultrasonic Inspection for Voids, Delamination,
and Cracks — Perform inspection per MIL-STD-883,
Method 2030.
8.2.2 Wire Bond — On wire bonds that meet the
requirements of MIL-STD-883, Method 2010, perform
destructive testing per MIL- STD-883, Method 2011,
Test Condition D. Bonds which cause lifted
metallization from the leadframe fingers shall also be
cause for component rejection.
NOTE 9: This test shall be performed at pre-seal and post-
seal.
8.2.3 Seal
8.2.3.1 Visual Inspection — The glass sealant
appearance and flow shall be visually inspected for
conformance to agreed process criteria.
8.2.3.2 Cap Torque Test — This test shall be
performed per process agreement.
8.2.4 Lead Finish — Type A per MIL-M-38510 if
required.
8.2.5 Hermeticity — This test shall be performed per
MIL-STD-883, Method 1014, Test Condition A or B
and C. The package must maintain hermetic integrity
after each environmental test or sequence of tests.
8.2.6 Environmental Testing — Environmental
evaluation shall include, but not be limited to, the
following tests:
NOTE 10: The sequence of testing and the sample sizes for
each sub-group shall be agreed between vendor and customer.
8.2.6.1 Temperature Cycle — Per MIL-STD-883,
Method 1010, Condition C.
8.2.6.2 Thermal Shock — Per MIL-STD-883, Method
1011, Condition B.
8.2.6.3 Vibration Fatigue — Per MIL-STD-883,
Method 2005, Test Condition B.
8.2.6.4 Mechanical Shock — Per MIL-STD-883,
Method 2002, Test Condition B.
8.2.6.5 Constant Acceleration — Per MIL-STD-883,
Method 2001, Test Condition D, “Y” axis only.
8.2.6.6 Moisture Resistance — Per MIL-STD-883,
Method 1004.
8.2.6.7 Additional Testing — Additional tests
performed at package qualification may include
evaluation of electrical and thermal characteristics.
These tests may be performed on a periodic basis to
maintain package qualification.
These tests may include, but are not limited to, the
following:
8.2.6.7.1 Insulation Resistance — Per MIL-STD-883,
Method 1003, Test Condition as agreed between user
and supplier.
8.2.6.7.2 Lead Inductance — Per SEMI Test Method
G23.
8.2.6.7.3 Lead-to-Lead Capacitance — Per SEMI Test
Method G24.
8.2.6.7.4 Lead Resistance — Per SEMI G25.
8.2.6.7.5 Thermal Dissipation — Per MIL-STD-883,
Method 1012.
9 Sampling
The sampling plan, based on MIL-STD-105, shall be
agreed between user and supplier.