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SEMI E49.7-0304 © SEMI 1995, 2004 9 RELATED INFORMATION 1 FLOW CONSIDERATIONS FOR ULTRAPURE WATER SYSTEMS NOTICE : Thi s related information i s not an of ficial part o f SEMI E49.7 and was derived from North American Li…

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SEMI E49.7-0304 © SEMI 1995, 2004 8
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer' s instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
SEMI E49.7-0304 © SEMI 1995, 2004 9
RELATED INFORMATION 1
FLOW CONSIDERATIONS FOR ULTRAPURE WATER SYSTEMS
NOTICE: This related information is not an official part of SEMI E49.7 and was derived from North American
Liquid Chemicals. This related information was approved for publication by full letter ballot on April 30, 2002.
R1-1 Ultrapure Water Considerations
R1-1.1 An ultrapure water system may benefit from
maintaining continuous flow with a velocity greater
than or equal to those listed in the following table:
Table R1-1
Nom. Size Tube ID
(inches)
V (ft/s) Tube ID
(cm)
V (cm/s)
¼” 0.125 5.2 0.3175 158.1
3/8” 0.250 2.6 0.6350 79.0
½” 0.375 1.7 0.9525 52.7
¾” 0.625 1.0 1.5875 31.6
1” 0.875 0.7 2.2225 22.6
R1-1.2 For reference this information is based on the
following equations, using a Reynolds number of 5000
and water at a temperature of 20°C.
Where:
Re is Reynolds number (dimensionless)
ρ is density (g/cm
3
)
V is fluid velocity (cm/sec)
D is tube diameter (cm)
µ is viscosity (g/cm-s)
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer' s instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
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Re
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DV
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=
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Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
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SEMI E49.8-1103 © SEMI 1996, 2003 1
SEMI E49.8-1103
GUIDE FOR HIGH PURITY AND ULTRAHIGH PURITY GAS
DISTRIBUTION SYSTEMS IN SEMICONDUCTOR MANUFACTURING
EQUIPMENT
This guide was technically approved by the Global Gases Committee and is the direct responsibility of the
North American Gases Committee. Current edition approved by the North American Regional Standards
Committee on September 3, 2003. Initially available at www.semi.org October 2003; to be published
November 2003. Originally published in 1996; previously published February 1998.
NOTICE: This document was completely rewritten in
2003.
1 Purpose
1.1 This document specifies guidelines for high purity
(HP) and ultrahigh purity (UHP) gas distribution
systems in semiconductor manufacturing equipment.
2 Scope
2.1 This guide applies to gas distribution systems
consisting of stainless steel components designed to
supply the following types of gases to the process
chamber:
2.1.1 Specialty Gases — Corrosive, flammable,
pyrophoric, oxidizer, toxic, inert, and mixtures.
2.1.2 Bulk Gases — Nitrogen, oxygen, argon,
hydrogen, and helium.
2.2 Typical processes include diffusion, anneal, plasma
etch, chemical vapor deposition, physical vapor
deposition, and ash.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety health practices and determine the
applicability or regulatory limitations prior to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E49 — Guide for Standard Performance,
Practices, and Sub-Assembly for High Purity Piping
Systems and Final Assembly for Semiconductor
Manufacturing Equipment
SEMI E49.6 — Guide for Subsystem Assembly and
Testing Procedures - Stainless Steel Systems
SEMI F1 — Specification for Leak Integrity of High-
Purity Gas Piping Systems and Components
SEMI F17 — Specification for High Purity Quality
Electroplished 316L Stainless Steel Tubing, Component
Tube Stubs, and Fittings Made from Tubing
SEMI F19 — Specification for the Finish of the Wetted
Surfaces of Electropolished 316L Stainless Steel
Components
SEMI F20 — Specification for 316L Stainless Steel
Bar, Extruded Shapes, Plate, and Investment Castings
for Components Used in High Purity Semiconductor
Manufacturing Applications
SEMI F37 — Method for Determination of Surface
Roughness Parameters for Gas Distribution
Components
SEMI F58 — Test Method for Determination of
Moisture Dry-Down Characteristics of Surface-
Mounted and Conventional Gas Distribution Systems
by Atmospheric Pressure Ionization Mass Spectroscopy
(APIMS)
SEMI F60 — Test Method for ESCA Evaluation of
Surface Composition of Wetted Surfaces of Passivated
316L Stainless Steel Components
SEMI F70 — Test Method for Determination of
Particle Contribution of Gas Delivery System
SEMI F73 — Test Method for Scanning Electron
Microscopy (SEM) Evaluation of Wetted Surface
Condition of Stainless Steel Components
SEMI F78 — Practice for Gas Tungsten Arc (GTA)
Welding of Fluid Distribution Systems in
Semiconductor Manufacturing Applications
SEMI F81 — Specification for Visual Inspection and
Acceptance of Gas Tungsten Arc (GTA) Welds in Fluid
Distribution Systems in Semiconductor Manufacturing
Applications
SEMI S2 — Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment
3.2 ASTM Document
1
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohocken, Pennsylvania 19428-2959, USA.
Telephone: 610.832.9585, Fax: 610.832.9555, Website:
www.astm.org