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SEMI M22-0303 © SEMI 1992, 2003 5 Figure 3 Pattern Deformati on Figure 4 Void in the Polycrystalline Silicon

SEMI M22-0303 © SEMI 1992, 2003 4

packed in such a manner to avoid chipping, scratches,

and contamination, and in accordance with the best

industry practices to provide protection against damage

during shipment.

10.2 The wafers supplied under this specification shall

be identified by appropriately labeling the outside of

each box or container and each subdivision thereof in

which it may reasonably be expected that the wafers

will be stored prior to further processing. Identification

shall include supplier’s name and reference no., date,

quantity, DI wafer diameter, DI wafer thickness, and

customer code no. The reference number assigned by

the supplier shall provide ready access to information

concerning the fabrication history of the particular

wafers in that lot. Such information shall be retained on

file at the manufacturer’s facility for at least one year

after the particular lot has been shipped.

Figure 1

Connected Tubs

Figure 2

Cross-Section of DI Wafer

SEMI M22-0303 © SEMI 1992, 2003 5

Figure 3

Pattern Deformation

Figure 4

Void in the Polycrystalline Silicon

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literature respecting any materials or equipment mentioned herein. These standards are subject to change without

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own responsibility.

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