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SEMI M49-0704 © SEMI 2001, 2004 7 Item Recommended Specification Comment References 2.8 Statistical Process Control (SPC) machine parameters automated 3 PROCEDURAL 3.1 Acceptance Testing user specific 3.2 Transport and A…

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SEMI M49-0704 © SEMI 2001, 2004 6
7.2 Other Documents
Evaluating Automated Wafer Measurement Instruments, SEMATECH
6
, Technology Transfer 94112638A-XFR
Metrology Tool Gauge Study Procedure for the International 300 mm Initiative (I300I), International 300 mm
Initiative
6
, Technology Transfer #97063295A-XFR
International Technology Roadmap for Semiconductors: 1999 edition
7
,
8
ISO 3274: 1996 — Geometrical Product Specifications (GPS) – Surface Texture: Profile method – Nominal
characteristic of contact (stylus) instruments
1
Table 1 Generic Equipment Characteristics
Item Recommended Specification Comment References
1 WAFER HANDLING
1.1 Robot End-Effector optional wafer edge or backside contact edge as defined
by SEMI M1
1.2 Scan Stage optional wafer edge or backside contact edge as defined
by SEMI M1
1.3 Wafer Contact Materials contact materials to leave metals and
organics on wafers < as defined in ITRS 99
1.4 Wafer Detection protection of accidental contact due to e.g.,
cross-slotting double slotting, protrusions,
etc.
1.5 Wafer Rotational Alignment random in, aligned out
1.6 Number of Cassette Stations 2–4, arbitrary sender/receiver assignment
1.7 Type of Cassettes open, FOUP/SMIF, FOSB to be specified
alternatively
1.8 Cassette Loading manual/guided vehicle, conveyor belt
1.9 Automatic Cassette ID user specific
1.10 Wafer Seating vertical or off-horizontal during setting
cassette on
station by
operator
1.11 Cassette Filling Modes random access and loading, programmable
empty slot filling
1.12 Automatic Wafer ID
reading
user specific
1.13 Particulate Contamination < 0.001 PWP per cm
2
, > 90 nm LSE front,
and > 120 nm LSE backside (See NOTE 1.)
verify with
mirror polished
wafer surfaces
SEMI E14
2 RELIABILITY
2.1 MTBF > 2000 h SEMI E10
2.2 MTTA > 4 h SEMI E10
2.3 MTTR according to service contract SEMI E10
2.4 Availability > 98% per year
2.5 Uptime > 160 h/w
2.6 Response Time according to service contract
2.7 Statistical Process Control
(SPC) performance
automated
6 International Sematech, 2706 Montopolis Drive, Austin, Tx. 78741-6499, USA
7 SEMATECH, 3101 Industrial Terrace Suite 106, Austin TX 78758
8 More recent versions of the ITRS are available from the homepage of International Sematech: www.sematech.org
SEMI M49-0704 © SEMI 2001, 2004
7
Item Recommended Specification Comment References
2.8 Statistical Process Control
(SPC) machine parameters
automated
3 PROCEDURAL
3.1 Acceptance Testing user specific
3.2 Transport and Assembly user specific
3.3 Quality Assurance supplier conforming with ISO 9000/9001 ISO 9000/9001
3.4 Warranty > 1 y
3.5 Test Certificates user specific
3.6 Spares Availability > 10 y
3.7 Change Control supplier conforming with ISO 9000/9001 ISO 9000/9001
4 DOCUMENTATION
4.1 Installation tbd
4.2 Operation tbd
4.3 Service tbd
5 COMPUTER, USER INTERFACE, CONNECTIVITY
5.1 Computer Operating System - Microsoft Windows NT 4.0 or higher, or
- Unix
5.2 Display cleanroom compatible, class 10 (Federal
Standard) or class 4 (ISO), respectively
FED-STD 209E
ISO 14644-1
5.3 Keyboard cleanroom compatible, class 10 (Federal
Standard) or class 4 (ISO), respectively
FED-STD 209E
ISO 14644-1
5.4 Pointing Device cleanroom compatible, class 10 (Federal
Standard) or class 4 (ISO), respectively
FED-STD 209E
ISO 14644-1
5.5 Printer cleanroom compatible, class 10 (Federal
Standard) or class 4 (ISO), respectively
FED-STD 209E
ISO 14644-1
5.6 Data Processing - reprocessing of data
- parallel processing in different modes
during measurement including sorting
- multiprocessing: e.g. recipe editing,
up/downloading during measurements
different modes
refer to data
evaluation e.g.
for two
different site
patterns, or
different
emulation
modes
5.7 Data Access - access to basic measurement results: e.g
thickness map, height map
- data available at SECS/GEM/HSMS
interface in real time
refers to all
functions as
defined in
Table 3
SEMI E5
SEMI E30
SEMI E37
5.8 Data Analysis
(Online/Offline)
on-line/off-line
5.9 Recipe Control - complete recipe generation off-line without
machine specific data (calibration curves)
- off-line recipe editing
- remote recipe control by host computer
- recipes are compatible between different
software versions
SEMI M49-0704 © SEMI 2001, 2004 8
Item Recommended Specification Comment References
5.10 Operating Sequence complete remote control : recipe download,
start, stop, define data evaluation via
SECS/GEM
SEMI E5
5.11 Data Interfaces - SECS/GEM
- optional additionally a mass data standard
transfer protocol (e.g. FTP)
SEMI E5
www.w3.org/Protocols/rfc95
9
5.12 Material Tracking System
Support
required, details user specific
5.13 Output File Format standardized formats:
- ASCII or XML for measurement results
- IEEE for raw data (floating point)
- JPEG (or equivalent) for raw data (image
data)
ISO/IEC 8859, ISO/IEC
10646-1
www.w3.org, ISO 8879
IEEE 754, IEEE 854
ISO/IEC 10918
5.14 Network Communications
Standards Support
Ethernet, Fast Ethernet IEEE 802
5.15 SECS/GEM required SEMI E5
5.16 ARAMS required SEMI E58
NOTE 1: The particulate contamination PWP value given for the backside has not been established in commercial practice and is under further
consideration by the SEMI Silicon Wafer Committee.
Table 2 Materials to be Measured
Item Recommended Specification Comments References
1 WAFERS
1.1 Kind of Wafers monocrystalline, unpatterned
silicon wafers with layers as
specified in Table 2, Item 1.3.4
SEMI M1
(SEMI M8)
(SEMI M11)
1.2 Wafer Characteristics – dimensional
1.2.1 Wafer Diameter 200 or 300 or 200+300 mm
nominal
SEMI M1
SEMI MF2074
DIN 50441-4
1.2.2 Wafer Thickness 700–850 µm For reclaim wafers
(performance as
outlined in Table 3
might be reduced):
200 mm: 600–850 µ
300 mm: 650–850 µm
SEMI MF1530
DIN 50441-1
1.2.3 Edge Shape rounded SEMI M1
DIN 50441-2
SEMI MF928
1.2.4 Wafer Shape Range 200 mm wfrs: warp <= 100 µm,
300 mm wfrs: warp <= 200 µm
SEMI M1
SEMI MF1390
DIN 50441-5
1.2.5 Fiducial 200 mm wfrs: notch or flat
300 mm wfrs: notch
SEMI M1
SEMI MF671
SEMI MF1152
(DIN 50441-4)
1.2.6 ID Mark(s) 200 mm wfrs: user specific
300 mm wfrs: according to SEMI
standards
content, type location
of ID mark to be
specified
SEMI M1.15
SEMI M12
SEMI M13
SEMI T7