semi合集-English.pdf - 第5205页
SEMI M38-1104 © SEMI 1999, 2004 4 Item Mechanical Furna ce Particle Lithography 6.0 Mechanical Characterist ics 6.1 Diameter 150 mm ± 0.50 mm 200 mm ± 0.50 mm 300 mm ± 0.50 mm 6.2 Primary Flat/Notch Dimension As-supplied…
SEMI M38-1104 © SEMI 1999, 2004 3
8.2 In the interest of controlling inspection costs, the
supplier and the purchaser may agree that the material
shall be certified as “capable of meeting” certain
requirements. In this context, “capable of meeting”
shall signify that the supplier is not required to perform
the appropriate tests in Section 9. However, if the
purchaser performs the test and the material fails to
meet the requirement, the material may be subject to
rejection.
9 Packing and Marking
9.1 Special packing requirements shall be subject to
agreement between the supplier and the purchaser.
Otherwise all wafers shall be handled, inspected, and
packed in such a manner as to avoid chipping,
scratches, and contamination, and in accordance with
the best industry practices, to provide ample protection
against damage during shipment.
9.2 The wafers supplied under this specification shall
be identified by appropriately labeling the outside of
each box or other container and each subdivision
thereof in which it may reasonably be expected that the
wafers will be stored prior to further processing.
9.3 For 300 mm wafers, the packing and marking
requirements of SEMI M31 and SEMI M45 shall be
met.
Table 1 Specifications for 150 mm, 200 mm, and 300 mm Silicon Reclaim Wafers
Item Mechanical Furnace Particle Lithography
1.0
General Characteristics
1.1 Growth Method As-supplied
1.2 Crystal Orientation As-supplied
1.3 Conductivity Type As-supplied
1.4 Dopant As-supplied
1.5 Nominal Edge Exclusion for FQA Unspecified Customer specified
2.0
Electrical Characteristics
2.1 Resistivity Customer specified
2.2 Radial Resistivity Variation (RRG) Unspecified
2.3 Resistivity Striations Unspecified
2.4 Minority Carrier Lifetime Unspecified
3.0
Chemical Characteristics
3.1 Oxygen Concentration Unspecified As-supplied Unspecified
3.2 Radial Oxygen Variation Unspecified As-supplied Unspecified
3.3 Carbon Concentration Unspecified As-supplied Unspecified
4.0
Structural Characteristics
4.1 Dislocation Etch Pit Density Unspecified None
4.2 Slip Unspecified None
4.3 Lineage Unspecified None
4.4 Twins Unspecified None
4.5 Swirl Unspecified
4.6 Shallow Pits Unspecified
4.7 OISF Unspecified
4.8 Oxide Precipitates Unspecified
5.0
Wafer Preparation Characteristics
5.1 Wafer ID Marking Customer specified
5.2 Front Surface Thin Films Unspecified None Unspecified None
5.3 Denuded Zone Unspecified
5.4 Extrinsic Gettering Unspecified None Unspecified None
5.5 Backseal Unspecified None Unspecified None
5.6 Annealing Unspecified
SEMI M38-1104 © SEMI 1999, 2004 4
Item Mechanical Furnace Particle Lithography
6.0
Mechanical Characteristics
6.1 Diameter
150 mm ± 0.50 mm
200 mm ± 0.50 mm
300 mm ± 0.50 mm
6.2 Primary Flat/Notch Dimension As-supplied
6.3 Primary Flat/Notch Orientation As-supplied
6.4 Secondary Flat Dimension (if Applicable) As-supplied
6.5 Secondary Flat Location (if Applicable) As-supplied
6.6 Edge Profile Unspecified
6.7 Thickness
150 mm (SEMI M1.8) 533–675 µm
150 mm (SEMI M1.13) 585–725 µm
200 mm 600–775 µm
300 mm 650–800 µm
6.8 Thickness Variation (TTV) Unspecified
6.9 Surface Orientation As-supplied
6.10 Bow Unspecified
6.11 Warp (for diameters other than 300 mm) Unspecified
Warp (for 300 mm only) Unspecified
6.12 Sori Unspecified Customer
specified
6.13 Flatness/Global Unspecified Customer
specified
6.14 Flatness/Site Unspecified Customer
specified
7.0
Front Surface Chemistry
7.1 Surface Metal Contamination
Sodium Unspecified Customer
specified
Unspecified
Aluminum Unspecified Customer
specified
Unspecified
Potassium Unspecified Customer
specified
Unspecified
Chromium Unspecified Customer
specified
Unspecified
Iron Unspecified Customer
specified
Unspecified
Nickel Unspecified Customer
specified
Unspecified
Copper Unspecified Customer
specified
Unspecified
Zinc Unspecified Customer
specified
Unspecified
7.2 Surface Organics Unspecified
8.0
Front Surface Visual Characteristics
8.1A Scratches (macro) – total length Unspecified None
8.1B Scratches (micro) – total length Unspecified
0.10 × Diameter
8.2 Pits Unspecified Customer specified
8.3 Haze Unspecified Customer specified
SEMI M38-1104 © SEMI 1999, 2004 5
Item Mechanical Furnace Particle Lithography
8.4 Localized Light Scatterers Unspecified
0.20/cm
2
@ 0.20 m
8.5 Contamination/area Unspecified None
8.6 Edge Chips Unspecified None
8.7 Edge Cracks Unspecified None
8.8 Cracks, Crow's feet Unspecified None
8.9 Craters Unspecified None
8.10 Dimples Unspecified None
8.11 Grooves Unspecified None
8.12 Mounds Unspecified None
8.13 Orange Peel Unspecified None
8.14 Saw Marks Unspecified None
9.0
Back Surface Characteristics
9.1 Edge Chips Unspecified None
9.6 Roughness Unspecified Customer specified
9.7A Brightness (gloss) (150 & 200 mm) Unspecified
9.7B Brightness (gloss) (300 mm)
80%
9.8 Localized Light Scatterers Unspecified Customer specified
9.9A Scratches (macro) Unspecified
0.25 × Diameter
9.9B Scratches (micro) Unspecified
10.0
Other Characteristics
TBD Edge condition
150 mm Unspecified
200 mm and 300 mm Unspecified Customer specified
Table 2 Specifications for 2", 3", 100 mm, and 125 mm Silicon Reclaim Wafers
Item Mechanical Furnace Particle Lithography
1.0
General Characteristics
1.1 Growth Method As-supplied
1.2 Crystal Orientation As-supplied
1.3 Conductivity Type As-supplied
1.4 Dopant As-supplied
1.5 Nominal Edge Exclusion Distance for FQA Unspecified Customer specified
2.0
Electrical Characteristics
2.1 Resistivity Customer specified
2.2 Radial Resistivity Variation (RRG) Unspecified
2.3 Resistivity Striations Unspecified
2.4 Minority Carrier Lifetime Unspecified
3.0
Chemical Characteristics
3.1 Oxygen Concentration Unspecified As-supplied Unspecified
3.2 Radial Oxygen Variation Unspecified As-supplied Unspecified
3.3 Carbon Concentration Unspecified As-supplied Unspecified
4.0
Structural Characteristics
4.1 Dislocation Etch Pit Density Unspecified None
4.2 Slip Unspecified None
4.3 Lineage Unspecified None
4.4 Twins Unspecified None