semi合集-English.pdf - 第197页

SEMI E24-92 © SEMI 1992, 2004 4 Figure R1-1 Illustration of Isolation Valve Interlock Standard NOTICE: The user’s attention is called to the possibility that compliance with this standard may require use of an inventi on…

SEMI E24-92 © SEMI 1992, 2004 3

RELATED INFORMATION 1

NOTICE: This related information is not an official part of SEMI E24 but was reapproved for publication by full

letter ballot procedures on February 28, 1999.

R1-1 Interlock Situations

R1-1.1 Examples are given below, for the different

types of modules, of situations in which it might be

considered hazardous for a connected module to

operate its isolation valve. Note that some of these

conditions prevent opening and others prevent closing

of the valves. (See Section 4.1.). Module types are

defined in SEMI E21. SEMI S2 provides guidance in

defining potential safety hazards. It is common practice

to detect valve positions and so verify operation, but

this is not an interface matter.

R1-1.2 Transport Module Examples — The transport

module end effector (see SEMI E22) is extended

beyond the interface plane. The connected module

should not close its isolation valve, as such an operation

could damage the end effector.

R1-1.2.1 The transport module is not at an acceptable

transfer pressure. Opening the isolation valve of the

connected module could result in damage to the valve

or wafer.

R1-1.3 Process Module Examples — The transport

module end effector exclusion volume (see SEMI E22)

is obstructed. The transport module should not open its

isolation valve and attempt to extend its end effector.

R1-1.3.1 The process module is not at an acceptable

transfer pressure. For instance, the module may be at

atmospheric pressure for preventive maintenance. The

transport module should not open its isolation valve.

R1-1.3.2 An unsafe partial pressure of a hazardous gas

exists in the process module. The transport module

should not attempt to open its isolation valve.

R1-1.4 Cassette Module Example — The cassette port

(loading door) is open, indicating the possibility of a

person' s hand in the cassette module. The transport

module should not operate its isolation valve to avoid

the possibility of injury to personnel.

R1-2 Illustration of Logic

R1-2.1 The interlock logic is illustrated in Figure A1

and described in Section 4.2. In the figure, the contacts

in module B are closed, enabling operation of the

isolation valve controlled by module A, while one of

the contacts in module A is open, preventing closure of

the isolation valve controlled by module B.

R1-3 Interlock Example

R1-3.1 This example elucidates some of the interlock

logic described in Section 4.2. In the case described

here, the Transport Module (TM) end effector is

extended into a Process Module (PM), which is

equipped with an isolation valve. This valve is inhibited

from closing by the interlock in the TM.

R1-3.2 A situation arises in the PM which results in its

interlock inhibiting the opening of the isolation valve

(which is already open) on the TM. As specified in

Section 4.3.3, the TM detects the interlock change and

immediately withdraws its end effector from the PM.

The TM interlock enables the closure of the PM

isolation valve (which the PM may do if that is the

appropriate response to the situation) and the TM can

close its isolation valve.

SEMI E24-92 © SEMI 1992, 2004 4

Figure R1-1

Illustration of Isolation Valve Interlock Standard

NOTICE: The user’s attention is called to the

possibility that compliance with this standard may

require use of an invention covered by patent rights. By

publication of this standard, Semiconductor Equipment

and Materials International (SEMI) takes no position

respecting the validity of any patent rights asserted in

connection with any item mentioned in this standard. In

particular, users of the specification should be aware

that Drytek, Inc., A Unit of General Signal, 16 Jonspin

Road, Wilmington, MA 01887-1087, Phone: (508) 657-

3933, has neither claimed nor disclaimed that

compliance with this specification would require use of

an invention covered by one or more of its patents.

Users of this standard are expressly advised that

determination of any such patent rights, and the risk of

the infringement of such rights, are entirely their own

responsibility.

These standards do not purport to address safety issues,

if any, associated with their use. It is the responsibility

of the user of these standards to establish appropriate

safety and health practices and determine the

applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E25-92 © SEMI 1992, 2004 1

SEMI E25-92 (Withdrawn 1104)

CLUSTER TOOL MODULE INTERFACE: MODULE ACCESS

GUIDELINE

This guideline was technically approved by the Global Physical Interfaces & Carriers Committee and is the

direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition

reapproved by the North American Regional Standards Committee on August 16, 2004. Initially available at

www.semi.org September 2004; to be published November 2004. Originally published in 1992; last

published June 1999.

Minor editorial changes were made to this document to conform to editorial guidelines.

NOTICE: This document was balloted and approved

for withdrawal in 2004.

1 Introduction

1.1 Scope — This guideline specifies an envelope

within which a cluster tool module is situated. Entry

and exit locations through the envelope and connection

locations to the module for utilities and facility services

are recommended.

1.2 Purpose — The purpose of the cluster tool module

access guideline is to provide assistance in the place-

ment of utilities and facility services to cluster tool

modules in order to improve access for maintenance

and service and to simplify cluster tool installation.

1.3 Impact — This guideline recommends that equip-

ment designs limit the placement of utility lines and

facility services to specific portions of the module

envelope.

1.4 Exceptions — Local safety regulations must always

take precedence over this guideline. Local conditions

may justify exceptions to this guideline.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the user of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

2 Referenced Documents

2.1 SEMI Documents

SEMI E20 — Cluster Tool Module Interface: Electrical

Power and Emergency Off Standard

SEMI E21 — Cluster Tool Module Interface:

Mechanical Interface and Wafer Transport Standard

SEMI E24 — Cluster Tool Module Interface: Isolation

Valve Interlocks Standard

SEMI S2 — Safety Guidelines for Semiconductor

Manufacturing Equipment

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

3 Module Envelope

3.1 For the purpose of this guideline, the module enve-

lope is taken to be a set of six surfaces that completely

encloses a module. Individual module envelopes may

contact but not penetrate adjacent module envelopes.

The six surfaces are the inboard and outboard planes,

the two sides, the bottom and the top.

3.2 The inboard plane is the interface plane between a

transport module and any other module as defined in

SEMI E21; thus, a transport module possesses multiple

inboard planes. The outboard surface is parallel to the

interface plane and normally coincides with that part of

the module which is farthest from the interface plane.

Each side of the module envelope consists of several

vertical planes. The bottom surface generally coincides

with the floor, and the top is a horizontal plane that con-

tains the highest point of the module.

3.3 In the sections that follow, the distinction between

the physical module and the space reserved for the

module within the envelope must be kept in mind. Sec-

tion 4 refers to where utility lines penetrate the enve-

lope, and Section 5 refers to constraints on where these

lines connect to the physical module.

4 Allocation of Module Envelope Surfaces

4.1 The allocation of surfaces is subject to the need for

access to the interface plane, module movement, main-

tenance access space, and protection of module compo-

nents (particularly electrical components) from liquid

leaks.

4.2 Inboard Plane — To allow access to the isolation

valve(s), no utilities or facility services should be rout-

ed through the inboard surface close to the valve

boundary. ( See SEMI E21) The inboard surface is pre-

ferred for intra-tool communications, EMO (see SEMI

E20) and the interlock interface between the transport

module and the attached modules. (See SEMI E24.)