semi合集-English.pdf - 第5807页

SEMI P23-0200 © SEMI 1993 , 2000 30 12 5 0 um 125 0 um 500 um 12 50 u m 500 um 125 0 um F i lm P a t te r n G lass Pa t ter n ( V er t i c al Li ne & S p ace P att er n ) 1 : 1 Li ne & S p a ce (H o r iz o n ta l…

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SEMI P23-0200 © SEMI 1993, 200029
(X / Y a x i s)(X/Y axis)
(Y axis)
(Y axis)
(Y axis) (Y axis)
(Y axis)
1/2
1/2
1/2
1/2
1/2
1/2
1/2
1/2
1/2
1/2
S1
S2
S1
S2
S2
S2
S2
S1
S1
Y
Y
Y
S2
S1
S
1
d
d
c
c
R. C.
a
b
a
b
DD
DD
A
I
B
HG
D
FE
C
JLK
MN
Edge IntrusionDot H ol e E dge Ex t en si on
Corner I nt rusionCorner Extension
Elongat i on Truncat ion Misplacement Misplacement
Mi ssi ng Pat t er n
Over Si ze Under Si ze
Mi spl acement
S1, S2 = Defect Size
DD = Defect Design Size
, R. C. = Reference Chip Pattern (or Design Pattern)
Figure 24
Defect
(Contact Hole Pattern)
SEMI P23-0200 © SEMI 1993, 2000 30
1250 um
1250 um
500 um1250 um
500 um1250 um
Film Pattern
Glass Pattern
(Vertical Line & Space Pattern)
1 : 1 Line & Space
(Horizontal Line & Space Pattern)
Line Width is Mask Design Rule Size.
Minimum 6000 um
Minimum 6000 um
Figure 25
Light Intensity Adjustment Pattern
SEMI P23-0200 © SEMI 1993, 200031
Figure 26
Sensitivity Check Sheet – Wiring Pattern