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SEMI P10-0705 © SEMI 1990, 2005 1 SEMI P10-0705 SPECIFICATION OF DATA STRU CTURES FOR PHOTOMASK ORDERS This specification was technic ally approved by the global Micro patterning Committee. This edition was approved for …

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SEMI P9-0298 © SEMI 1988, 19985
Table 6 Extended Testing — Processing
Characteristic Measured Property Variable Fixed Conditions Test Methods
Thermal image stability Shape Temperature Post exposure
Wall angle Line width Image hardening
Ramp rate
Corner rounding Line width
Line width Film thickness
Film integrity Environment
Wet etch adhesion (undercut/side) Line width (top & bottom) Etch time Substrate ASTM F 518
Etch temp Etch composition
Temperature
Resist treatment
Developer
Wet etch adhesion (bias) Line width etch-resist As above As above
Dry etch resistance Film thickness Hardbake conditions Ion
Line width Image hardening Process gases
Surface appearance Process conditions
Ion implant effects Outgassing Hardbake conditions Ion
Film integrity Image hardening Power
Temperature
Film thickness
Resist removal Removal rate Hardbake conditions Stripping time
Residue Post processing Stripping temperature
Particles Removal method
NOTICE: These standards do not purport to address safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish appropriate safety and health practices and determine the
applicability of regulatory limitations prior to use. SEMI makes no warranties or representations as to the suitability
of the standards set forth herein for any particular application. The determination of the suitability of the standard is
solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are
subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
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the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI P10-0705 © SEMI 1990, 2005 1
SEMI P10-0705
SPECIFICATION OF DATA STRUCTURES FOR PHOTOMASK ORDERS
This specification was technically approved by the global Micropatterning Committee. This edition was
approved for publication by the global Audits and Reviews Subcommittee on April 20, 2005. It was
available at www.semi.org in June 2005 and on CD-ROM in July 2005. Originally published in 1990;
previously published July 2004.
1 Purpose
1.1 These data structure specifications are intended to facilitate the transmittal of mask order data between software
systems to allow:
automated order placement by mask customers and to allow the automatic processing of such orders by mask
shops, and
automated delivery of actual mask data by mask shops and to allow the automatic processing of such data by
mask customers.
1.2 By using these standardized structures, software written independently for either mask customers or mask shops
should be able to communicate unambiguously with software written by other parties.
2 Scope
2.1 This structure only defines the data format for the transmitted file. No particular database or programming
language is specified by this standard, except that implementation of the Mask Results Data Structure Syntax is also
shown in Extensible Markup Language (XML) Format for those that choose to use it. The data file is to be
transmitted as an ASCII file. As such, it is compatible with the SECS-II standard.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
3 Limitations
3.1 For a given customer, all pattern file names must be unique. (i.e., Pattern files which are different may not have
the same name.)
3.2 For a given customer, all job file names must be unique. (i.e., Job files which are different may not have the
same name.)
3.3 For a given customer, each mask set must have a unique identification.
3.4 For a given customer, each magnetic tape or other physical media delivered to the mask shop must have a
unique identification.
3.5 All <pattern_data>, <job_data>, FRACTURE_FILE, MEASURE_FILE_NAME and
CD_MATRIX_FILE_NAME files should be introduced through a <data> structure to be used within the
<mask_order>. If such files are referenced in a <mask_order> without identification through <data>, specific
methods to identify and locate such files must be established between the customer and the vendor.
4 Referenced Standards and Documents
4.1 SEMI Standards
SEMI P1 — Specification for Hard Surface Photomask Substrates
SEMI P2 — Specification for Chrome Thin Films for Hard Surface Photomasks
SEMI P4 — Specification for Round Quartz Photomask Substrates
SEMI P5 — Specification for Pellicles
SEMI P6 — Specification for Registration Marks for Photomasks
SEMI P10-0705 © SEMI 1990, 2005 2
SEMI P21 — Guidelines for Precision and Accuracy Expression for Mask Writing Equipment
SEMI P22 — Guideline for Photomask Defect Classification And Size Definition
SEMI P24 — CD Metrology Procedures
SEMI P29 — Guideline for Description of Characteristics Specific to Halftone/Attenuated Phase Shift Masks and
Mask Blanks
SEMI P35 — Terminology for Microlithography Metrology
SEMI P37 — Specification for Extreme Ultraviolet Lithography Mask Substrates
SEMI P38 — Specification for Absorbing Film Stacks and Multilayers on Extreme Ultraviolet Lithography Mask
Blanks
SEMI P39 — Specification for Open Artwork System Interchange Standard (OASIS)
SEMI P43 — Photomask Qualification Terminology
4.2 ISO Standards
1
ISO 4217:2001 — Currency and funds code list
2
ISO 8601:2000 — Date and time notation
3
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
5 Terminology
5.1 See §8.
6 Instructions and Conventions
6.1 Each record in the file will be composed of a specific keyword identifier followed by one or more data values,
and will be terminated by a carriage return and/or linefeed.
6.2 Only records which are required to specify the order need to be included in the transmitted <mask_order> file,
but each record included must appear in the sequence shown in the syntax specification.
6.3 Subsequent modifications or additions to the mask set require transmittal of all the information for the specific
masks involved, including previously transmitted keywords and data fields if they still apply. Masks previously
ordered which are not affected by the new order transmission may have their <mask_definition>, <mask_group> or
<mask_set> omitted as appropriate.
6.4 Options are specified hierarchically such that those specified at a higher level are the default for all masks
below, unless overridden at a lower level. The hierarchy is such that mask set options are overridden by mask group
options, followed by mask definition, cell definition, cell instance, pattern group definition, and pattern definition.
6.5 Mask groups describe sets of masks which are similarly constructed. In simple cases there will be only one
mask group per mask set. Multiple mask groups will be needed to describe mix-and-match sets, or for situations
within a mask set where different features are required on some masks.
6.6 Pattern group definitions are intended for patterns which are similarly placed on all or most masks within a
mask group (e.g., primary pattern files or test pattern files).
6.7 Cell definitions describe the construction of clusters of pattern groups and/or other cells. The
PLACEMENT_TOP_CELL under a mask group describes the overall layout of the cells on all masks within the
mask group.
1 International Organization for Standardization, ISO Central Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland.
Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30, Website: www.iso.ch
2 http://www.bsi-global.com/Technical+Information/Publications/_Publications/tig90.xalter
3 http://www.cl.cam.ac.uk/~mgk25/iso-time.html