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SEMI P40-1103 © SEMI 2003 1 SEMI P40-1103 SPECIFICATION FOR MOUNTI NG REQUIREMENTS AND ALIGNMENT REFERENCE LOCATIONS FOR EXTREME ULTRAVIOLET LITHOGRAPHY MASKS This specification was technically approved by the Global Mi …

SEMI P39-0304

bounding box should be calculated to cover the full extent of all geometric figures and text element (x,y) points

within that cell and all of its subcells after a full expansion of any hierarchy beneath the cell.

A2-2.2.2 The flags field is an unsigned-integer. Only the least-significant 3 bits are presently defined, and have the

following meanings:

flags.bit.0: 0 = bounding box is known

1 = bounding box is unknown

flags.bit.1: 0 = bounding box is non-empty

1 = bounding box is empty

flags.bit.2: 0 = bounding box depends on no external cells

1 = bounding box depends on one or more external cells

A2-2.3 S_CELL_OFFSET

A2-2.3.1 This property may occur once after each CELLNAME record. Its value list consists of a single unsigned-

integer which declares the byte offset from the beginning of the file (byte 0) to where the corresponding CELL

record appears in the file. An offset value of 0 denotes an external cell, with no corresponding CELL record in the

same OASIS file.

A2-3 Element-Level Properties

A2-3.1 S_GDS_PROPERTY

A2-3.1.1 This property is intended exclusively for compatibility with GDSII Stream properties. It may occur one or

more times after any element within a CELL definition. Its value list contains exactly two values in sequence:

<attribute>, an unsigned-integer, and <propvalue-string>, a b-string. These values correspond to GDSII Stream

PROPATTR and PROPVALUE records, respectively.

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SEMI P40-1103 © SEMI 2003 1

SEMI P40-1103

SPECIFICATION FOR MOUNTING REQUIREMENTS AND ALIGNMENT

REFERENCE LOCATIONS FOR EXTREME ULTRAVIOLET

LITHOGRAPHY MASKS

This specification was technically approved by the Global Micropatterning Committee and is the direct

responsibility of the North American Micropatterning Committee. Current edition approved by the North

American Regional Standards Committee on September 3, 2003. Initially available at www.semi.org

September 2003; to be published November 2003.

1 Purpose

1.1 This specification covers the mounting

requirements for Extreme Ultraviolet Lithography

(EUVL) masks.

2 Scope

2.1 This standard details the requirements for EUVL

mask mounting. The mask mount is a flat reference

surface against which the mask is clamped. The

specific design and material of the mask mount are not

specified.

2.1.1 The mounting requirements in this standard apply

to the exposure tool, the mask pattern generator and the

pattern placement metrology tool. As an option, the

requirements may be used in other tools used to

fabricate or measure EUV masks.

2.2 This standard also defines the area on the EUV

mask reserved for proper handling, identification (ID)

marks and alignment references. The forms of the

alignment and ID marks are not specified.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Referenced Standards

3.1 SEMI Standards

SEMI P37 — Specification for Extreme Ultraviolet

Lithography Mask Substrates

SEMI P38 — Specification for Absorbing Film Stacks

and Multilayers on Extreme Ultraviolet Lithography

Mask Blanks

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

4 Terminology

4.1 Abbreviations and Acronyms

4.1.1 EUV — extreme ultraviolet

4.1.2 EUVL — extreme ultraviolet lithography

4.2 Definitions

4.2.1 chuck — the chuck is the physical apparatus in

the tools listed in Section 2.1.1 upon which the mask is

mounted.

4.2.2 mounting surface — the mounting surface is the

surface of the chuck in direct contact with the mask.

The backside of the mask, which is the unpatterned

side, shall be in direct contact with the mounting

surface while the mask is being used in the tools listed

in Section 2.1.1.

4.2.3 pin or pedestal — the surface of the chuck may

consist of an array of pins or pedestals. Pins are

protrusions from the chuck surface that come to a point

at the location on their surface farthest from the chuck.

Pedestals have a nominally flat surface at their surface

farthest from the chuck. Note that if S

= P

in Figure

5, the chuck is referred to as a pin chuck. Otherwise, it

is a pedestal chuck.

4.2.4 user — this term may refer to the user of

fabrication equipment for EUV masks that contains a

chuck, or this term may refer to the purchaser of an

EUV mask from a mask supplier.

5 Mask Layout Requirements

5.1 The square substrates shall conform to the

dimensional tolerances as defined in Section 6 of SEMI

P37. Datum points on the edges of the mask substrate

are defined in Figure 2 of SEMI P37.

5.2 Masks shall have areas reserved for patterns to be

printed, for identification (ID) marks, for reticle

alignment on the front side and for handling as shown

in Figure 1.

5.2.1 The mask layout shall include an area reserved

for the printable area, which has maximum dimensions

SEMI P40-1103 © SEMI 2003 2

of 104 mm by 132 mm. This region is also centered on

the mask as shown in Figure 1.

5.2.2 The region outside of the printable area is

reserved for alignment marks, ID marks and handling.

The location of the regions for these items is to be

negotiated between user and supplier.

6 Mounting Requirements

6.1 The mask mounting quality area is indicated in

Figure 2. The dimensions of the mask mounting quality

area, D and W, are agreed upon beween user and

supplier. The edge length of the mask substrate, L, is

defined in Table 1 of SEMI P37.

6.2 The mounting surface shall meet the flatness

requirements defined in Table 1 over the mounting

quality area shown in Figure 2.

6.2.1 The flatness error is defined as the maximum

deviation of the surface from the best fit plane that

minimizes the maximum deviation of the mounting

surface from the best fit plane. This definition is

illustrated in Figure 3. Note that the mounting surface

is defined in Section 4.2.2 .

6.3 The mounting surface may be discontinuous and

not touch the backside at all points within the flatness

quality area. In other words, the mounting surface may

be an array of pins or pedestals.

6.3.1 The maximum distance between these pins must

meet the requirements shown in Table 4. Figure 5

defines the pin spacing.

6.3.2 Other dimensions of the pins shown in Figure 5

are to be agreed upon between the user and supplier as

indicated in Table 4. Note that if S

= P

in Figure 5,

the chuck is referred to as a pin chuck.

6.3.3 If the mounting surface is discontinuous as

allowed in Section 6.3, the plane that defines the

maximum deviation will include points near or at the

tops of the pins or pedestals. This plane is illustrated in

Figure 4.

6.4 The mask will be mounted with a clamping

pressure as specified in Table 2. The clamping pressure

is the force per unit area in the plane of the mounting

surface. The minimum effective bending stiffness of

the chuck cross section is specified in Table 3.

6.5 The mask mounting and chuck attributes are not

limited to EUVL exposure/stepper tool but apply to the

mask pattern generator and pattern placement

metrology tools.

7 Test Methods

7.1 Flatness  to be agreed upon between user and

supplier.

7.2 Stiffness  to be agreed upon between user and

supplier.

7.3 Clamping Pressure  to be agreed upon between

user and supplier.

7.4 Pin or Pedestal Spacing, Height, Period and

Sidewall Angle  to be agreed upon between user and

supplier.

8 Certification

8.1 Upon request of the user, a supplier' s certification

that the chuck was manufactured and tested in

accordance with this specification, together with a

report of the test results, shall be furnished at the time

of shipment.