semi合集-English.pdf - 第766页

SEMI E104-0303 © SEMI 2000, 2003 2 3.2 ASTM Stan dards 1 ASTM D1193 — Standard Specif ication for Reagent Water ASTM F328 — Stan dard Practice for Calibration of an Airborne Part icle Counter Using Mo nodisperse Spherica…

100%1 / 7923
SEMI E104-0303 © SEMI 2000, 2003 1
SEMI E104-0303
SPECIFICATION FOR INTEGRATION AND GUIDELINE FOR
CALIBRATION OF LOW-PRESSURE PARTICLE MONITOR
This specification was technically approved by the Global Metrics Committee and is the direct responsibility
of the European Equipment Automation Committee. Current edition approved by the European Regional
Standards Committee on January 8, 2003. Initially available at www.semi.org January 2003; to be published
March 2003. Originally published October 2000; previously published March 2002.
1 Purpose
1.1 The use of in situ particle monitoring (ISPM;
particle measurements performed while the wafer
resides inside the processing chamber) in low-pressure
and vacuum applications provides a number of
advantages for defect, process, and equipment
management such as:
• Reduction of particle test wafers used for off-line
tests and saving operator time,
• Optimization and real-time characterization of the
process,
• Advanced process control,
• Advanced equipment control,
• Monitoring process chamber conditions, and
• Optimization of cleaning procedures and
maintenance.
1.1.1 Therefore, ISPM achieves more equipment
availability and faster ramp-up of the production,
reduces cost of ownership, improves quality and yield.
To reach these goals, ISPM needs to be easily
integrated into new or existing process equipment and
the acquisition as well as the analysis of the particle
data needs to be automated. The ISPM sensor should
not have any negative influence on the process and the
measurement has to represent the main particle flow.
The sensor should be designed to have a minimum
negative impact on the parameters defined in SEMI E10
for the whole semiconductor process equipment, to
achieve an advantage in capacity.
1.2 This standard is intended to stipulate operating
conditions, mechanical, electrical, and communication
interfaces for the use of Low-pressure Particle
Detectors integrated in semiconductor process
equipment. A guideline for a reference calibration of
those sensors is intended to support correlation between
measurements with different sensors.
2 Scope
2.1 This standard applies to particle measurement
under low-pressure and vacuum conditions in
semiconductor manufacturing equipment.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety health practices and determine the
applicability of regulatory or other limitations prior to
use.
3 Referenced Standards
3.1 SEMI Standards
SEMI C6.5 — Particle Specification for Grade 10/0.2
Nitrogen (N
2
) and Argon (Ar) Delivered as Pipeline
Gas
SEMI C6.6 — Particle Specification for Grade 10/0.1
Nitrogen (N
2
) and Argon (Ar) Delivered as Pipeline
Gas
SEMI E4 — SEMI Equipment Communications
Standard 1 Message Transfer (SECS-I)
SEMI E5 — SEMI Equipment Communications
Standard 2 Message Content (SECS-II)
SEMI E10 — Specification for Definition and
Measurement of Equipment Reliability, Availability,
and Maintainability (RAM)
SEMI E33 — Specification for Semiconductor
Manufacturing Facility Electromagnetic Compatibility
SEMI E37 — High-Speed SECS Message Services
(HSMS) Generic Services
SEMI E54 — Sensor/Actuator Network Standard
SEMI E54.10 — Specification for Sensor/Actuator
Network Specific Device Model for an In-Situ Particle
Monitor Device
SEMI F6 — Guide for Secondary Containment of
Hazardous Gas Piping Systems
SEMI E104-0303 © SEMI 2000, 2003 2
3.2 ASTM Standards
1
ASTM D1193 — Standard Specification for Reagent
Water
ASTM F328 — Standard Practice for Calibration of an
Airborne Particle Counter Using Monodisperse
Spherical Particles
ASTM F649 — Practice for Secondary Calibration of
Airborne Particle Counter Using Comparison
Procedures
3.3 BSI Standards
2
BS 3406-7 — Determination of Particle Size
Distribution – Recommendations for Single Particle
Light Interaction Methods
3.4 IEC Standards
3
IEC 60625-1 — Programmable Measuring Instruments
- Interface System (Byte Serial, Bit Parallel) - Part 1:
Functional, Electrical and Mechanical Specifications,
System Applications, and Requirements for the
Designer and User
IEC 60625-2 — Programmable Measuring Instruments
- Interface System (Byte Serial, Bit Parallel) - Part 2:
Codes, Formats, Protocols, and Common Commands
IEC 60654-1 — Operating Conditions for Industrial-
Process Measurement and Control Equipment - Part 1:
Climatic Conditions
IEC 60654-2 — Operating Conditions for Industrial-
Process Measurement and Control Equipment - Part 2:
Power
IEC 60654-3 — Operating Conditions for Industrial-
Process Measurement and Control Equipment - Part 3:
Mechanical Influences
IEC 60654-4 — Operating Conditions for Industrial-
Process Measurement and Control Equipment - Part 4:
Corrosive And Erosive Influences
IEC 60801-1 — Electromagnetic Compatibility for
Industrial-Process Measurement and Control
Equipment - Part 1: General Introduction
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohocken, Pennsylvania 19428-2959, USA.
Telephone: 610.832.9585, Fax: 610.832.9555 Website:
www.astm.org
2 British Standards Institute, 389 Chiswick High Road, London, W4
4AL, United Kingdom. Telephone: 44.0.20.8996.9000, Fax:
44.0.20.8996.7001 Website: www.bsi-global.com
3 International Electrotechnical Commission, 3, rue de Varembé,
Case Postale 131, CH-1211 Geneva 20, Switzerland. Telephone:
41.22.919.02.11; Fax: 41.22.919.03.00 Website: www.iec.ch
3.5 IEEE Standards
4
IEEE 488.1 — IEEE Standard Digital Interface for
Programmable Instrumentation
IEEE 488.2 — IEEE Standard Codes, Formats,
Protocols, and Common Commands for use with IEEE
488.1, IEEE Standard Digital Interface for
Programmable Instrumentation
3.6 IEST Standards
5
IEST RP-011 — A Glossary of Terms and Definitions
Related to Contamination Control
3.7 ISO Standards
6
ISO 1609 — Vacuum technology -- Dimensions (ISO-
K style and ISO-F style)
ISO 2861-1 — Vacuum technology -- Quick-release
couplings – Dimensions - Part 1: Clamped type (ISO-
KF)
ISO 2861-2 — Vacuum technology -- Quick-release
couplings – Dimensions - Part 2: Screwed type (ISO-
MF)
ISO 3669 — Vacuum technology -- Bakeable flanges --
Dimensions (ISO-K-CF)
ISO 10012-1 — Quality assurance requirements for
measuring equipment – Part 1: Metrological
confirmation system for measuring equipment
ISO 10012-2 — Quality assurance requirements for
measuring equipment – Part 2: Guidelines for control of
measuring processes
ISO 13323-2 — Determination of particle size
distribution – Single Particle Light Interaction Methods
Part 2: Light scattering single particle light interaction
devices design, performance specifications, and
operation requirements
ISO 14644-1 — Cleanrooms and associated controlled
environments - Part 1: Classification of air cleanliness
ISO 14644-5 — Cleanrooms and associated controlled
environments - Part 5: Operation of cleanroom systems
4 Institute of Electrical and Electronics Engineers, IEEE Operations
Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, New Jersey
08855-1331, USA. Telephone: 732.981.0060; Fax: 732.981.1721
5 Institute of Environmental Sciences and Technology, 5005 Newport
Drive, Suite 506, Rolling Meadows, IL 60008-3841, USA.
Telephone: 847.255.1561; Fax: 847.255.1699 Website: www.iest.org
6 International Organization for Standardization, ISO Central
Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,
Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30
Website: www.iso.ch
SEMI E104-0303 © SEMI 2000, 2003 3
3.8 JIS Standards
7
JIS B 9921 — Light Scattering Automatic Particle
Counter
3.9 VDI Standards
8
VDI-Richtlinie 3489-3 — Messen von Partikeln:
Methoden zur Charakterisierung und Überwachung von
Prüfaerosolen - Optischer Partikelzähler (Particulate
Matter Measurement: Methods of Characterizing and
Monitoring Test Aerosols – Optical Particle Counter)
VDI-Richtlinie 3491 — Messen von Partikeln:
Herstellungsverfahren für Prüfaerosole,
Verdünnungssysteme (Particulate Matter Measurement:
Generation of Test Aerosols, Dilution Systems)
NOTICE: As listed or revised, all documents cited
shall be the latest publications of adopted standards.
4 Terminology
4.1 Abbreviations and Acronyms
4.1.1 COV — Coefficient of Variation
4.1.2 HEPA — High-Efficiency Particulate Air
4.1.3 ISPM — In Situ Particle Monitor
4.1.4 LDL — Lower Detectable Limit
4.1.5 LPPD — Low-Pressure Particle Detector
4.1.6 PHA — Pulse Height Analyzer
4.1.7 RPC — Reference Particle Counter
4.1.8 ULPA — Ultra-Low Penetration Air
4.2 Definitions
4.2.1 accuracy of size — the closeness of agreement
between the ascertained size of the detected particle and
its real size.
4.2.2 coefficient of variation (COV) — the width of a
distribution (in %), obtained by dividing the standard
deviation of the distribution by the mean of the
distribution.
4.2.3 coincidence — the presence of two or more
particles in the detection area of the particle detector at
the same time, causing the particle detector to interpret
the combined signal erroneously as resulting from one
larger particle.
7 Japanese Industrial Standards, Available through the Japanese
Standards Association, 1-24, Akasaka 4-Chome, Minato-ku, Tokyo
107-8440, Japan. Telephone: 81.3.3583.8005; Fax: 81.3.3586.2014
Website: www.jsa.or.jp
8 Beuth Verlag GmbH, Burggrafenstrasse 6, D-10787 Berlin,
Germany. Telephone: 49.30.2601.0, Fax: 49.30.2601.1260 Website:
www2.beuth.de
4.2.4 concentration — the number of particles per unit
volume, at ambient temperature T
A
and pressure p.
4.2.5 concentration limit — the particle concentration
specified by the manufacturer of the particle detector at
which the error due to coincidence is 10% or less.
NOTE 1: Manufacturers may specify concentration limits at
error levels other than 10%.
4.2.6 counting efficiency the ratio (in %) of detected
concentration divided by the actual concentration of
particles of a given size or range of sizes (see appendix
2).
4.2.7 detection area the area, defined through the
light beam and the detection optics, in which the
particles are detected. Often this area is much smaller
than the cross-section of the pump line or the process
chamber.
4.2.8 high-efficiency particulate air (HEPA) filter
filter with a minimum particle-collection efficiency of
99.97% on all particles larger than
0.3 micrometer.
4.2.9 in situ refers to processing steps or tests that
are done without moving the wafer. Latin for “in
original position”.
4.2.10 in situ particle monitor (ISPM) particle
monitor used under atmospheric conditions or in low-
pressure, vacuum or liquid applications to detect
particles while a process is running.
4.2.11 isokinetic sampling sampling of particles in a
moving aerosol or fluid by matching the sample probe
inlet velocity (flow speed and
direction) to the velocity
of the moving aerosol or fluid.
4.2.12 lower detectable limit (LDL) in particle
measurement: the smallest particle size that a particle
detector can measure at a given flow rate with a signal-
to-noise ratio of at least 3 dB and with a counting
efficiency of 50% ± 10%.
NOTE 2: This is a general definition of LDL. Due to the
special design of most of the LPPDs, a counting efficiency of
50% can not be achieved.
4.2.13 low-pressure particle detector (LPPD)
optical particle sensor for use under low-pressure and
vacuum conditions to measure particles or particle
levels in semiconductor process equipment.
4.2.14 monodisperse calibration particles particles
with known optical properties, a sizing accuracy of at
least 95%, and a size distribution in which the
coefficient of variation is 5% or less.
4.2.15 optical equivalent size the diameter of a
monodisperse calibration particle that produces the