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SEMI M12-1103 © SEMI 2003 10 RELATED INFORMATION 1 NOTICE : This rel ated information is not an of ficial part of SEMI M1 2 but was ap proved for publi cation on Jul y 12, 1998. R1-1 Considerations for Reliable Automatic…
SEMI M12-1103 © SEMI 1988, 2003 9
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer' s instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
SEMI M12-1103 © SEMI 2003 10
RELATED INFORMATION 1
NOTICE: This related information is not an official part of SEMI M12 but was approved for publication on July 12,
1998.
R1-1 Considerations for Reliable Automatic
Reading of the Marking
R1-1.1 The following suggestions are offered to assist
in assuring the most reliable automatic reading of the
alphanumeric marking.
R1-1.2 Character Stroke Thickness — If a 5 × 9 dot
matrix is chosen for marking, it is recommended that
the minimum dot size be 0.100 mm. Double or higher
density dot matrix is recommended — when used,
smaller dot diameters may be employed. Stroke
thickness should be constant within 20% over the entire
character set so that the reader settings may be
optimized for the specific wafer run.
R1-1.3 Contrast — The character should have
sufficient contrast to be legible. Contrast may be
affected by depth and other conditions.
R1-1.4 Clear Zone — It is recommended that the area
immediately beneath and a minimum of 0.500 mm
around the marking characters be of uniform
reflectivity and free of any lithography and process
overlay edges.
R1-2 Considerations for the Use of Front
Surface Markings
R1-2.1 Marks can impinge upon areas where devices
may be printed. Since mask geometries are varied,
considerations of the mark area should be made in mask
design and also when applying the mark specifications
to existing mask designs.
R1-2.2 When the mark is applied prior to epitaxial
deposition, a crown or epi may grow along the mark
edge. The height of this crown will depend upon the epi
thickness and the deposition process.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer' s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user' s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI M13-1103 © SEMI 1988, 2003 1
SEMI M13-1103
SPECIFICATION FOR ALPHANUMERIC MARKING OF SILICON
WAFERS
This specification was technically approved by the Global Traceability Committee and is the direct
responsibility of the North American Traceability Committee. Current edition approved by the North
American Silicon Wafer Committee on July 27, 2003. Initially available at www.semi.org October 2003; to
be published November 2003. Originally published in 1988; previously published in September 1998.
1 Purpose
1.1 This specification describes an alphanumeric
marking system for silicon wafers. The marking code
includes information on the origin, approximate
resistivity, dopant species, and crystal growth
orientation in addition to a wafer identification number.
Use of this specification ensures the consistency of all
wafer marking performed by silicon manufacturers.
This consistency allows simplification of the
performance requirements of Automatic Optical
Character Reading (OCR) equipment.
1.2 By defining the basic code used to characterize the
individual wafer, this specification provides the
information needed for practical operator interpretation.
2 Scope
2.1 This specification defines the character set,
location, and associated dimensions and tolerances of
an alphanumeric code, specifically for identification of
flatted and notched silicon wafers.
2.2 This specification does not address the marking
techniques that may be employed when complying with
this standard.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 None.
4 Terminology
4.1 Definitions
4.1.1 adjacent character misalignment, R
adj
— the
vertical distance between the character baselines of two
adjacent characters on the same line.
4.1.2 character separation — the horizontal distance
between the adjacent boundaries of any characters.
4.1.3 character spacing — the horizontal distance
between the character spacing reference lines of the
adjacent characters.
4.1.4 line character misalignment, R
line
— the vertical
distance between the character baselines of the highest
and lowest characters on the same line.
Figure 1
Character Outline
5 Shape and Size of Marking
5.1 Solid line or dot matrix method may be used to
write characters. The minimum matrix shall be 5 dots
horizontal and 9 dots vertical as shown in Figure 1.
More dots may be used, up to and including a solid line.
Higher density is recommended, especially for use with
the larger code size applicable to notched wafers, to
achieve improved read reliability (see Related
Information 1).
5.2 Character Dimensions and Spacing — See Table 1
and Figure 1.
5.3 SEMI OCR Standard Character Set — See Table 2
and Appendix 1.
6 Alphanumeric Code
6.1 Message Content — The code consists of one line
of 18 characters. The first eight characters are an
identification number that is unique to the wafer for a
given supplier. These characters may be alphanumeric
except character 8, which must be numeric (see
Table 3). Characters 9 and 10 are the supplier