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SEMI E21-94 © SEMI 1991, 2002 3 provided in the O-ring flange face as shown in Figure 1 and specified i n Figure 3. Alignm ent pin height above the flange fac e is 6 mm (0.24 in. ) minim um to 8 mm (0.31 in.) m aximum (s…

SEMI E21-94 © SEMI 1991, 2002 2

5.1.9 process module — a module that accepts or

presents a single wafer inside the module for intratool

transport.

5.1.10 reach — the distance measured from the

interface plane to the wafer centroid within a process or

cassette module.

5.1.11 transport module — a module that accepts or

presents a single wafer outside the module across the

interface plane for intratool transport.

5.1.12 wafer transport plane — the horizontal surface

a wafer traverses between modules.

5.1.13 wafer transport zone — the area of the interface

plane free of physical obstructions, reserved for wafer

movement between modules.

6 Requirements

6.1 Wafer Transport and Placement

6.1.1 Horizontal Transport Plane — The dimensions

for wafer placement during wafer transport are

referenced from the interface plane in the plan view

shown in Figure 1. The transport module is required to

present or accept a horizontal wafer outside the module

anywhere along an axis perpendicular to the center of

the interface plane to a maximum 305 mm (12 in.) from

the interface plane. Thus, a transport module is required

to have the capability to reach 305 mm (12 in.) beyond

its interface plane to a wafer centroid (see Section R1-

1). However, location of the wafer at a distance less

than 305 mm (12 in.) from the interface plane requires

that the transport module be capable of addressing the

intermediate location. Similarly, a cassette module or

process module accepts a horizontal wafer inside the

module anywhere along an axis perpendicular to the

center of its interface plane up to a maximum 305 mm

(12 in.) from the interface plane as required by the

application.

6.1.1.1 Placement Accuracy — The requirements for

placement accuracy of a wafer in the horizontal plane

within a module are 1.0 mm (0.04 in.) true position, ±

0.5 mm (± 0.020 in.) radially, with less than one degree

angular rotation for every module-to-transport-to-

module wafer transport (B

:A:B

+ 1as shown in Figure

1). If the wafer is displaced in the process module, it

must be returned to the original position within the non-

culmulative placement accuracy of 1.0 mm (0.04 in.)

true position, ± 0.5 mm (± 0.020 in.) radially.

6.1.2 Vertical Position of Transport Plane — The

elevation of the wafer transport plane is measured from

the facility floor as shown in Figure 2. The transport

module is required to present or accept a horizontal

wafer outside the module at a nominal wafer transport

height of 1100 mm (43.307 in.) from the facility floor

(see Section R1-2).

6.1.2.1 Vertical Motion — The transport module is

required to move the wafer to within ± 0.5 mm (0.020

in.) in the wafer transport plane. The transport module

is also required to posess a vertical motion capability to

a second plane 6.0 mm ± 0.5 mm (0.236 in. ± 0.020 in.)

below the wafer transport plane in order to allow wafer

handoff to or from passive cassette or process modules

(see Figure 2 and Section R1-3).

6.1.2.2 Reference Plane — The interface plane

alignment pins define a reference plane 9.5 mm (0.374

in.) below the wafer transport plane (see Figure 2).

6.2 Interface Plane — The interface plane contains the

interface seal zone and the wafer transport zone, which

do not overlap, and the location of the interface plane

alignment pins (see Figures 3 and 4).

6.2.1 Interface Seal Zone — The interface seal zone is

rectangular and symmetrically referenced to the

interface plane alignment pins. The inside boundary

dimension of the interface seal zone is 46 mm (1.811

in.) by 236 mm (9.291 in.). The outside boundary is 76

mm (2.992 in.) by 266 mm (10.472 in.). A seal zone is

either a seal surface or an O-ring face. All interface seal

zones facing toward a transport module are seal

surfaces polished to a surface finish less than or equal to

0.8 micrometer (32 microinches) parallel to the

circumference (see Section R1-4). All interface seal

zones facing toward a cassette or process module are O-

ring faces equipped with the appropriate capture groove

for the sealing method employed (see Figure 3 and

Section R1-4.1).

6.2.2 Wafer Transport Zone — The wafer transport

zone is the area within the interface seal zone reserved

for moving the wafer between modules. The wafer

transport zone which cannot be compromised by any

module is defined as the area at least 16 mm (0.630 in.)

above and below the alignment pin centerlines, and 111

mm (4.370 in.) to the left and right of the centerline

between the two alignment pins (see Figure 3 and

Section R1-5).

6.2.3 Interface Plane Alignment Pins — Provisions are

made for two 10 mm (0.394 in.) diameter locating pins

(see Figure 4) to be used as alignment aids between

modules. Under no circumstances should the flanges at

the interface plane and the alignment pins be subject to

a total load exceeding 500N (112 lbf) in shear. The

alignment pins have an absolute centerline separation of

300.0 mm (11.811 in.) in the horizontal plane. The pins

reside in the seal surface side of the flange pair,

opposite the O-ring, facing toward the transport

module. Mild press fit holes are provided in the seal

surface flange face. A clearance hole and a slot are

provided in the O-ring flange face as shown in Figure 1

and specified in Figure 3. Alignment pin height above

the flange face is 6 mm (0.24 in.) minimum to 8 mm

(0.31 in.) maximum (see Section R1-6).

6.2.4 Isolation Valves — The transport module is

always equipped with a valve for environmental

isolation at each module interface plane. The intratool

transport port on a process or cassette module may be

equipped with an environmental isolation valve (see

Section R1-7).

6.3 Flange — A flange is specified as 162 mm (6.378

in.) by 340 mm (13.386 in.). One horizontal edge is

specified to be 50 mm (1.969 in.) from the alignment

pins’ centerline (see Figure 4).

6.3.1 Clamping — Clamping grooves as specified in

the International Standards Organization document,

Vacuum Technology, Flange Dimensions (ISO 1609-

1986), Table 2, nominal bores 40 mm-250 mm (1.575

in.Ð9.843 in.) are located at the flange perimeter (see

groove detail in Figure 4). Clamps for ISO flanges can

be used to generate the force necessary to produce an

environmental seal (see Section R1-8).

6.3.2 Non-Flanged Surfaces — A non-flanged surface

may be used to join with a flanged surface. An

attachment means to engage the flange must be

provided. If a flanged adaptor piece is necessary to join

two non-flanged surfaces, then the adaptor piece shall

be located on the process or cassette side of the

interface plane.

LIST OF FIGURES

Figure 1 — Module Interface with Wafer Transport and

Placement Detail (Plan View)

Figure 2 — Wafer Transport Plane Elevation

Figure 3 — Interface Plane

Figure 4 — Flange Specification

Figure 1

Module Interface with Wafer Transport and Placement Detail (Plan View)