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SEMI T5-96 © SEMI 1996, 2004 9

SEMI T5-96 © SEMI 1996, 2004 8

SEMI T5-96 © SEMI 1996, 2004 9

SEMI T5-96 © SEMI 1996, 2004 10

RELATED INFORMATION 1

NOTICE: This related information is not an official part of SEMI T5. This related information was approved for

publication by full letter ballot procedures.

R1-1 Considerations for Reliable Automatic

Reading of the Marking

R1-1.1 The following suggestions are offered to assist

in assuring the most reliable automatic reading of the

alphanumeric marking.

R1-1.2 Character Stroke Thickness — If a 5 × 9 dot

matrix is chosen for marking, it is recommended that

the minimum dot size be 0.100 mm. Double or higher

density dot matrix is recommended; when used, smaller

dot diameters may be employed. Stroke thickness

should be constant withing 20% over the entire

character set so that the reader settings may be

optimized for the specific wafer run.

R1-1.3 Contrast — The character should have

sufficient contrast to be legible. Contrast may be

affected by depth and other conditions.

R1-1.4 Clear Zone — It is recommended that the area

immediately beneath and a minimum of 0.500 mm

around the marking characters be of uniform

reflectivity and free of any lithography and process

overlay edges.

R1-2 Considerations for the Use of Front

Surface Markings

R1-2.1 Marks can impinge upon areas where devices

may be printed. Since mask geometries are varied,

considerations of the mark area should be made in mask

design and also when applying the mark specifications

to existing mask designs.

R1-2.2 When the mark is applied prior to epitaxial

deposition, a crown or epi may grow along the mark

edge. The height of this crown will depend upon the epi

thickness and the deposition process.

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer's instructions, product labels,

product data sheets, and other relevant literature,

respecting any materials or equipment mentioned

herein. These standards are subject to change without

notice.

By publication of this standard, Semiconductor

Equipment and Materials International (SEMI) takes no

position respecting the validity of any patent rights or

copyrights asserted in connection with any items

mentioned in this standard. Users of this standard are

expressly advised that determination of any such patent

rights or copyrights, and the risk of infringement of

such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.