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SEMI E129-1103 © SEMI 2003 28 R3-7 ACKNOWLEDGEME NT Contributed by Vladim ir Kraz, Credence Technologies, 3601-A Caldwell Drive, Soq uel CA 95073, vladimir@credencetech.com NOTICE: SEMI makes no warranties or representat…

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SEMI E129-1103 © SEMI 2003 27
measurements it is important to use an antenna with a
flat frequency response since frequency correction that
is common in the frequency domain is not possible for
time domain measurements. Another important note is
that a typical oscilloscope captures only one event (i.e.,
first or last one, depending on trigger setting), missing
multiple events that are common.
R3-4.7.3 Spectrum analyzers common in EMC test and
wireless communication are not practical for detecting
EMI from ESD events due to their unacceptably low
acquisition speed.
R3-4.8 Below is comparison Table R3-1 of EMI/ESD
measurement instruments.
R3-5 EMI and Ground
R3-5.1 An essential component of EMI management is
a consideration of EMI in grounding. High impedance
to ground at high frequencies prevents EMI from being
dissipated. Long ground wires act as receiving
antennae that inject high-frequency signals into tools.
A common ground for several tools, with high
impedance to the rest of the grounding network,
facilitates propagation of EMI from one noisy tool to
another.
R3-6 Related Documents
R3-6.1 SEMI Standards
SEMI E33 — Specification for Semiconductor
Manufacturing Facility Electromagnetic Compatibility
R3-6.2 ANSI Documents
ANSI C63.13 — American National Standard Guide on
the Application and Evaluation of EMI Power-Line
Filters for Commercial Use.
(http://standards.ieee.org/reading/ieee/std_public/descri
ption/emc/C63.13-1991_desc.html)
ANSI C63.16 — American National Standard Guide
for Electrostatic Discharge Test Methodologies and
Criteria for Electronic Equipment.
http://standards.ieee.org/reading/ieee/std_public/descrip
tion/emc/C63.16-1993_desc.html
R3-6.3 EN / IEEE Documents
EN 61000-4-2 / IEC 61000-4-2 — Electromagnetic
compatibility (EMC) – Part 4: Testing and
measurement techniques. Section 2: Electrostatic
discharge immunity test (ESD).
EN 61000-4-3 / IEC 61000-4-3 (ENV 50140 & ENV
50204) — Electromagnetic compatibility (EMC) – Part
4: Testing and measurement techniques, Section 3:
Radiated, radio frequency, electromagnetic field
immunity test
EN 61000-4-4 / IEC 61000-4-4 — Electromagnetic
compatibility (EMC) – Part 4: Testing and
measurement techniques. Section 4: Electrical fast
transient / burst immunity test IEC 61000-4-4-am2 to
Ed. 1:2001
EN 61000-4-5 / IEC 61000-4-5 (ENV 50142) —
Electromagnetic compatibility (EMC) – Part 4: Testing
and measurement techniques. Section 5: Surge
immunity requirements
EN 61000-4-6/ IEC 61000-4-6 (ENV 50141) —
Electromagnetic compatibility (EMC) – Part 4-6:
Testing and measurement techniques - Immunity to
conducted disturbances, induced by radio-frequency
fields
EN 61000-6-2 — Electromagnetic compatibility (EMC)
– Part 6-2: Generic standards—Immunity for industrial
environments.
R3-6.4 IEEE Documents
IEEE 518 — IEEE Guide for the Installation of
Electrical Equipment to Minimize Electrical Noise
Inputs to Controllers from External Sources
(
http://standards.ieee.org/reading/ieee/std_public/descri
ption/emc/518-1982_desc.html)
Table R3-1 EMI/ESD Measuring Instruments
Instrument Ease-of-Use Cost Sensitivity Multiple
Discharges
Event
Magnitude
Event Count
AM Radio Easy $ Low No No No
EMI Locators Easy to Medium $$-$$$$ Medium to High Some High/Low to Full
Range
Some
High-Speed
Storage
Oscilloscope
Difficult $$$$$ High No Full Range Some
SEMI E129-1103 © SEMI 2003 28
R3-7 ACKNOWLEDGEMENT
Contributed by Vladimir Kraz, Credence Technologies,
3601-A Caldwell Drive, Soquel CA 95073,
vladimir@credencetech.com
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer's instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E131-0304 © SEMI 2004 1
SEMI E131-0304
SPECIFICATION FOR THE PHYSICAL INTERFACE OF AN
INTEGRATED MEASUREMENT MODULE (IMM) INTO 300 mm TOOLS
USING BOLTS-M
This specification was technically approved by the Global Physical Interfaces & Carriers Committee and is
the direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition
approved by the North American Regional Standards Committee on December 4, 2003. Initially available at
www.semi.org February 2004; to be published March 2004.
1 Purpose
1.1 This document establishes the specification for the
interface requirements between an integrated
measurement module (IMM) and 300 mm tools using
an interface as defined by SEMI E63 (BOLTS-M).
NOTE 1: The 1997 and 2000 SIA roadmaps call for the
implementation of metrology integrated with process tools.
Such technology is important as specifications tighten the cost
of monitor substrates at larger size increases, and as materials
and processing steps become more complex.
NOTE 2: The 300 mm equipment generation offers an
opportunity for integration of measurement equipment
modules in a configuration that could be standard across
different tools.
1.2 The standard will permit the tool suppliers, robotics
suppliers, and measurement module suppliers, to
provide plug and play integrated measurement solutions
on a mechanical level.
1.3 It is the purpose of this standard to facilitate
process monitoring through rapid access to
measurement data, to reduce material handling between
process and measurement equipment, and to provide the
opportunity to increase process monitoring with a
minimum or no decrease in throughput.
2 Scope
2.1 This standard is intended to set an appropriate level
of specification that places minimal limits on
innovation while ensuring modularity and
interoperability at all mechanical interfaces. It
establishes the mechanical interface specifications for
integration of measurement modules intended for, but
not limited to, 300 mm process tools using a BOLTS-M
interface, while utilizing existing SEMI Standards as
much as possible.
2.2 This standard specifies that SEMI E63 is utilized
for the tool side of the interface.
2.3 This standard covers the following topics:
• General physical requirements for integration of
the IMM,
• Nominal wafer-seating plane within the IMM,
• Maximum outer dimensions of the IMM, in case it
is located at the front of a tool.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 This standard does not specify the location of the
IMM relative to the tool.
3.2 This standard does not specify facility or
communication interfaces.
3.3 No materials requirements or micro-contamination
limits are given.
3.4 Substrate input and retrieval will be the obligation
of the tool.
4 Referenced Standards
4.1 SEMI Standards
SEMI E1.9 — Mechanical Specification for Cassettes
Used to Transport and Store 300 mm Wafers
SEMI E15 — Specification for Tool Load Port
SEMI E15.1 — Specification for 300 mm Tool Load
Port
SEMI E47.1 — Provisional Mechanical Specification
for Boxes and Pods Used to Transport and Store 300
mm Wafers
SEMI E57 — Mechanical Specification for Kinematic
Couplings Used to Align and Support 300 mm Carriers
SEMI E63 — Mechanical Specification for 300 mm
Box Opener/Loader to Tool Standard (BOLTS-M)
Interface
SEMI E64 — Specification for 300 mm Cart to SEMI
E15.1 Docking Interface Port