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SEMI G11-88 © SEMI 198 1, 1996 3 NOTICE: T hese standards do n ot purport to address safety issues, if any , associated with th eir use. It is the responsibility of t he user of these standards to establish appropriate s…

SEMI G11-88 © SEMI 1981, 1996 2
5.3.3 The free running ram speed shall be at least 25.4
mm/sec (1"/sec). Recommended speed is 100 ± 25
mm/sec into the pot and application of pressure on the
charge shall not exceed 5 seconds.
5.3.4 The transfer pressure measured under the
transfer plunger is to be 6.895 ± 0.177 mpa (1000 ± 25
psi) unless otherwise specified.
5.3.5 Unless otherwise specified, a minimum of 1.5
minutes close and cure time shall be used.
5.4 Flow Length — Read the spiral flow length
directly from the molded specimen at the point of
farthest continuous flow to the nearest 6.35 mm (0.25
in).
5.5 Flow Duration — The flow duration or gel time is
defined as the time interval between the moment when
the ram contacts the charge and the time the ram stops
moving. The contact and gelation points are determined
from the ram follower trace.
6 Procedure for Spiral Flow
6.1 Thoroughly clean the ram, pot, and mold of any
cured compound, or other foreign matter.
6.2 Heat the mold and ram to within (± 3°C) of the
specified temperature.
6.3 At the beginning of each series of tests and at each
change of compound, check and set the transfer
pressure using the force gage. The proper force gage
setting can be determined from the formula:
F
=
π
D
2
P
4
where F is the force in pounds, P is the desired pressure
on the material in psi and D is the ram diameter in
inches.
6.4 For each material change, make at least three
“clean out” runs using the material to be tested before
recording data. These runs may be used to determine
the charge weight.
6.5 Weigh out the compound to the nearest 0.1 g as
previously determined to yield a cull of 3.302 ± 0.254
mm (0.130 ± 0.010 in.).
6.6 Raise the ram, add the compound to the pot, and
immediately activate the transfer cycle. If the recorder
does not have a remote on-off that is activated by the
cycle start, then it should be started before the cycle
starts. After the ram motion ceases, the chart may be
stopped.
6.7 Open mold and remove cured material. Measure
cull thickness. If the cull is not within 3.302 ± 0.254
mm (0.130 ± 0.010 in.), discard run and repeat the test,
adjusting the charge weight as necessary.
6.8 Read the flow length to the nearest 6.35 mm (0.5
in.).
6.9 Mark the point on the chart where the ram contacts
the charge. This point is identified on the displacement
trace as the point at which the rate of displacement
initially changes.
6.10 Mark where the ram stopped moving. Caution
should be exercised where significant flashing occurs.
Count the number of divisions between the two points
and divide by the chart speed. The result is the flow
duration or gel time in seconds. Record this time to the
nearest second.
6.11 If the optional velocity trace is available, mark
point on the chart where the ram contacts the charge.
This point is identified on the velocity trace as the point
at which the transfer velocity transducer initially detects
a significant reduction in velocity output.
6.12 Mark where the ram stopped moving. In order to
detect the point of zero (0) velocity, the signal must be
of sufficient magnitude. Count the number of divisions
between the two points and divide by the chart speed.
The result is the flow duration or gel time in seconds.
Record this time to the nearest second.
6.13 If both displacement and velocity transducers are
used, the starting and ending points should agree,
therefore yielding the same gel time.
6.14 Repeat step 6.5 at least 3 times for repeatability.
7 Reporting of Results
7.1 Report the material designation and lot number.
7.2 Report the average and standard deviation of the
flow length and gel time.
7.3 Report the temperature and pressure used for the
tests.

SEMI G11-88 © SEMI 1981, 19963
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.

SEMI G13-88 © SEMI 1981, 19961
SEMI G13-88
STANDARD TEST METHOD FOR EXPANSION CHARACTERISTICS OF
MOLDING COMPOUNDS
1 Scope
1.1 This specification describes the procedure for
measuring the Coefficient of Thermal Expansion (CTE)
and Glass Transition Temperature (T
g
) of thermosetting
molding compounds.
2 Apparatus
2.1 Mold — Producing 0.1–0.2" c ubes or equivalent
with an aspect ratio of 0.8–1.
2.2 Transfer Press
2.3 Micrometer — (0.0001 accuracy)
2.4 Thermomechanical Analyzer — (TMA) (Dupont
Model 943, Perkin-Elmer TMS-1, or equivalent)
2.5 Recorder and Power Supply — (Dupont Model
990, Perkin-Elmer UUI, or equivalent)
2.6 Oven — (200° ± 5°C capabilit y)
3 Materials
3.1 Nitrogen (Gas)
3.2 Nitrogen (Liquid)
4 Sampling
4.1 Mold samples according to pro duct specifications.
4.2 Postcure the specimen in acco rdance with the
material specification, and allow two (2) hours for
cooling in a desiccator.
5 Procedure
5.1 Select a sample, making certain that all sides are
flat and smooth. Measure the height of the sample with
a micrometer to the nearest 0.0001 inch.
5.2 Place the sample into the TMA sample holder and
bring the expansion probe down slowly until it just
makes contact with the sample. Place sample on fixture
per Instruction Manual. Add 3.0–5.0 grams to weight
tray. Adjust the Linear Variable Differential
Transformer (LVDT) to bring the recorder pen on scale.
The LVDT is then zeroed with the zero switch.
Readjust LVDT, if necessary, to bring pen on scale.
5.3 In a nitrogen atmosphere, heat the sample at a rate
of 20°C/min. to its post-cure temperature.
5.4 Without changing LVDT or pr obe position, use
liquid nitrogen to cool the sample to a temperature at
least 100°C below the deviation from α
1
.1.
5.5 Heat the sample at a rate of 5°C/min. to at least
200°C.
5.6 Calculate α(CTE), using the formula:
CTE =
DL()DY()
DT
()
L
()
°
°
°
°
°
°
where: L
(T+10°)
=Length at Temperature 10° higher than
temperature at which CTE is being measured. L
(T-
10°)
=Length at Temperature 10° lower than temperature
at which CTE is being measured
∆Y = Y axis sensitivity in mils./in
.
∆T = change in temperature (20°C)
L = initial sample height (mils)
K =
LIT CTE
EXP.CTE
for aluminum standard
5.7 Run two (2) samples for each lot and record the
average.
5.8 An aluminum standard should be run to determine
the calibration factor K for the Y (length) axis per 5.4
above, as necessary to insure the accuracy of the
instrument's calibration.
5.9 Temperature readings should b e calibrated
periodically per manual instructions.
6 Report
6.1 Data is to include the orientati on for which the
sample is measured (e.g., perpendicular to flow).
6.2 CTE is reported as a function o f temperature. CTE
is to be reported every 10°C increments.
6.3 Report molding conditions and post-mold cure
conditions.
6.4 Report specimen size.
NOTE: For many materials, the Glass Transition Temperature
(Tg) may be determined by drawing tangents to the curve at
the points of minimum and maximum slope. The point at
which the tangents intersect is the T
g
. The slopes of the lines
are referred to as α 1 (below T
g
) and α2 (above T
g
).