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SEMI S8-0705 © SEMI 1995, 2005 44 Section 3: Wa fer Cassette Loa ding Section Indicator Figure 3.5 Minimum hand clearance on either si de of the cassette , measured f rom the side of the casset te to the nearest adjacent…
SEMI S8-0705 © SEMI 1995, 2005 43
Section 3: Wafer Cassette Loading
Section Indicator Figure
3.0 NOTE A: The criteria of this section should only be applied to
production operations where production materials will be
loaded and unloaded by people.
NOTE B: A load port is the surface upon which the machine operator
places the wafer cassette or the base of the wafer cassette
when it is placed on a machine arm or in a receptacle.
NOTE C: Coupling point is the center of a handle or the large middle
knuckle of the hand when it grasps an object.
3.1 Wafer cassette loading should not require greater than 10 degrees cassette
rotation about any axis. Unless otherwise specified, you should assume
that 200 mm or smaller wafers are transported in the vertical orientation
and that 300 mm wafers are transported in the horizontal orientation.
Acceptance criteria: less than 10 degrees rotation about any axis.
NOTE: Manual and powered wafer cassette rotation devices are a
means to provide controlled rotation of wafer cassettes. See
section 5.0, “Manual Wafer Cassette Rotation Device
Design” for design recommendations.
Wafer cassette shown in the manual
carrying orientation
Rotation about
the Z-axis
Maximum 10
0
Rotation about the Y-axis
Maximum 10
0
Rotation about
the X-axis
Maximum 10
0
3.2 Load port height, vertical distance from standing surface (150–200 mm
wafers).
Acceptance criteria: maximum 960 mm (38 in.)
minimum 890 mm (35 in.)
NOTE: Machine height variables such as the presence of load
bearing pads, anti-vibration platforms, casters or the
adjustment of leveling feet should be specified when
measuring the load port height.
Maximum 960 mm
(38 in)
Minimum 890 mm
(35 in.)
3.3 Maximum lip height in front of cassette load port over which the cassette
is lifted (150–200 mm wafer cassettes only). Measure lip height from the
load surface.
Acceptance criterion: maximum 30 mm (1.2 in.)
NOTE: For machines where the wafer cassette is loaded on a
machine arm, measure the vertical distance from the base of
the wafer cassette when it’s on the arm to the highest
obstruction the wafer cassette must be lifted over when
loading or unloading.
Lift-over lip
height above the
load port
Maximum 30 mm
(1.2 in.)
3.4 Reach distance from the leading edge of the tool or obstruction to the
coupling point(s) on a rotation device or the product grasp point.
Acceptance criterion: maximum 330 mm (13 in.)
NOTE: Reach distances should be measured from the leading edge of
the machine housing or any obstruction between the machine
operator and the load port. Obstructions include keyboard
trays, drip trays, anti-vibration platforms and machine load-
bearing pads.
Reach distance
Maximum
330 mm
(13 in.)
SEMI S8-0705 © SEMI 1995, 2005 44
Section 3: Wafer Cassette Loading
Section Indicator Figure
3.5 Minimum hand clearance on either side of the cassette, measured from the
side of the cassette to the nearest adjacent object.
Acceptance criterion: minimum 76 mm (3.0 in.)
NOTE: Clearance must be provided on both sides of the cassette.
Hand
clearance
Minimum
76.0 mm
(3.0 in.)
Section 4: Work in Process Storage (specific to wafer cassettes)
Section Indicator Figure
4.1 Integral wafer cassette/lot box storage shelf height (150 and 200 mm
wafer cassette/lot boxes only).
Acceptance criteria: maximum (1 box deep) 1520 mm (60 in.)
maximum (2 boxes deep) 1220 mm (48 in.)
minimum 460 mm (18 in.)
1-box deep
Maximum 1520
mm
(60 in.)
2-boxes deep
Maximum 1220
mm
(48 in.)
Minimum 460 mm
(18 in.)
Section 5: Manual Wafer Cassette Rotation Device Design
Section Indicator Figure
5.0 NOTE A: Some machines process wafers horizontally. 150–200mm
wafers are normally carried vertically, so to load these
machines, the operator must rotate the wafer cassette to
orient the wafers for processing.
NOTE B: Manual rotation of wafer cassettes can increase stress on the
machine operator’s upper extremities, which may lead to
physical strain over time and/or damage to wafers, especially
if the wafer cassettes do not have handles.
NOTE C: Manual and powered wafer cassette rotation devices are a
way to provide controlled rotation of wafer cassettes as a
means to reduce the machine operator’s physical stress and
lower the potential for wafer damage.
Manual handling
orientation for a
150-200 mm
wafer cassette
Machine handling
orientation for a
150-200 mm
wafer cassette
5.1 Handle height, couple point for hand(s) from standing surface.
Acceptance criteria: maximum 1206 mm (47.5 in.)
minimum 838 mm (33 in.)
NOTE: Coupling point is the center of a handle or the large middle
knuckle of the hand when it grasps an object.
Handle
height
Maximum
1206 mm
(47.5 in.)
Minimum
838 mm
(33 in.)
SEMI S8-0705 © SEMI 1995, 2005 45
Section 5: Manual Wafer Cassette Rotation Device Design
Section Indicator Figure
5.2 Hand grip(s) shall allow for a full “power grip” similar to grabbing a rung
on a ladder or holding a pistol.
Acceptance criterion: allows for a full power grip in either pronated (palm
facing down) or neutral (handshake position) posture.
NOTE A: Acceptable handle types include cylindrical, circular,
triangular, or enclosed.
NOTE B: See §6 for handle design recommendations.
Power Grips
5.3 Single hand lift force
Acceptance criterion: maximum 37.8 N (8.5 lbf). This value includes a
15% capacity reduction due to cleanroom glove use.
5.4 Two hand lift force
Acceptance criterion: maximum 64.5 N (14.5 lbf). This value includes a
15% capacity reduction due to cleanroom glove use.
Section 6: Handle Design
Section Indicator Figure
6.0 (Handle dimensions are correct for use of bare hand or use of typical
cleanroom gloves).
NOTE A: A recommended practice for selecting a handle design is to
first determine the force requirements before choosing a
handle design that is best suited for the intended forces,
motions and environment. Handle design recommendations
for various hand forces and handgrips are located in ¶¶6.2–
6.6.
NOTE B: Handles should anticipate the use of gloved hands.
6.1
Handle Surface finish:
Acceptance criterion: all edges radiused
6.2
Cylindrical handle
6.2.1
Cylindrical handle diameter (D).
Acceptance criteria: maximum 38 mm (1.5 in.)
minimum 25 mm (1.0 in.)
6.2.2
Cylindrical handle length (L)
Acceptance criterion: minimum 127 mm (5.0 in.)
Length
Diameter
6.3
Circular or triangular handle
6.3.1
Circular or triangular handle diameter (D)
Acceptance criteria: maximum 90 mm (3.5 in.)
minimum 50 mm (2.0 in.)
6.3.2
Circular or triangular handle height (thickness) (H)
Acceptance criteria: maximum 25 mm (1 in.)
minimum 19 mm (0.75 in.)
Thickness
Diamete
r